10AS048K1F35E1HG - Arria 10 SX SoC FPGA 480K LE | Intel FPGA
MPN: 10AS048K1F35E1HG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4850 | $4,850.00 |
| 10 | $4600 | $46,000.00 |
| 100 | $4350 | $435,000.00 |
| 500 | $4100 | $2,050,000.00 |
| 1,000 | $3850 | $3,850,000.00 |
Drop-in alternatives for 10AS048K1F35E1HG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10AS048K1F35I1HG
✅ Drop-In✓ In Stock
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View Datasheet →10AS048K1F35E2SG
✅ Drop-In📋 Reference alternative (not in catalog)
10AS048K1F35E3LG
✅ Drop-In📋 Reference alternative (not in catalog)
10AS048H2F34E1HG
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View Datasheet →10AS048K1F35E1HG Maximum Ratings & Electrical Characteristics
| Product Series | Arria 10 SX SoC FPGA |
| Logic Elements | 480,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Clock Speed | Up to 1.5 GHz |
| Process Technology | 20 nm |
| Package | 1152-ball FC-BGA (flip-chip), 35x35 mm |
| Mounting Type | Surface Mount |
| Operating Temperature | Industrial / commercial per part number suffix |
| Memory Interfaces | DDR4, DDR3, LPDDR3, QDR IV (hard controllers) |
| Transceivers | Multi-gigabit serial transceivers, up to 17.4 Gbps (family) |
| DSP Blocks | Variable-precision DSP blocks (per family) |
| On-chip RAM | M20K memory blocks + MLAB (per family) |
| HPS Peripherals | Gigabit Ethernet, USB 2.0 OTG, SD/SDIO/MMC, SPI, I2C, UART, CAN |
| Hard IP Blocks | PCIe Gen3 (hard), 10/40 GbE MAC, DDR controllers, partial reconfiguration |
| Configuration | FPGA fabric + HPS independent configuration, supports AS/PS/JTAG |
| RoHS Status | Compliant |
| Design Software | Intel Quartus Prime (legacy: Altera Quartus II) |
10AS048K1F35E1HG 1152-ball fc-bga (flip-chip), 35x35 mm Pin Configuration Guide
Complete pinout information for 10AS048K1F35E1HG (1152-ball fc-bga (flip-chip), 35x35 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS048K1F35E1HG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS048K1F35E1HG is suitable for 6 applications: 5G Wireless Baseband DSP, Software-Defined Radio (SDR), Industrial Machine Vision Inspection, Medical Imaging Pre-Processing, Broadcast Video Processing, High-Performance Embedded Computing (HPEC).
5G Wireless Baseband DSP
The 10AS048K1F35E1HG's 480K logic elements, variable-precision DSP blocks (FMA support), and multi-gigabit transceivers up to 17.4 Gbps make it well-suited to 5G NR baseband digital signal processing. Its dual ARM Cortex-A9 HPS at 1.5 GHz runs the L2/L3 control stack and MAC scheduling, while the FPGA fabric implements LDPC/Polar FEC decoders, FFT/IFFT pipelines, and digital predistortion. Hard PCIe Gen3 and 40GbE MAC blocks connect the device to host processors and fronthaul networks without burning fabric logic, which lowers latency in low-latency baseband pipelines.
Recommended
Software-Defined Radio (SDR)
The 10AS048K1F35E1HG is a strong fit for military and commercial SDR platforms. Its HPS handles waveform control, network stack, and Linux management, while the FPGA fabric executes DDC/DUC, channelizers, and wideband FFT engines for tactical radios and electronic warfare. Transceivers operating at multi-gigabit data rates enable direct digitization of intermediate-frequency signals. The 1.5 GHz Cortex-A9 cluster offers responsive boot times for secure boot flows, and the FC-BGA package supports the dense mixed-signal routing that SDR front-ends require.
Recommended
Industrial Machine Vision Inspection
Industrial inspection systems require deterministic, high-throughput pixel processing. The 10AS048K1F35E1HG delivers this via 480K logic elements for line-scan/bayer conversions, defect detection CNN accelerators, and camera-link/CoaXPress aggregation through multi-gigabit transceivers. The HPS runs Linux for recipe management, MQTT/SCADA messaging, and HMI display rendering. Hard DDR4 controllers provide high-bandwidth frame buffer access for 4K/8K inspection streams, while the industrial temperature range (via the I-suffix variants) supports factory-floor deployments.
Recommended
Medical Imaging Pre-Processing
The 10AS048K1F35E1HG accelerates medical imaging pipelines such as CT, MRI, and ultrasound beamforming. Its HPS runs the patient-management UI and DICOM stack while the FPGA fabric executes filter-backprojection, image reconstruction, and real-time signal conditioning. Variable-precision DSP blocks support numerical algorithms tuned to medical precision requirements, and hard PCIe Gen3 enables host x86/x64 coprocessor links. The 1152-ball FC-BGA package supports dense mixed-signal routing, and RoHS compliance simplifies regulatory certification for medical device manufacturers.
Recommended
Broadcast Video Processing
Broadcast studios need low-latency, real-time video processing at UHD/4K frame rates. The 10AS048K1F35E1HG handles multi-stream SDI/HDMI aggregation, HDR/SDR conversion, and HEVC codec acceleration on the FPGA fabric, while the dual ARM Cortex-A9 HPS manages playout control and ancillary data. Multi-gigabit transceivers connect to SDI/HDMI IP cores at high bit rates, and hard DDR4 controllers supply the frame buffer bandwidth that real-time broadcast workflows demand. Source: typical Arria 10 SX SoC video design patterns from Intel reference materials.
Recommended
High-Performance Embedded Computing (HPEC)
The 10AS048K1F35E1HG powers defense and aerospace HPEC platforms that combine OS-managed control with FPGA-accelerated signal processing. The 1.5 GHz Cortex-A9 cluster runs VxWorks or Linux for system management, while the 480K-LE fabric executes parallel DSP pipelines such as radar pulse compression, SAR processing, and adaptive beamforming. Hard 40GbE MACs and PCIe Gen3 enable low-latency backplane links to VPX/OpenVPX chassis. FC-BGA packaging supports the thermal envelope of sealed VPX conduction-cooled cards used in military vehicles.
Recommended
Recommended Products Summary
Engineering reference data for 10AS048K1F35E1HG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS048K1F35I1HG | 10AS048K1F35E2SG | 10AS048K1F35E3LG | 10AS048H2F34E1HG | 10AS048H1F34E1HG |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FBGA, FC (35x35) | 1152-FBGA, FC (35x35) - same | 1152-FBGA, FC (35x35) - same | 1152-FBGA, FC (35x35) - same | 1152-FBGA, FC (34x34) - smaller | 1152-FBGA, FC (34x34) - smaller |
| Logic Elements | 480,000 | 480,000 | 480,000 | 480,000 | 480,000 | 480,000 |
| HPS Architecture | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore |
| HPS Clock | Up to 1.5 GHz | Up to 1.5 GHz | Up to 1.5 GHz | Up to 1.5 GHz | Up to 1.5 GHz | Up to 1.5 GHz |
| Speed Grade | E1 (commercial, fast) | I1 (industrial) | E2 (commercial, slower) | E3 (commercial, slowest) | E1 | E1 |
| Operating Temperature | Commercial (0C to +85C, per E1 suffix) | Industrial (-40C to +100C) | Commercial | Commercial | Commercial | Commercial |
| RoHS Status | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
Key Differentiators
- Arria 10 SX SoC FPGA with integrated 1.5 GHz dual Cortex-A9 HPS (vs 10AS032H4F35I3SG)
- Hard PCIe Gen3 and 40GbE IP blocks reduce fabric utilization (vs Cyclone V SoC FPGAs)
- Multi-gigabit transceivers up to 17.4 Gbps for direct fronthaul interfaces (vs Cyclone 10 SoC family)
Design Notes
The Arria 10 SX SoC FPGA in the FC-BGA (35x35 mm) package can dissipate significant power under heavy HPS + fabric load. Use the Arria 10 thermal model and conduct a board thermal simulation in Quartus Prime PowerPlay / Thermal Analysis before committing to the PCB stack-up. Estimated: at 85C ambient with all 480K LEs active and 1.5 GHz HPS utilization, junction-to-ambient thermal resistance (theta_JA) is approximately 5-7 C/W with proper heatsink/cold-plate attachment. Provide at least 1 oz copper inner layers under the BGA for heat spreading.
The 1152-ball FC-BGA requires a high-density PCB stack-up: microvias (laser-drilled), 0.8 mm or 1.0 mm ball pitch, and matched-length routing for high-speed transceivers. Use the Arria 10 SX pin-out file from Intel and run HyperLynx or Ansys SIwave for signal integrity on DDR4 channels. Estimated: HPS DDR4 controller supports up to 2400 Mbps per lane; layout must meet length-matching tolerance of +/- 0.25 mm on byte lanes to avoid read/write training failures.
Do not assume that different speed-grade suffixes (E1 vs E2 vs E3) within the same Arria 10 SX family have the same fabric Fmax - slower grades reduce achievable clock frequency and may fail timing closure. Quartus Prime reports the grade-specific Fmax; verify your RTL meets timing with the actual device suffix before tape-out. Also verify the package footprint suffix (F35 vs F34) against your PCB land pattern, as they differ in BGA dimension.
Separate analog/digital ground domains using a star-ground connection near the FPGA. The HPS and FPGA fabric share a common GND but noisy switching returns must not couple into sensitive transceiver analog supply pins. Place decoupling capacitors (10 uF bulk + 100 nF per power pin) within 3 mm of each supply ball per Arria 10 SX hardware reference design. Estimated: per Arria 10 SX pin-power map, expect ~40-60 decoupling positions for the HPS supply island.
Compliance Information
RoHS compliance per WWDParts listing for the 10AS048K1F35E1HG. REACH compliance, halogen-free status, and conflict-mineral disclosures not stated in verified web data; refer to Intel product declarations for authoritative statements.
