10AS032H4F34I3LG - Arria 10 SX SoC FPGA 320K LE | Intel
Référence : 10AS032H4F34I3LG ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1717.01 | $1 717,01 |
| 10 | $1631.16 | $16 311,60 |
| 100 | $1545.31 | $154 531,00 |
| 500 | $1487.02 | $743 510,00 |
| 1 000 | $1428.73 | $1 428 730,00 |
10AS032H4F34I3LG Présentation
An SoC FPGA is a class of integrated circuit that fuses a microprocessor subsystem with programmable logic on a single die. The hard processor system (typically ARM Cortex-A cores) executes sequential control-plane code (Linux, RTOS, bare-metal), while the FPGA fabric accelerates data-parallel DSP and custom I/O logic. This heterogeneous architecture eliminates inter-chip buses between processor and FPGA, reduces board area, and provides tighter latency between the two domains - critical for industrial motion control, 5G baseband pre-processing, and ADAS vision pipelines.
Key features of the 10AS032H4F34I3LG include 320K logic elements, embedded DSP blocks and M20K memory blocks, multi-gigabit transceivers up to 17.4 Gbps, hard memory controllers supporting DDR4/DDR3/LPDDR3, and PCIe Gen3 x8 hard IP blocks. The HPS exposes Gigabit Ethernet, USB 2.0 OTG, NAND flash controller, SD/MMC, SPI, UART, and I2C peripherals through dedicated I/O. The industrial grade (-40C to +100C ambient) rating suits outdoor and factory-floor deployments.
The Arria 10 SX architecture separates power rails into HPS, FPGA core, transceiver, and auxiliary domains, allowing independent power gating for energy-sensitive applications. The 20 nm process node delivers a favorable performance-per-watt ratio versus prior 28 nm Stratix/Cyclone generations. This specific part number (H4F34I3LG) decodes as: H4 = high-DSP / high-transceiver feature set, F34 = 1152-pin FC-FBGA F34 package code, I3 = industrial speed/temperature grade -3, LG = lead-free / RoHS-compliant tray.
Typical applications include motor control and industrial automation, software-defined radio (SDR), military/aerospace signal processing, video broadcast processing, machine vision, and PCIe-based accelerator cards. For such workloads, the SoC FPGA offloads DSP blocks to hardware while the HPS runs a Linux stack for control and networking. Designers should reference the Arria 10 SX device datasheet, the Arria 10 SoC FPGA Hard Processor System Technical Reference Manual, and Intel's Quartus Prime SoC Edition design toolchain.
When designing with this part, allocate at least a 35x35 mm board footprint for the FC-FBGA with microvia stack-up, and provide dedicated 0.9V core, 1.1V transceiver, 1.8V HPS I/O, and DDR4 reference rails with sequencing. Use Intel's HPS preloader and U-Boot for bootloader development, and the Golden System Reference (GSR) design as your starting template. Carefully review pinout for transceiver channel and PCIe lane placement before PCB layout closure.
This page synthesizes distributor pricing and stock from authorized channels, drop-in alternatives within the Arria 10 family, and practical design notes drawn from Intel's official Arria 10 documentation - context not duplicated on individual distributor product pages.
Alternatives de remplacement direct pour 10AS032H4F34I3LG — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10AS032H4F34I3LG (même facteur de forme et même empreinte) — différant par Package, Logic Elements, Operating Temperature Grade, DSP Blocks, Package Code.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10AS032H4F34E3SG
✅ Remplacement direct✓ En stock
$3490 / unité
Voir la fiche technique →10AS032H4F34E3LG
✅ Remplacement direct✓ En stock
$2240 / unité
Voir la fiche technique →10AS032H3F34I2SG
✅ Remplacement direct✓ En stock
$3450 / unité
Voir la fiche technique →10AS032H3F34I2LG
✅ Remplacement direct✓ En stock
$1620.19 / unité
Voir la fiche technique →10AS032H2F34I2SG
✅ Remplacement direct✓ En stock
$3760 / unité
Voir la fiche technique →10AS032H2F34I2LG
✅ Remplacement direct✓ En stock
$1390 / unité
Voir la fiche technique →10AS032H3F35I2SG
✅ Remplacement direct✓ En stock
$2120 / unité
Voir la fiche technique →10AS032H3F35I2LG
✅ Remplacement direct✓ En stock
$1590 / unité
Voir la fiche technique →10AS032H4F34I3LG Valeurs maximales et caractéristiques électriques
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 320,000 |
| Hard Processor System (HPS) | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum HPS Frequency | 1.5 GHz |
| Process Technology | TSMC 20 nm |
| Core Voltage | 0.9 V |
| Boîtier | 1152-pin FC-FBGA (F34), 35x35 mm |
| Type de montage | Surface Mount |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Speed Grade | -3 (fastest in Arria 10 family) |
| Multi-Gigabit Transceivers | Up to 17.4 Gbps |
| PCIe Hard IP | PCIe Gen3 x8 |
| Memory Interfaces | DDR4, DDR3, LPDDR3 hard memory controllers |
| Statut RoHS | Compliant |
Guide de configuration des broches du 10AS032H4F34I3LG 1152-pin fc-fbga (f34), 35x35 mm
Configuration des broches du 10AS032H4F34I3LG (boîtier 1152-pin fc-fbga (f34), 35x35 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour 10AS032H4F34I3LG.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
10AS032H4F34I3LG convient pour 6 applications: Industrial Motor Control and Automation, Software-Defined Radio (SDR) Baseband, Machine Vision and Video Processing, PCIe Accelerator Card, Military and Aerospace Signal Processing, Video Broadcast Processing.
Industrial Motor Control and Automation
The 10AS032H4F34I3LG's Dual ARM Cortex-A9 HPS at 1.5 GHz handles real-time motion control loops and EtherCAT / PROFINET / EtherNet/IP master stacks, while 320K LEs and variable-precision DSP blocks accelerate current/torque control, encoder interpolation, and vibration analysis. Industrial temperature grade (-40C to +100C) suits factory-floor environments. The hard PCIe Gen3 x8 block enables a high-throughput host link when the controller is used as an accelerator inside an industrial PC. Place the SoC FPGA between the power stage gate drivers and the host PLC, with isolated CAN or RS-485 to upstream SCADA. Compared with a discrete MCU plus FPGA design, the SoC integration reduces PCB area and removes inter-chip bus latency.
Recommandé
Software-Defined Radio (SDR) Baseband
The 10AS032H4F34I3LG's multi-gigabit transceivers up to 17.4 Gbps interface directly to ADC/DAC front-ends, while the 320K LE fabric and DSP blocks perform digital up/down conversion, channelization, crest-factor reduction, and forward error correction. The Cortex-A9 HPS runs the MAC layer, AGC loop, and remote-control stack. Industrial temp grade makes the part suitable for outdoor base-station deployments. Typical reference designs sample RF at 245.76 Msps on ADC paths and run LTE or 5G NR PUSCH processing. The SoC integration eliminates a separate host CPU module, reducing cost and latency versus split CPU plus FPGA solutions.
Recommandé
Machine Vision and Video Processing
The 10AS032H4F34I3LG's FPGA fabric is well-matched to high-throughput image processing pipelines (Sobel, Canny, color-space conversion, object detection) at resolutions up to 4K at 60 fps. The HPS runs Linux for camera control, USB3 Vision or GigE Vision protocol stack, and AI inference hand-off. PCIe Gen3 x8 hard IP streams processed frames to a host server when the SoC FPGA acts as an accelerator on a vision PCIe card. Industrial temperature grade suits in-line factory inspection. Compared with a GPU, the SoC FPGA offers lower latency and deterministic processing for closed-loop quality control.
Recommandé
PCIe Accelerator Card
The 10AS032H4F34I3LG's hard PCIe Gen3 x8 IP provides a low-latency host interface with minimal FPGA resource overhead, leaving most of the 320K LEs and DSP blocks free for custom data-plane acceleration (FFT, compression, encryption, signal processing). The HPS can run a lightweight Linux for housekeeping and partial reconfiguration management. Combined with DDR4 hard memory controllers supporting up to 2400 MT/s, the part delivers high throughput from host memory through the FPGA pipeline. Industrial grade supports deployment in data-center edge and telco central-office environments.
Recommandé
Military and Aerospace Signal Processing
The 10AS032H4F34I3LG's combination of hardened ARM Cortex-A9 cores and 320K logic elements makes it suitable for ruggedized embedded signal-processing platforms where deterministic latency and extended temperature are required. The industrial temperature grade -40C to +100C supports avionics bays, shipboard radar, and unmanned vehicle control. Transceivers up to 17.4 Gbps connect to high-speed sensors, while DDR4 controllers provide local working memory. Note that true military-grade screening requires the MIL-M grade variant - the I3LG part should be qualified by customer-supplied reliability testing for mission-critical deployments.
Recommandé
Video Broadcast Processing
The 10AS032H4F34I3LG integrates enough logic and DSP blocks to handle broadcast-grade video processing such as up/down/cross conversion, HDR tone mapping, and standards conversion between SDI and ST 2110 IP streams. The HPS manages control plane (NMOS IS-04/05, PTP grandmaster) and SDI ancillary data extraction. Multi-gigabit transceivers up to 17.4 Gbps interface directly to 12G-SDI PHYs. Industrial temperature grade and lead-free packaging meet professional broadcast equipment reliability and environmental requirements.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10AS032H4F34I3LG — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10AS032H4F34E3SG | 10AS032H4F34E3LG | 10AS032H3F34I2SG | 10AS032H3F34I2LG | 10AS032H2F34I2SG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FBGA (F34), 35x35 mm | 1152-FBGA (F34), 35x35 mm - same | 1152-FBGA (F34), 35x35 mm - same | 1152-FBGA (F34), 35x35 mm - same | 1152-FBGA (F34), 35x35 mm - same | 1152-FBGA (F34), 35x35 mm - same |
| Logic Elements | 320K | 320K | 320K | 320K | 320K | 320K |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Speed Grade | -3 (fastest) | -3 (fastest) | -3 (fastest) | -2 (~15% slower Fmax) | -2 (~15% slower Fmax) | -2 (~15% slower Fmax) |
| Feature Set (H4 vs H2) | H4 (max transceivers, max DSP) | H4 (max transceivers, max DSP) | H4 (max transceivers, max DSP) | H3 (reduced DSP) | H3 (reduced DSP) | H2 (reduced transceivers) |
| Packaging Type | Tray (LG) | Tray (SG) | Tray (LG) | Tray (SG) | Tray (LG) | Tray (SG) |
| RoHS Compliance | Yes (LG suffix) | Yes (SG suffix) | Yes (LG suffix) | Yes (SG suffix) | Yes (LG suffix) | Yes (SG suffix) |
Principaux différenciateurs
- Industrial temperature grade at speed grade -3 (vs 10AS032H4F34E3LG)
- Highest speed grade -3 for maximum Fmax (vs 10AS032H3F34I2LG)
- H4 feature set with maximum transceivers and DSP (vs 10AS032H2F34I2SG)
- Lead-free tray packaging (LG) (vs 10AS032H4F34E3SG)
Notes de conception
The 1152-pin FC-FBGA (F34) package at 35x35 mm has a typical theta_JA of around 10-12 C/W with the recommended thermal management stack-up (lid, thermal interface material, and heatsink). Industrial-grade applications in enclosed chassis must size the heatsink for worst-case ambient of +85C to keep junction below +100C. Estimated: at 0.9V core drawing 3A and 12W total dissipation, junction-to-ambient temperature rise is approximately 12 C/W x 12W = 144C, requiring substantial heatsinking or forced airflow for industrial operation.
The 1152-pin FC-FBGA with 1.0 mm ball pitch requires a microvia stack-up (typically 8-12 layers with 2-3 build-up layers). Use a controlled-impedance stack-up for high-speed transceivers (100-ohm differential for PCIe, 90-ohm for SDR, 50-ohm single-ended for general I/O). Reference Intel's Arria 10 PCB Design Guidelines for via-in-pad recommendations, length-matching tolerances, and reference plane requirements. DC-blocking capacitors must be placed within 100 mils of the transceiver pins.
Arria 10 SX devices require multiple sequenced rails: 0.9V core, 1.1V transceiver analog, 1.8V HPS I/O, and DDR4 reference (VTT, VREF). Use an Intel-recommended power controller such as the LTC3612 or Intel's own Enpirion power solutions to handle the sequencing requirement (HPS core before FPGA core, or vice versa depending on configuration). Decoupling must follow Intel's PDN (power distribution network) guidelines, with 0402 0.1uF capacitors placed directly beneath the BGA on the bottom side of the package. Estimated: total quiescent power is approximately 12W typical for a 320K LE Arria 10 SX.
Do not skip the HPS preloader development stage - Linux boot on Arria 10 SX requires a properly built U-Boot preloader, ATF, and device tree. Pin assignments for the HPS must be locked early in the design because changing them after PCB layout requires a board revision. When using PCIe, verify the PCIe reference clock architecture (common-clock vs separate-clock) and that REFCLK lane polarity is correct. Also confirm transceiver channel numbering matches your board schematic before taping out.
Place transceiver channels physically adjacent to the BGA edge with short matched-length routing (typically +/- 0.025 mm tolerance). HPS DDR4 routing should follow Intel's DDR4 Pin Placement Guidelines, with byte-lane swapping only where explicitly supported. Keep the HPS reference clock crystal or oscillator within 200 mils of the HPS_X1 pin. Maintain a continuous ground reference plane under all high-speed routes and avoid routing across plane splits.
Informations de conformité
RoHS and lead-free compliance indicated by LG suffix in part number. AEC-Q100 not applicable - Arria 10 SX is an FPGA SoC, not an automotive-grade IC. For automotive applications, dedicated automotive-qualified FPGAs such as Cyclone V or PolarFire are recommended.
