10AS066K2F35I2LG - 660K LE, 1.5GHz SoC FPGA | Intel
Référence : 10AS066K2F35I2LG ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $5650.15 | $5 650,15 |
| 10 | $5650.15 | $56 501,50 |
| 100 | $5650.15 | $565 015,00 |
| 500 | $5650.15 | $2 825 075,00 |
| 1 000 | $5650.15 | $5 650 150,00 |
10AS066K2F35I2LG Présentation
An FPGA is a field-programmable gate array, an integrated circuit whose logic functions are configured after manufacturing. A system-on-chip FPGA extends that concept by combining programmable logic, processor cores, memory interfaces, and peripheral resources on one device. Within the semiconductor hierarchy, this part belongs to the Arria 10 SX family of SoC FPGAs, bridging programmable logic and embedded processing. The 660,000 logic elements provide configurable digital resources, while the dual ARM Cortex-A9 MPCore subsystem provides a processor-based execution path. CoreSight technology supports system-level debug and tracing functions for development and diagnostics.
The key verified characteristics are 660,000 logic elements, a 1.5 GHz stated frequency, and a 1152-ball FCBGA package with 35 mm by 35 mm dimensions. The part is specified for an industrial temperature grade in the provided cross-reference data. The device is also described as a semiconductor programmable logic device using 20 nm technology, with a stated 0.9 V operating parameter in one source result. These values should be verified against the manufacturer ordering documentation before establishing board-level power, timing, or thermal limits.
At the system level, the combination of configurable logic and ARM Cortex-A9 cores supports partitioned implementations: deterministic datapaths, protocol handling, and control logic can be placed in the FPGA fabric, while operating-system, management, or application functions can run on the processors. This architecture is useful when a design needs hardware parallelism without giving up software-based configuration, monitoring, or network processing. The large 1152-ball package also indicates a high-density device requiring controlled PCB routing, power distribution, signal integrity, and thermal analysis.
Typical applications include industrial automation, medical equipment, communications infrastructure, test and measurement systems, and embedded vision or signal-processing platforms. The industrial temperature designation makes the part relevant to environments where operating conditions may extend beyond commercial ranges. A specific application must confirm the device's supported configuration, memory interface, transceiver resources, processor peripherals, and power requirements from the official documentation. The provided search data does not enumerate those detailed electrical characteristics, so they remain marked as data needed rather than inferred.
Designers should plan the PCB around the 1152-ball package and obtain the complete manufacturer pinout, package land pattern, power-supply sequence, clocking requirements, and thermal recommendations before layout. A 35 mm square package can create substantial routing and manufacturing complexity, so escape routing, via topology, decoupling placement, and differential-pair geometry should be reviewed early. Programmable logic should also be treated as a configurable system component: configuration storage, reset behavior, clock distribution, and boundary-scan access affect production programming and board bring-up.
This data set combines verified distributor identification, the manufacturer ordering page, and targeted cross-reference results. It emphasizes exact package and device facts, while marking unverified electrical limits and replacement compatibility as data needed rather than presenting assumptions as specifications.
Alternatives de remplacement direct pour 10AS066K2F35I2LG — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10AS066K2F35I2LG (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Logic Elements, Mounting Type, Temperature Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10AS066K2F35E2SG
✅ Remplacement direct✓ En stock
$2890 / unité
Voir la fiche technique →10AS066K2F35E2LG
✅ Remplacement direct✓ En stock
$3360 / unité
Voir la fiche technique →10AS066K2F35E1HG
✅ Remplacement direct✓ En stock
$3290 / unité
Voir la fiche technique →10AS066K1F35I1HG
✅ Remplacement direct✓ En stock
$2275 / unité
Voir la fiche technique →10AS066H4F34I3SG
✅ Remplacement direct✓ En stock
$2295 / unité
Voir la fiche technique →10AS066K2F35I2LG Valeurs maximales et caractéristiques électriques
| Manufacturer | Altera / Intel |
| Product Type | System-on-chip FPGA |
| Family | Arria 10 SX |
| Logic Elements | 660000 logic elements |
| Processor Cores | Dual ARM Cortex-A9 MPCore |
| CoreSight Technology | Included |
| Operating Frequency | 1.5 GHz |
| Boîtier | 1152-ball FCBGA |
| Package Dimensions | 35 mm x 35 mm |
| Terminal Count | 1152 balls |
| Terminal Form | Ball |
| Temperature Grade | Industrial |
| Process Technology | 20 nm |
| Stated Operating Voltage | 0.9 V |
| Logic Element Count | 660K |
| Type de montage | Surface mount |
| Package Shape | Square |
| Configuration | FPGA and embedded processor SoC |
Guide de configuration des broches du 10AS066K2F35I2LG square
Configuration des broches du 10AS066K2F35I2LG (boîtier square). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour 10AS066K2F35I2LG.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
10AS066K2F35I2LG convient pour 6 applications: Industrial Automation Controller, Medical Signal-Processing Platform, Communications Infrastructure Equipment, Test and Measurement Instrument, Embedded Vision and Image Processing, Aerospace and UAV Control System.
Industrial Automation Controller
10AS066K2F35I2LG fits industrial automation systems that need both deterministic programmable logic and processor-based control. Its verified 660,000 logic elements support configurable interfaces, sequencing, filtering, and motion or machine-control datapaths, while the dual ARM Cortex-A9 MPCore processors can run supervisory software, communications, diagnostics, and protocol stacks. CoreSight technology supports system-level development and debug. The listed industrial temperature grade makes the device relevant to factory environments, but designers must confirm the exact ambient and junction limits, supported operating modes, and reliability requirements in the official documentation before production release.
Recommandé
Medical Signal-Processing Platform
10AS066K2F35I2LG is a potential platform component for medical equipment requiring high-density signal processing and embedded control. The 660,000 logic elements can be configured for acquisition pipelines, filtering, data reduction, and interface logic, while the dual ARM Cortex-A9 MPCore processors can manage device control, data movement, and user-interface functions. The verified 1.5 GHz device description indicates a high-performance SoC positioning. Medical designs also require system-level safety, validation, traceability, and regulatory evidence beyond component specifications; the supplied data does not provide medical certification or functional-safety claims, so those must be confirmed separately.
Recommandé
Communications Infrastructure Equipment
10AS066K2F35I2LG can support communications equipment that combines packet processing, protocol handling, and hardware acceleration. Its 660,000 logic elements provide configurable resources for datapaths, framing, buffering control, and interface adaptation, while the dual ARM Cortex-A9 MPCore subsystem can handle control-plane software and system management. CoreSight technology provides a development and trace framework for embedded software. The package is a 1152-ball FCBGA measuring 35 mm by 35 mm, so board implementation must address high-density escape routing, signal integrity, power integrity, and thermal management. Detailed transceiver, memory, and interface resources are not provided and require official datasheet review.
Recommandé
Test and Measurement Instrument
10AS066K2F35I2LG suits test and measurement designs that require simultaneous high-speed data handling, configurable measurement logic, and processor-based instrument control. The verified 660,000 logic elements can implement acquisition, triggering, timing, filtering, and data-formatting functions, while the dual ARM Cortex-A9 processors can manage user interfaces, calibration, storage, and communications. CoreSight technology assists embedded software development and diagnostics. The part is listed as an Arria 10 SX SoC FPGA with 1.5 GHz frequency and an industrial temperature grade. Exact analog performance, ADC or DAC integration, I/O standards, memory configuration, and power limits are not included in the supplied data and must be validated.
Recommandé
Embedded Vision and Image Processing
10AS066K2F35I2LG can serve as the processing and control centerpiece in an embedded vision system. Its 660,000 logic elements can accelerate image pipelines, sensor-interface adaptation, filtering, region-of-interest operations, and data formatting, while the dual ARM Cortex-A9 MPCore processors can run camera control, protocol management, and application software. The verified 1.5 GHz frequency and SoC architecture support partitioning between parallel hardware and software tasks. Designers must evaluate available memory bandwidth, external memory interfaces, sensor I/O standards, configuration support, and power dissipation from the manufacturer documentation because those values are not present in the supplied search data.
Recommandé
Aerospace and UAV Control System
10AS066K2F35I2LG may be evaluated for UAV and aerospace control systems that combine sensor acquisition, control loops, communications, and embedded software. The 660,000 logic elements support configurable control and signal-processing hardware, while the dual ARM Cortex-A9 MPCore processors support supervisory control and application execution. CoreSight technology can assist software debugging and system trace. The verified data identifies an industrial temperature grade and a 1152-ball FCBGA package, but it does not establish aerospace qualification, radiation performance, reliability data, or mission-profile support. Those requirements require qualification evidence and exact manufacturer documentation; the part should not be selected from package capacity alone.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10AS066K2F35I2LG — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10AS066K2F35E2SG | 10AS066K2F35E2LG | 10AS066K2F35E1HG | 10AS066K1F35I1HG | 10AS066H4F34I3SG |
|---|---|---|---|---|---|---|
| Brand | Altera / Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-ball FCBGA, 35 mm x 35 mm | 1152-ball FCBGA | 1152-ball FCBGA | 1152-ball FCBGA | 1152-ball FCBGA | 1152-ball FCBGA |
| Terminal Count | 1152 balls | 1152 | 1152 | 1152 | 1152 | 1152 |
| Terminal Form | Ball | Ball | Ball | Ball | Ball | Ball |
Principaux différenciateurs
- Integrated dual ARM Cortex-A9 MPCore processing with FPGA fabric (vs 10AS066K2F35E2SG)
- Industrial temperature-grade identification (vs 10AS066K2F35E2LG)
- High-density 1152-ball FCBGA implementation (vs 10AS066H4F34I3SG)
Notes de conception
The verified package is a 1152-ball FCBGA measuring 35 mm by 35 mm. Before schematic release, obtain the official land pattern, ball map, via recommendations, escape-routing guidance, and manufacturing rules for 10AS066K2F35I2LG. Do not derive a footprint from a generic BGA library. Confirm whether the selected PCB stack-up supports the required ball pitch, dogbone or via-in-pad construction, via reliability, plane transitions, and impedance targets for the actual I/O implementation.
The provided data states 0.9 V for one part listing, but it does not provide the complete power-supply table, current requirements, ramp sequence, tolerance, or power-up behavior for 10AS066K2F35I2LG. Treat 0.9 V as an unconfirmed single-source descriptor, not a complete design value. Use the manufacturer documentation to define rail voltages, sequencing, decoupling, transient response, and brownout handling. Keep high-frequency decoupling close to the relevant power balls and use verified plane and via structures for the 1152-ball package.
Although the source data identifies an industrial temperature grade, it does not provide junction-temperature limits, thermal resistance, allowable power, airflow conditions, or derating curves. Thermal analysis must therefore use the official device data and the board-level environment. Estimate only after obtaining power dissipation and package thermal models, then correlate the model with the assembled PCB, enclosure, neighboring components, airflow, and expected worst-case ambient. Do not infer reliability from the industrial label alone.
Plan the board implementation around both the 1152-ball package and the exact I/O bank assignments. Separate high-speed or noisy interfaces from sensitive clocks and processor-related signals, maintain continuous reference planes, and use short controlled-impedance routes where the design requires them. Configuration, reset, clock, and debug connections should be assigned according to the exact manufacturer ball map. Because the supplied data does not include the complete pinout or I/O bank table, those details are marked as data needed.
A common integration mistake is to treat 10AS066K2F35I2LG as a generic 660,000-logic-element FPGA without validating configuration, software, processor, memory, and power requirements. The ordering code, package, temperature designation, and 1.5 GHz descriptor must all be checked against the official ordering table. Do not assume that a related 10AS066 family code is a drop-in replacement, and do not use a 1152-ball package description as a substitute for the exact ball-out or land pattern.
Informations de conformité
The verified search results identify the manufacturer ordering page and describe the part as an Altera or Intel programmable logic device, but they do not provide verified RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals declarations. Compliance values are therefore unknown. AEC-Q100 is not applicable to the provided data only as a classification placeholder; qualification is not established.
