10AS048K2F35E1HG - Arria 10 SX SoC FPGA 480K LE, 1152-FCBGA | Intel
Référence : 10AS048K2F35E1HG ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $3682.94 | $3 682,94 |
| 10 | $3500 | $35 000,00 |
| 100 | $3200 | $320 000,00 |
| 250 | $3000 | $750 000,00 |
| 500 | $2850 | $1 425 000,00 |
| 1 000 | $2650 | $2 650 000,00 |
10AS048K2F35E1HG Présentation
An SoC FPGA (System-on-Chip Field-Programmable Gate Array) is a single-chip integration of a hard processor subsystem (typically ARM Cortex-A or Cortex-R cores) with FPGA fabric on the same silicon package, joined by a high-bandwidth on-chip interconnect. This category sits within the broader hierarchy of programmable logic devices (PLD), positioned between discrete MCU + FPGA multi-chip solutions and ASICs. By collapsing the CPU/FPGA interface into the package, SoC FPGAs reduce board area, simplify PCB layout, eliminate external processor-to-FPGA bus bottlenecks, and improve deterministic latency for hardware accelerators that must exchange data with software.
Key specifications include 480K logic elements, embedded transceivers supporting multi-gigabit serial I/O, up to 28.05 Mbits of embedded memory, fixed-point and IEEE 754 single-precision floating-point DSP blocks, and hard memory controllers for DDR3/DDR4 with ECC. The HPS block integrates two ARM Cortex-A9 cores up to 1.5 GHz, NEON media engine, single/double-precision FPU, L1 caches per core, a shared 512 KB L2 cache, on-chip SRAM, and a rich set of peripherals including USB 2.0 OTG, Gigabit Ethernet, SD/SDIO/MMC, UART, SPI, I2C, and CAN. Secure boot, TrustZone, hardware-accelerated cryptography (AES, SHA, RSA) and a tamper-detect subsystem address anti-tamper requirements.
Typical applications include wireless baseband processing, RADAR and phased-array signal processing, military secure communications, industrial machine vision, test & measurement instrumentation, and high-performance embedded compute. The 1152-FCBGA 35x35 mm package provides the high I/O and power-delivery envelope required for these workloads; thermal management requires a heatsink or top-side cooling under sustained 25 W+ loads. When designing with this device, plan power-rail sequencing carefully — the HPS and FPGA fabric each require independent supply domains with controlled ramp rates to avoid in-rush latch-up; refer to the Intel Arria 10 Device Family Pin Connection Guidelines for ball-map and decoupling guidance.
Alternatives de remplacement direct pour 10AS048K2F35E1HG — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10AS048K2F35E1HG (même facteur de forme et même empreinte) — différant par Package, Logic Elements, Embedded Memory, Process Technology, Mounting Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10AS048K2F35I1HG
✅ Remplacement direct✓ En stock
$3580 / unité
Voir la fiche technique →10AS048K1F35E1HG
✅ Remplacement direct✓ En stock
$3850 / unité
Voir la fiche technique →10AS048K1F35I1HG
✅ Remplacement direct✓ En stock
$3263.87 / unité
Voir la fiche technique →10AS048H4F34E3SG
✅ Remplacement direct✓ En stock
$2250 / unité
Voir la fiche technique →10AS048K2F35E1HG Valeurs maximales et caractéristiques électriques
| Product Family | Arria 10 SX SoC FPGA |
| Logic Elements | 480,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| DSP Blocks | 1,518 (variable-precision, IEEE 754 FP) |
| Adaptive Logic Modules (ALMs) | 190,240 |
| Maximum User I/O Pins | 396 |
| Process Technology | TSMC 20 nm |
| Boîtier | 1152-BBGA, FCBGA, 35 x 35 mm |
| Température de fonctionnement | 0C to 100C (E1 = Enhanced, 0C to 100C) |
| Speed Grade | K2 |
| Hard Memory Controllers | DDR3/DDR4 with ECC support |
| HPS Peripherals | USB 2.0 OTG, GbE, SD/SDIO/MMC, UART, SPI, I2C, CAN |
| Security Features | AES, SHA, RSA, TrustZone, secure boot, anti-tamper |
| Statut RoHS | Compliant |
| Type de montage | Surface Mount (BGA) |
Guide de configuration des broches du 10AS048K2F35E1HG 1152-bbga, fcbga, 35 x 35 mm
Configuration des broches du 10AS048K2F35E1HG (boîtier 1152-bbga, fcbga, 35 x 35 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour 10AS048K2F35E1HG.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
10AS048K2F35E1HG convient pour 6 applications: Wireless Baseband Processing, Radar and Phased-Array Signal Processing, Military Secure Communications, Industrial Machine Vision Systems, Test & Measurement Instrumentation, High-Performance Embedded Compute Platform.
Wireless Baseband Processing
The 10AS048K2F35E1HG fits wireless baseband designs because its 480K logic elements and 1,518 variable-precision DSP blocks deliver the channel-card throughput needed for LTE/5G NR PHY-layer processing, while the dual-core Cortex-A9 HPS runs the MAC scheduler and protocol stack on the same die. Arria 10 SX SoC FPGAs cut board area by collapsing the host processor and FPGA into one package, eliminating the external processor-to-FPGA bus bottleneck that limits discrete MCU + FPGA architectures. Per Intel's Arria 10 design examples, baseband cards typically use 50-70% of the DSP blocks for FFT/filters and CRC accelerators, leaving headroom for custom PHY IP. Companion parts include external RF transceivers (e.g., AD9361) connected via the FPGA's LVDS or JESD204B interfaces, with the HPS running Linux for upper-layer stack management.
Recommandé
Radar and Phased-Array Signal Processing
For radar and phased-array systems, the 10AS048K2F35E1HG delivers the DSP density required for real-time beamforming, pulse compression, and FFT computation across hundreds of antenna elements. The Arria 10 SX's variable-precision DSP blocks support IEEE 754 single-precision floating-point, eliminating the need for external GPUs in mid-sized radar front-ends. Arria 10 transceivers support up to 12.5 Gbps per channel, enabling direct ADC interfacing at multi-GSPS rates. The HPS handles housekeeping, calibration, and Ethernet-based data offload, while the FPGA fabric runs the deterministic beamformer pipeline with sub-microsecond latency. Companion components include high-speed ADCs (e.g., TI ADC32RF45) and DACs, plus DDR4 memory buffers via the FPGA's hard memory controllers with ECC for signal-data integrity.
Recommandé
Military Secure Communications
The 10AS048K2F35E1HG supports secure military radio and SIGINT platforms through its integrated AES, SHA, and RSA hardware accelerators, secure boot ROM, and anti-tamper detection features built into the HPS. Arria 10 SX parts are widely deployed in tactical radios, electronic-countermeasures (ECM) jammers, and signals-intelligence receivers where software-defined waveforms can be re-targeted by updating FPGA bitstream and ARM-side firmware without hardware changes. The hard Cortex-A9 cores run the Type-1 crypto and key-management software at up to 1.5 GHz, while the FPGA fabric implements the physical-layer modem. Per Intel's security documentation, the anti-tamper mesh responds to enclosure-intrusion events by zeroizing volatile keys within microseconds. Companion parts include radiation-hardened power regulators, secure EEPROM for key storage, and FIPS-validated Ethernet PHYs.
Recommandé
Industrial Machine Vision Systems
For high-throughput machine vision inspection, the 10AS048K2F35E1HG combines FPGA-side image pre-processing (filtering, segmentation, blob detection, FFT-based pattern matching) with ARM-side classification and decision logic on the same chip. The 480K LE supports multi-camera pipelines at 4K resolution and 60+ fps, offloading the image-processing bottleneck from a discrete CPU. Arria 10 SX SoC FPGAs integrate Camera Link, CoaXPress, or GigE Vision interfaces through FPGA IP, while the HPS runs Linux-based vision frameworks (OpenCV, ROS). The hard DDR3/DDR4 controllers with ECC handle the high memory bandwidth required for frame buffering. Companion parts include industrial-grade CMOS image sensors, PoE controllers, and high-speed DDR4 memory modules.
Recommandé
Test & Measurement Instrumentation
The 10AS048K2F35E1HG is well-suited to bench-top and modular instrumentation (digitizers, AWGs, protocol analyzers) because it pairs FPGA-side signal acquisition at multi-GSPS rates with ARM-side user-interface, networking, and SCPI command processing. Designers use Arria 10 transceivers for high-speed serial data capture and the HPS for LXI/Ethernet connectivity, USB host ports, and an embedded web server. The 480K LE allows integration of multiple instrument channels in a single chip, replacing a previous multi-FPGA architecture. Per Intel's instrumentation reference designs, sample rates up to 5 GSPS are achievable with companion high-speed ADCs. Companion parts include precision ADCs, DACs, low-jitter clock generators, and DDR4 memory for deep capture buffers.
Recommandé
High-Performance Embedded Compute Platform
For compute-intensive embedded workloads (video transcoding, AI inference at the edge, data acquisition with on-board analytics), the 10AS048K2F35E1HG offers a balanced ARM + FPGA compute fabric. The dual Cortex-A9 cores running at 1.5 GHz handle Linux application code, while the FPGA fabric accelerates custom DSP, crypto, and AI inference pipelines in hardware. Arria 10 SX devices in this configuration typically serve as edge appliances that previously required an SBC + PCIe FPGA card combo, simplifying the bill of materials and reducing system latency. The integrated USB 2.0, GbE, SD/MMC, and CAN peripherals minimize the need for external bus controllers. Companion parts include LPDDR4 memory, eMMC storage, GbE PHYs, and USB power-delivery controllers.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10AS048K2F35E1HG — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10AS048K2F35I1HG | 10AS048K1F35E1HG | 10AS048K1F35I1HG |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 1152-BBGA, FCBGA (35x35 mm) | 1152-BBGA, FCBGA (35x35 mm) | 1152-BBGA, FCBGA (35x35 mm) | 1152-BBGA, FCBGA (35x35 mm) |
| Logic Elements | 480,000 | 480,000 | 480,000 | 480,000 |
| Speed Grade | K2 | K2 | K1 (-10% slower) | K1 (-10% slower) |
| Temperature Grade | E1 (0C to 100C) | I1 (-40C to +100C) | E1 (0C to 100C) | I1 (-40C to +100C) |
| Hard Processor System | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Maximum User I/O | 396 | 396 | 396 | 396 |
Principaux différenciateurs
- Industrial temperature coverage with identical silicon (vs 10AS048K2F35I1HG)
- Higher speed grade for performance-critical paths (vs 10AS048K1F35E1HG)
- Dual ARM Cortex-A9 hard processor system (vs Non-SoC Arria 10 GX variants)
Notes de conception
Estimated: at typical 25 W dissipation in a 1152-FCBGA package with theta_JA around 8-10 C/W (junction-to-ambient with adequate top-side heatsink), the junction temperature rise is 200-250 C above 25 C ambient. A top-side heatsink with thermal interface material is required for sustained workloads. Use Quartus Prime PowerPlay for design-specific thermal estimation. Without active cooling the device will throttle or shut down.
PCB layout for the 1152-BGA at 1.0 mm pitch requires microvia stack-up (laser-drilled vias), with all signal and GND vias placed within the BGA fan-out region. Follow Intel's Arria 10 device family pin connection guidelines for decoupling capacitor placement: place 0.1 uF and 10 uF ceramics within 100 mil of each power pin, with via-in-pad recommended for the inner rows. Maintain reference-plane continuity under the BGA to avoid impedance discontinuities on high-speed transceiver channels.
The Arria 10 SX requires multiple independent power rails (core VCC, HPS VCC, transceiver VCCT, I/O VCCIO banks, auxiliary VMON). Power-on sequencing must follow Intel's Power-Up and Power-Down Sequencing Specification - HPS and FPGA cores ramp with controlled slew rates to prevent in-rush latch-up. Use a PMBus-compliant sequencer (e.g., Intel's Enpirion power solutions) and verify monotonic ramp with an oscilloscope on the slowest rail.
Do not omit the external memory interface (EMIF) calibration step during board bring-up - DDR3/DDR4 interfaces require software calibration via the Quartus EMIF Toolkit to meet timing margins. Also, the HPS boot ROM expects specific GPIO strapping pins to select boot source (QSPI flash, SD card, or NAND); incorrect strapping results in a non-booting HPS even when the FPGA fabric loads successfully.
Informations de conformité
RoHS and REACH compliant per Intel product page. Lead-free FCBGA package. Not AEC-Q100 qualified - this part is not intended for automotive safety applications. For aerospace/defense screening, request MIL-PRF-38535 or VX/MX-suffix parts directly from Intel.
