10AS048H4F34I3LG - Arria 10 SX SoC FPGA 480K LE | Intel
Référence : 10AS048H4F34I3LG ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $5200 | $5 200,00 |
| 10 | $4950 | $49 500,00 |
| 100 | $4600 | $460 000,00 |
| 250 | $4380 | $1 095 000,00 |
| 500 | $4150 | $2 075 000,00 |
| 1 000 | $3920 | $3 920 000,00 |
10AS048H4F34I3LG Présentation
A System-on-Chip FPGA is a single silicon device that combines a general-purpose processor subsystem with programmable logic. This hybrid architecture allows the CPU to run operating systems such as Linux or real-time executives while the FPGA fabric accelerates parallel data-path operations, DSP blocks, and high-speed interfaces. The Arria 10 SX family specifically targets applications that benefit from tight coupling between the ARM cores and custom logic, such as motor control, software-defined radio, and high-throughput industrial vision.
Key features of the 10AS048H4F34I3LG include 480K logic elements, embedded transceivers supporting multi-gigabit serial links, hardened memory controllers, and DSP blocks optimized for fixed- and floating-point operations. The integrated ARM Cortex-A9 MPCore subsystem includes NEON media-processing engines, L1 caches per core, a shared L2 cache, and CoreSight debug and trace infrastructure that streamlines firmware development.
The device architecture leverages TSMC's 20 nm process and an innovative variable-precision DSP block layout, enabling energy-efficient arithmetic pipelines. Hardened memory controllers support DDR4, DDR3, LPDDR3, and QDRII+/RLDRAM3 memories, while the transceiver array delivers up to 17.4 Gbps per channel, making the part suitable for backplane, optical, and chip-to-chip interconnect applications.
Typical applications include software-defined radio baseband processing, industrial machine vision and machine learning inference at the edge, real-time motor and motion control, military and aerospace signal intelligence, and high-end medical imaging. Designers select this part when they need deterministic ARM processing combined with substantial FPGA throughput.
When designing with the 10AS048H4F34I3LG, pay close attention to PCB layout for the FCBGA-1152 package, which requires microvia stack-ups and BGA escape routing on a high-layer-count board. Thermal management via a heat spreader or heatsink is recommended at sustained high utilization, and power planning should use the Intel Quartus Prime Early Power Estimator to validate envelope.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour 10AS048H4F34I3LG — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10AS048H4F34I3LG (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Logic Elements, Mounting Type, Family.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10AS048H4F34E3LG
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$2295 / unité
Voir la fiche technique →10AS048H4F34E3SG
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$2250 / unité
Voir la fiche technique →10AS048H3F34I2SG
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3450 / unité
Voir la fiche technique →10AS048H3F34I2LG
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$2960 / unité
Voir la fiche technique →10AS048H2F34I2SG
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3505 / unité
Voir la fiche technique →10AS048H2F34I2LG
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$2712.45 / unité
Voir la fiche technique →10AS032H4F34I3LG
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$1428.73 / unité
Voir la fiche technique →10AS048H1F34I1HG
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$2650 / unité
Voir la fiche technique →10AS048H4F34I3LG Valeurs maximales et caractéristiques électriques
| Device Family | Arria 10 SX SoC FPGA |
| Logic Elements | 480,000 |
| Processor Subsystem | Dual ARM Cortex-A9 MPCore with CoreSight |
| Hard Processor System Frequency | Up to 1.5 GHz |
| Boîtier | 1152-ball FCBGA (F34) |
| Package Size | 35 x 35 mm |
| Process Technology | 20 nm |
| Température de fonctionnement | Industrial grade |
| Type de montage | Surface Mount (BGA) |
| Supply Voltage - Minimum | 0.87 V (core, per Intel DB) |
| Memory Controller | Hardened DDR4/DDR3/LPDDR3/QDRII+/RLDRAM3 controller |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
Guide de configuration des broches du 10AS048H4F34I3LG 35 x 35 mm
Configuration des broches du 10AS048H4F34I3LG (boîtier 35 x 35 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour 10AS048H4F34I3LG.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
10AS048H4F34I3LG convient pour 6 applications: Software-Defined Radio Baseband, Industrial Machine Vision, Real-Time Motor and Motion Control, Military and Aerospace Signal Intelligence, Medical Imaging and Diagnostics, High-Speed Networking and Packet Processing.
Software-Defined Radio Baseband
The 10AS048H4F34I3LG is well-suited to software-defined radio baseband processing where the dual ARM Cortex-A9 cores handle protocol stacks and scheduling while the FPGA fabric executes FFT, channelization, and demodulation pipelines. With 480K logic elements and embedded DSP blocks, the device can implement multi-carrier LTE or 5G NR physical-layer processing at baseband. The integrated transceiver array supports multi-gigabit serial links to RF front-end ADCs and DACs. Using the HPS, engineers run embedded Linux with real-time extensions to manage MAC scheduling, while the FPGA accelerates DSP kernels at deterministic throughput. Compared with pure-software approaches, the heterogeneous compute architecture reduces latency by an order of magnitude.
Recommandé
Industrial Machine Vision
In machine-vision and automated optical inspection systems, the 10AS048H4F34I3LG combines high-speed image-sensor interfaces with FPGA-accelerated pre-processing. The HPS runs the vision-application software stack (OpenCV, TensorFlow Lite) while the FPGA fabric executes real-time Bayer demosaic, edge detection, and feature extraction at line rate. The 480K LE fabric supports simultaneous processing of multiple 4K sensor streams. Hardened memory controllers drive DDR4 buffers for frame storage, and integrated transceivers stream results to centralized servers. Compared with CPU-only designs, the SoC FPGA reduces per-frame latency by 5-10x and enables deterministic sub-millisecond response for in-line factory QA systems.
Recommandé
Real-Time Motor and Motion Control
The dual Cortex-A9 cores in the 10AS048H4F34I3LG handle motion trajectory planning and supervisory control loops while the FPGA fabric executes deterministic current, velocity, and position loops at multi-MHz rates. The 480K LEs support multi-axis field-oriented control of up to 8 servos simultaneously, with hard DSP blocks delivering sub-microsecond PID update periods. Industrial temperature grade (the I3 designation) supports operation in factory environments from -40C to +100C. The hardened memory controllers and integrated transceivers enable EtherCAT, PROFINET, or SERCOS III industrial networking. Compared with microcontroller-based motor controllers, this SoC FPGA scales to multi-axis robotics with deterministic jitter below 100 ns.
Recommandé
Military and Aerospace Signal Intelligence
The 10AS048H4F34I3LG supports signal-intelligence and electronic-warfare applications requiring FPGA-accelerated wideband DSP plus ARM-based mission software. With 480K logic elements, the device implements digital down-conversion, pulse compression, and direction-finding algorithms at multi-GSPS sample rates. The HPS runs security-hardened operating systems and crypto stacks while the FPGA executes real-time SIGINT kernels. The 20 nm process delivers high performance-per-watt, which is critical for size-, weight-, and power-constrained platforms. Integrated transceivers accept direct RF-ADC data streams and drive high-speed recording or networking links.
Recommandé
Medical Imaging and Diagnostics
In ultrasound, CT, and MRI systems, the 10AS048H4F34I3LG provides FPGA-accelerated beamforming and image reconstruction alongside ARM-based patient-interface and display software. The 480K LEs and DSP blocks support real-time beamformed channel processing at 64-256 channels simultaneously. The HPS handles DICOM networking, user interface, and database access while the FPGA does pixel-rate image rendering. The industrial temperature grade supports medical equipment operating rooms. Compared with discrete CPU + GPU architectures, the integrated SoC reduces BOM cost and PCB area by 40-60% while delivering deterministic image latency.
Recommandé
High-Speed Networking and Packet Processing
The 10AS048H4F34I3LG enables line-rate packet processing at 100G and beyond in network switches, routers, and security appliances. The integrated multi-gigabit transceivers interface directly with QSFP28 optical modules, while the FPGA fabric executes packet parsing, classification, and deep-packet inspection. The dual Cortex-A9 cores run control-plane protocols (BGP, OSPF) and management software. The hardened DDR4 memory controllers buffer packets at line rate. Compared with merchant-silicon switch ASICs, this SoC FPGA delivers full programmability for custom protocol support and proprietary features while maintaining multi-gigabit throughput.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10AS048H4F34I3LG — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10AS048H4F34E3LG | 10AS048H3F34I2SG | 10AS048H2F34I2LG | 10AS032H4F34I3LG |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FCBGA (F34) 35x35 mm | 1152-FCBGA (F34) 35x35 mm - same | 1152-FCBGA (F34) 35x35 mm - same | 1152-FCBGA (F34) 35x35 mm - same | 1152-FCBGA (F34) 35x35 mm - same |
| Logic Elements | 480,000 | 480,000 | 480,000 | 480,000 | 320,000 |
| Speed Grade | H4 (fastest) | H4 | H3 (one step slower) | H2 (slower) | H4 |
| Temperature Grade | Industrial (I3) | Extended (E3) | Industrial (I2) | Industrial (I2) | Industrial (I3) |
| ARM Cortex-A9 Cores | 2 | 2 | 2 | 2 | 2 |
| HPS Max Frequency | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz |
| Single-Unit Price (USD) | 5200 | 5300 (estimated) | 4950 (estimated) | 4700 (estimated) | 3500 (estimated) |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
Principaux différenciateurs
- Highest speed grade available in 480K LE Arria 10 SX F34 package (vs 10AS048H3F34I2SG)
- Maximum density for the F34 footprint (vs 10AS032H4F34I3LG)
- Industrial temperature grade support (vs 10AS048H4F34E3SG)
Notes de conception
The 1152-ball FCBGA at 35x35 mm requires a high-layer-count PCB (at least 12 layers) with microvia stack-ups. BGA escape routing demands 0.4-0.5 mm trace pitch, so-called HDI (High-Density Interconnect) construction. Designers should follow Intel's Arria 10 SX board design guidelines for via-in-pad, decoupling capacitor placement, and reference-plane stitching to ensure signal-integrity compliance. Failure to use proper stack-up will cause power-supply noise coupling into transceiver channels and timing-margin loss on DDR interfaces.
Estimated: At full FPGA and HPS utilization, the 10AS048H4F34I3LG can dissipate 15-25 W. Without a heat spreader or heatsink, junction temperature can exceed 100 C in enclosed industrial enclosures. Engineers should use the Quartus Prime Early Power Estimator (EPE) tool to model activity-factor-based dissipation, and select a thermal solution rated for at least 30 W continuous. Industrial-grade parts must stay below the 100 C junction limit for long-term reliability per Intel's reliability datasheet.
Common pitfalls when designing with the 10AS048H4F34I3LG include: (1) omitting the required POR (power-on-reset) sequencing circuit for the HPS and FPGA rails; (2) failing to assign the MSEL pins for the desired configuration mode, leading to factory-default Quad SPI boot; (3) using LPDDR2 instead of LPDDR3 or DDR4 in the memory interface, which is not supported on Arria 10 SX. Designers should reference the Arria 10 SX pin connection guidelines and Pin-Out File (POF) early in the schematic capture cycle.
Informations de conformité
RoHS compliant per Intel product page. Halogen-free status not explicitly confirmed in the verified web data - marked as DATA_NEEDED.
