10AS048K1F35I1HG - Arria 10 SX SoC FPGA 480K LE | Intel
MPN: 10AS048K1F35I1HG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5099.79 | $5,099.79 |
| 10 | $4589.81 | $45,898.10 |
| 100 | $4079.83 | $407,983.00 |
| 500 | $3671.85 | $1,835,925.00 |
| 1,000 | $3263.87 | $3,263,870.00 |
Drop-in alternatives for 10AS048K1F35I1HG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AS048K1F35E1HG
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View Datasheet →10AS048H4F34I3SG
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View Datasheet →10AS048H2F34I1HG
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View Datasheet →10AS048H1F34I1HG
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View Datasheet →10AS048K1F35I1HG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX SoC FPGA |
| Logic Elements | 480,000 |
| Processor Subsystem | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| Maximum HPS Clock Frequency | 1.5 GHz |
| User I/O Count | 396 |
| Package | 1152-ball FCBGA (35x35 mm) |
| Process Technology | 20 nm |
| Device Variant | 10AS048 (480K LE) |
| Speed Grade | K1 |
| Operating Temperature | -40C to +100C (Industrial) |
| Package Code | F35 |
| Mounting Type | Surface Mount (Flip-Chip BGA) |
| RoHS Status | Compliant |
| MSL Level | 3 (per JEDEC J-STD-020) |
| Supply Voltage (Core) | 0.9 V typical (multi-rail) |
10AS048K1F35I1HG f35 Pin Configuration Guide
Complete pinout information for 10AS048K1F35I1HG (f35 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS048K1F35I1HG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS048K1F35I1HG is suitable for 6 applications: Wireless Baseband Processing, Radar and Electronic Warfare Signal Processing, Industrial Machine Vision Systems, Broadcast Video Infrastructure, Military Communications and Tactical Radio, Medical Imaging Systems.
Wireless Baseband Processing
The 10AS048K1F35I1HG's combination of 480K programmable logic elements and an integrated dual-core ARM Cortex-A9 MPCore HPS at 1.5 GHz makes it well suited for 4G/5G small-cell baseband processing, where the FPGA fabric accelerates FFT/iFFT and channel-correction blocks while the HPS runs the MAC scheduler and OAM stack. The 396 user I/O and 20 nm process deliver high DSP throughput at moderate power; the HPS-FPGA coherent interconnect enables low-latency data hand-off. For a 20 MHz LTE sector, expect 15-25 W dissipation at full load.
Recommended
Radar and Electronic Warfare Signal Processing
Arria 10 SX SoC FPGAs are widely deployed in radar front-end and electronic-warfare subsystems, where the FPGA fabric's variable-precision DSP blocks perform pulse compression, MTI filtering, and beamforming while the dual-core ARM Cortex-A9 HPS handles mode control and target tracking. The 1.5 GHz HPS frequency provides ample headroom for control-plane software, and the 1152-ball FCBGA F35 package supports the high transceiver lane count typical of phased-array radar. Designers typically partition the FFT onto FPGA fabric and run tracking filters on the HPS Cortex-A9 cores.
Recommended
Industrial Machine Vision Systems
The 10AS048K1F35I1HG's high-density FPGA fabric (480K LEs) enables real-time image pre-processing - filtering, color-space conversion, and feature extraction - at multi-megapixel sensor rates, while the dual-core ARM Cortex-A9 MPCore at 1.5 GHz runs the inspection classifier and PLC communication stack. The 1152-FCBGA F35 package supports multiple MIPI CSI-2 or GigE Vision sensor interfaces via FPGA fabric transceivers. Industrial temperature grade (-40C to +100C) suits factory-floor deployment without additional ruggedization.
Recommended
Broadcast Video Infrastructure
The 10AS048K1F35I1HG is well matched to broadcast video encoder/decoder and video-routing infrastructure where the FPGA fabric handles multi-stream HEVC/H.264 encoding pipelines and the dual-core ARM Cortex-A9 HPS runs the control and network-management plane. The 396 user I/O and high transceiver count (via the F35 1152-FCBGA package) accommodate SMPTE 2022, 2110 IP-video, and 12G-SDI interfaces simultaneously. The SoC integration reduces board area versus discrete FPGA-plus-CPU designs by approximately 30-40%.
Recommended
Military Communications and Tactical Radio
Arria 10 SX 480K LE SoC FPGAs serve tactical radio and secure communications platforms, where the FPGA fabric implements modem waveforms (LINK-16, SINCGARS, HAVE QUICK) and the dual-core ARM Cortex-A9 HPS at 1.5 GHz runs crypto and routing stacks under a security-hardened OS. The industrial temperature grade and Intel's Anti-Tamper design support defense-aerospace requirements. The 1152-ball FCBGA F35 footprint enables compact, ruggedized board layouts.
Recommended
Medical Imaging Systems
The 10AS048K1F35I1HG's combination of 480K logic elements, dual-core ARM Cortex-A9 HPS at 1.5 GHz, and high transceiver bandwidth suits CT, MRI, and ultrasound imaging systems, where the FPGA fabric executes beamforming and image reconstruction while the HPS handles the user interface, DICOM stack, and clinician workflow. Industrial temperature grade is adequate for controlled clinical environments; for portable or field-imaging equipment, consider the E (extended) temperature variant. SoC integration reduces BOM and simplifies IEC 60601 compliance verification.
Recommended
Recommended Products Summary
Engineering reference data for 10AS048K1F35I1HG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS048K1F35E1HG | 10AS048H4F34I3SG | 10AS048H4F34I3LG | 10AS048H2F34I1HG | 10AS048H1F34I1HG |
|---|---|---|---|---|---|---|
| Package | 1152-FCBGA F35 (35x35 mm) | 1152-FCBGA F35 (35x35 mm) | 1152-FCBGA F35 (35x35 mm) | 1152-FCBGA F35 (35x35 mm) | 1152-FCBGA F35 (35x35 mm) | 1152-FCBGA F35 (35x35 mm) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA | Arria 10 SX SoC FPGA |
| Logic Elements | 480K | 480K | 480K | 480K | 480K | 480K |
| Speed Grade | K1 | K1 | H4 | H4 | H2 | H1 |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +100C (Extended) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| HPS Maximum Clock Frequency | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz |
| User I/O Count | 396 | 396 | 396 | 396 | 396 | 396 |
| RoHS Compliance | Yes | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Highest HPS clock frequency tier in the Arria 10 SX family (vs 10AS048H2F34I1HG)
- Industrial temperature grade (-40C to +100C) (vs 10AS048K1F35E1HG)
- F35 (35x35 mm) 1152-ball FCBGA package - largest Arria 10 SX BGA option (vs 10AS048H4F34I3SG)
Design Notes
At typical utilization (60-70% logic, 50% DSP, HPS active), the 10AS048K1F35I1HG dissipates approximately 15-25 W. The 35x35 mm F35 FCBGA package requires a high-performance PCB thermal solution: at least 8 thermal vias in the central ball-grid array under the die, connected to inner-plane copper or a heatsink. Without adequate thermal relief, junction temperature can exceed 100C in still air. Estimated: 20 W dissipation at 0.9 V core with theta-JA around 8-12 C/W on a 12-layer PCB. Always run Intel's Arria 10 PowerPlay early estimator before committing to a board stack-up.
The 1152-ball FCBGA F35 (35x35 mm) requires a 1.0 mm or 0.8 mm ball pitch escape routing pattern. Use Intel's recommended land pattern and follow IPC-7352 / IPC-7093 for BGA fanout. Decoupling: place 0402 0.1 uF and 0201 0.01 uF capacitors on every power pin within 2 mm trace length; add bulk 47-100 uF polymer capacitors near each power-rail entry point. Use a 12-layer or 14-layer stack-up with dedicated ground and power planes. Signal-integrity simulations are mandatory for transceiver lanes above 10 Gbps.
Do not assume F34 and F35 packages share the same ball-out - the part numbering decodes F35 as the 35x35 mm FCBGA package, but the F34 (different Arria 10 SX 1152-ball FCBGA option) has a different ball map. Always cross-check the Intel Quartus Prime .pcf pinout file for the exact OPN before PCB layout. Another common pitfall: attempting to migrate between speed grades (K1, H1, H2, H4) without re-running timing closure - higher speed grades (lower number suffix) may not meet timing for your design. Finally, ensure configuration source selection (MSEL pins) is correctly set for your boot mode (AS, PS, JTAG, or FPP).
Compliance Information
RoHS, REACH, lead-free, halogen-free, and conflict-minerals compliance per Intel product environmental documentation for Arria 10 SX devices. AEC-Q100 qualification not applicable - Arria 10 SX is industrial/military grade, not automotive AEC-Q100.
