10AS032H4F34I3LG - Arria 10 SX SoC FPGA 320K LE | Intel
MPN: 10AS032H4F34I3LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1717.01 | $1,717.01 |
| 10 | $1631.16 | $16,311.60 |
| 100 | $1545.31 | $154,531.00 |
| 500 | $1487.02 | $743,510.00 |
| 1,000 | $1428.73 | $1,428,730.00 |
Drop-in alternatives for 10AS032H4F34I3LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10AS032H4F34E3SG
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$3490 / Unit
View Datasheet →10AS032H4F34E3LG
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View Datasheet →10AS032H3F34I2SG
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View Datasheet →10AS032H3F34I2LG
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View Datasheet →10AS032H2F34I2SG
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View Datasheet →10AS032H2F34I2LG
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View Datasheet →10AS032H3F35I2SG
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View Datasheet →10AS032H3F35I2LG
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$1590 / Unit
View Datasheet →10AS032H4F34I3LG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 320,000 |
| Hard Processor System (HPS) | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum HPS Frequency | 1.5 GHz |
| Process Technology | TSMC 20 nm |
| Core Voltage | 0.9 V |
| Package | 1152-pin FC-FBGA (F34), 35x35 mm |
| Mounting Type | Surface Mount |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Speed Grade | -3 (fastest in Arria 10 family) |
| Multi-Gigabit Transceivers | Up to 17.4 Gbps |
| PCIe Hard IP | PCIe Gen3 x8 |
| Memory Interfaces | DDR4, DDR3, LPDDR3 hard memory controllers |
| RoHS Status | Compliant |
10AS032H4F34I3LG 1152-pin fc-fbga (f34), 35x35 mm Pin Configuration Guide
Complete pinout information for 10AS032H4F34I3LG (1152-pin fc-fbga (f34), 35x35 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS032H4F34I3LG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS032H4F34I3LG is suitable for 6 applications: Industrial Motor Control and Automation, Software-Defined Radio (SDR) Baseband, Machine Vision and Video Processing, PCIe Accelerator Card, Military and Aerospace Signal Processing, Video Broadcast Processing.
Industrial Motor Control and Automation
The 10AS032H4F34I3LG's Dual ARM Cortex-A9 HPS at 1.5 GHz handles real-time motion control loops and EtherCAT / PROFINET / EtherNet/IP master stacks, while 320K LEs and variable-precision DSP blocks accelerate current/torque control, encoder interpolation, and vibration analysis. Industrial temperature grade (-40C to +100C) suits factory-floor environments. The hard PCIe Gen3 x8 block enables a high-throughput host link when the controller is used as an accelerator inside an industrial PC. Place the SoC FPGA between the power stage gate drivers and the host PLC, with isolated CAN or RS-485 to upstream SCADA. Compared with a discrete MCU plus FPGA design, the SoC integration reduces PCB area and removes inter-chip bus latency.
Recommended
Software-Defined Radio (SDR) Baseband
The 10AS032H4F34I3LG's multi-gigabit transceivers up to 17.4 Gbps interface directly to ADC/DAC front-ends, while the 320K LE fabric and DSP blocks perform digital up/down conversion, channelization, crest-factor reduction, and forward error correction. The Cortex-A9 HPS runs the MAC layer, AGC loop, and remote-control stack. Industrial temp grade makes the part suitable for outdoor base-station deployments. Typical reference designs sample RF at 245.76 Msps on ADC paths and run LTE or 5G NR PUSCH processing. The SoC integration eliminates a separate host CPU module, reducing cost and latency versus split CPU plus FPGA solutions.
Recommended
Machine Vision and Video Processing
The 10AS032H4F34I3LG's FPGA fabric is well-matched to high-throughput image processing pipelines (Sobel, Canny, color-space conversion, object detection) at resolutions up to 4K at 60 fps. The HPS runs Linux for camera control, USB3 Vision or GigE Vision protocol stack, and AI inference hand-off. PCIe Gen3 x8 hard IP streams processed frames to a host server when the SoC FPGA acts as an accelerator on a vision PCIe card. Industrial temperature grade suits in-line factory inspection. Compared with a GPU, the SoC FPGA offers lower latency and deterministic processing for closed-loop quality control.
Recommended
PCIe Accelerator Card
The 10AS032H4F34I3LG's hard PCIe Gen3 x8 IP provides a low-latency host interface with minimal FPGA resource overhead, leaving most of the 320K LEs and DSP blocks free for custom data-plane acceleration (FFT, compression, encryption, signal processing). The HPS can run a lightweight Linux for housekeeping and partial reconfiguration management. Combined with DDR4 hard memory controllers supporting up to 2400 MT/s, the part delivers high throughput from host memory through the FPGA pipeline. Industrial grade supports deployment in data-center edge and telco central-office environments.
Recommended
Military and Aerospace Signal Processing
The 10AS032H4F34I3LG's combination of hardened ARM Cortex-A9 cores and 320K logic elements makes it suitable for ruggedized embedded signal-processing platforms where deterministic latency and extended temperature are required. The industrial temperature grade -40C to +100C supports avionics bays, shipboard radar, and unmanned vehicle control. Transceivers up to 17.4 Gbps connect to high-speed sensors, while DDR4 controllers provide local working memory. Note that true military-grade screening requires the MIL-M grade variant - the I3LG part should be qualified by customer-supplied reliability testing for mission-critical deployments.
Recommended
Video Broadcast Processing
The 10AS032H4F34I3LG integrates enough logic and DSP blocks to handle broadcast-grade video processing such as up/down/cross conversion, HDR tone mapping, and standards conversion between SDI and ST 2110 IP streams. The HPS manages control plane (NMOS IS-04/05, PTP grandmaster) and SDI ancillary data extraction. Multi-gigabit transceivers up to 17.4 Gbps interface directly to 12G-SDI PHYs. Industrial temperature grade and lead-free packaging meet professional broadcast equipment reliability and environmental requirements.
Recommended
Recommended Products Summary
Engineering reference data for 10AS032H4F34I3LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS032H4F34E3SG | 10AS032H4F34E3LG | 10AS032H3F34I2SG | 10AS032H3F34I2LG | 10AS032H2F34I2SG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FBGA (F34), 35x35 mm | 1152-FBGA (F34), 35x35 mm - same | 1152-FBGA (F34), 35x35 mm - same | 1152-FBGA (F34), 35x35 mm - same | 1152-FBGA (F34), 35x35 mm - same | 1152-FBGA (F34), 35x35 mm - same |
| Logic Elements | 320K | 320K | 320K | 320K | 320K | 320K |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Speed Grade | -3 (fastest) | -3 (fastest) | -3 (fastest) | -2 (~15% slower Fmax) | -2 (~15% slower Fmax) | -2 (~15% slower Fmax) |
| Feature Set (H4 vs H2) | H4 (max transceivers, max DSP) | H4 (max transceivers, max DSP) | H4 (max transceivers, max DSP) | H3 (reduced DSP) | H3 (reduced DSP) | H2 (reduced transceivers) |
| Packaging Type | Tray (LG) | Tray (SG) | Tray (LG) | Tray (SG) | Tray (LG) | Tray (SG) |
| RoHS Compliance | Yes (LG suffix) | Yes (SG suffix) | Yes (LG suffix) | Yes (SG suffix) | Yes (LG suffix) | Yes (SG suffix) |
Key Differentiators
- Industrial temperature grade at speed grade -3 (vs 10AS032H4F34E3LG)
- Highest speed grade -3 for maximum Fmax (vs 10AS032H3F34I2LG)
- H4 feature set with maximum transceivers and DSP (vs 10AS032H2F34I2SG)
- Lead-free tray packaging (LG) (vs 10AS032H4F34E3SG)
Design Notes
The 1152-pin FC-FBGA (F34) package at 35x35 mm has a typical theta_JA of around 10-12 C/W with the recommended thermal management stack-up (lid, thermal interface material, and heatsink). Industrial-grade applications in enclosed chassis must size the heatsink for worst-case ambient of +85C to keep junction below +100C. Estimated: at 0.9V core drawing 3A and 12W total dissipation, junction-to-ambient temperature rise is approximately 12 C/W x 12W = 144C, requiring substantial heatsinking or forced airflow for industrial operation.
The 1152-pin FC-FBGA with 1.0 mm ball pitch requires a microvia stack-up (typically 8-12 layers with 2-3 build-up layers). Use a controlled-impedance stack-up for high-speed transceivers (100-ohm differential for PCIe, 90-ohm for SDR, 50-ohm single-ended for general I/O). Reference Intel's Arria 10 PCB Design Guidelines for via-in-pad recommendations, length-matching tolerances, and reference plane requirements. DC-blocking capacitors must be placed within 100 mils of the transceiver pins.
Arria 10 SX devices require multiple sequenced rails: 0.9V core, 1.1V transceiver analog, 1.8V HPS I/O, and DDR4 reference (VTT, VREF). Use an Intel-recommended power controller such as the LTC3612 or Intel's own Enpirion power solutions to handle the sequencing requirement (HPS core before FPGA core, or vice versa depending on configuration). Decoupling must follow Intel's PDN (power distribution network) guidelines, with 0402 0.1uF capacitors placed directly beneath the BGA on the bottom side of the package. Estimated: total quiescent power is approximately 12W typical for a 320K LE Arria 10 SX.
Do not skip the HPS preloader development stage - Linux boot on Arria 10 SX requires a properly built U-Boot preloader, ATF, and device tree. Pin assignments for the HPS must be locked early in the design because changing them after PCB layout requires a board revision. When using PCIe, verify the PCIe reference clock architecture (common-clock vs separate-clock) and that REFCLK lane polarity is correct. Also confirm transceiver channel numbering matches your board schematic before taping out.
Place transceiver channels physically adjacent to the BGA edge with short matched-length routing (typically +/- 0.025 mm tolerance). HPS DDR4 routing should follow Intel's DDR4 Pin Placement Guidelines, with byte-lane swapping only where explicitly supported. Keep the HPS reference clock crystal or oscillator within 200 mils of the HPS_X1 pin. Maintain a continuous ground reference plane under all high-speed routes and avoid routing across plane splits.
Compliance Information
RoHS and lead-free compliance indicated by LG suffix in part number. AEC-Q100 not applicable - Arria 10 SX is an FPGA SoC, not an automotive-grade IC. For automotive applications, dedicated automotive-qualified FPGAs such as Cyclone V or PolarFire are recommended.
