10AS066H4F34I3SG - 660K LE Arria 10 SX SoC FPGA | Intel
Référence : 10AS066H4F34I3SG ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $2808.68 | $2 808,68 |
| 10 | $2735.42 | $27 354,20 |
| 100 | $2580.15 | $258 015,00 |
| 500 | $2425.3 | $1 212 650,00 |
| 1 000 | $2295 | $2 295 000,00 |
10AS066H4F34I3SG Présentation
A System on Chip (SoC) FPGA is a single silicon device that merges a programmable logic fabric with one or more hard processor cores, high-speed peripherals, and memory controllers. Within the broader taxonomy, this part sits in the chain SoC FPGA -> FPGA -> Programmable Logic Device (PLD) -> Integrated Circuit. The SoC architecture removes the need for a separate processor chip on the PCB, lowering BOM cost, shrinking board area, and reducing inter-chip latency while retaining full FPGA programmability.
The 10AS066H4F34I3SG delivers 660K logic elements, embedded hardened memory controllers, 28 nm transceivers, fractional PLLs, and PCIe Gen2/Gen3-capable hardened IP blocks. Its hard ARM Cortex-A9 dual-core subsystem supports symmetric multiprocessing with NEON SIMD media engine, ECC L1/L2 caches, and an integrated CoreSight debug and trace fabric. The integrated HPS exposes EMAC, USB 2.0 OTG, NAND/NOR flash controllers, and DDR3/4 memory interfaces with hardware ECC for reliability.
In system architecture the 10AS066H4F34I3SG is typically paired with external DDR3/DDR4 SDRAM, eMMC or NAND boot flash, and high-speed serial links to ASICs, FPGAs, or backplane transceivers. The 1152-FCBGA package enables the highest-pin-count configurations of the Arria 10 SX family, supporting up to 492 user I/Os at the I/O bank limit and multiple 10 Gbps transceiver channels routed from the FPGA side. The Arria 10 architecture is widely deployed in mid-range communications, video broadcast, industrial imaging, and defense applications.
Typical applications include 4K video processing pipelines, 10G/40G Ethernet aggregation, baseband DSP for wireless backhaul, industrial machine vision, and SoC-based control plane processors. The combination of hardened ARM cores and high-density FPGA fabric makes the part a strong fit when deterministic hardware acceleration must coexist with a Linux-class application processor.
When designing with this device, provide at least 0.9 V core and 1.8 V/2.5 V/3.3 V auxiliary rails, follow the Intel Arria 10 pin connection guidelines, and use the Quartus Prime design suite for synthesis, place-and-route, and HPS configuration. The 35 x 35 mm FCBGA requires ENIG surface finish, microvia or HDI PCB stack-up, and a high-current multi-rail power distribution network.
This page synthesizes distributor pricing, drop-in same-family variants, and design considerations that go beyond what a single manufacturer datasheet delivers, helping sourcing engineers and PCB designers compare options without manually cross-checking every part number.
Alternatives de remplacement direct pour 10AS066H4F34I3SG — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10AS066H4F34I3SG (même facteur de forme et même empreinte) — différant par Package, Mounting Type, Operating Temperature, Logic Elements, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10AS066H4F34I3LG
✅ Remplacement direct✓ En stock
$3400 / unité
Voir la fiche technique →10AS066H4F34E3SG
✅ Remplacement direct✓ En stock
$1920 / unité
Voir la fiche technique →10AS066H4F34E3LG
✅ Remplacement direct✓ En stock
$2419.49 / unité
Voir la fiche technique →10AS066H4F34I4SGES
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
10AS066H3F34I2SG
✅ Remplacement direct✓ En stock
$3200 / unité
Voir la fiche technique →XC7Z100-2FFG1156
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
10AS066H4F34I3SG Valeurs maximales et caractéristiques électriques
| Manufacturer | Intel (formerly Altera) |
| Series | Arria 10 SX |
| Logic Elements | 660,000 |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Processor Cores | Dual ARM Cortex-A9 MPCore with CoreSight |
| Hard Processor System Clock | 1.5 GHz |
| Boîtier | 1152-ball FCBGA (35 mm x 35 mm) |
| User I/Os | 492 |
| Température de fonctionnement | Industrial (-40 C to +100 C) |
| Type de montage | Surface Mount |
| Device Family Tier | H4 (high-performance, mid-density, enhanced DSP and transceiver) |
| Hard Memory Controllers | Yes (DDR3/DDR4 with ECC) |
| Transceivers | 28 nm multi-gigabit transceivers |
| Design Tool | Intel Quartus Prime |
| RoHS | Compliant |
Guide de configuration des broches du 10AS066H4F34I3SG 1152-ball fcbga (35 mm x 35 mm)
Configuration des broches du 10AS066H4F34I3SG (boîtier 1152-ball fcbga (35 mm x 35 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour 10AS066H4F34I3SG.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
10AS066H4F34I3SG convient pour 6 applications: 4K Video Processing and Broadcast, Wireless Baseband and Backhaul, Industrial Machine Vision, Defense and Avionics Signal Processing, Medical Imaging and Diagnostics, High-Performance Computing Acceleration.
4K Video Processing and Broadcast
The 10AS066H4F34I3SG is well suited to 4K video broadcast pipelines because its 660,000 logic elements and hardened DSP blocks can absorb real-time HEVC/H.264 encode-decode, color space conversion, frame-rate conversion, and deinterlacing workloads. The integrated dual-core ARM Cortex-A9 hard processor system at 1.5 GHz handles transport stream muxing, encryption, and ancillary data processing without burdening the FPGA fabric. The 1152-FCBGA package exposes up to 492 user I/Os and multiple multi-gigabit transceivers, enabling direct interfacing to SDI, HDMI, and 10G Ethernet reference designs. Compared with discrete FPGA + ASSP solutions, the SoC integration reduces board area and inter-chip latency.
Recommandé
Wireless Baseband and Backhaul
The 10AS066H4F34I3SG targets wireless baseband and backhaul designs where the FPGA fabric accelerates FFT/iFFT, channel coding, and crest-factor reduction while the dual ARM Cortex-A9 MPCore runs MAC/PHY scheduling and Linux networking stacks. The 20 nm process and 28 nm transceivers deliver the timing margin required for CPRI/OBSAI fronthaul and 10G/40G Ethernet aggregation. Industrial temperature grade enables deployment in outdoor and sealed enclosures used by mobile network operators. The SoC architecture reduces system bill of materials by combining a control-plane processor and high-throughput DSP accelerator into a single 1152-FCBGA package.
Recommandé
Industrial Machine Vision
The 10AS066H4F34I3SG is a good fit for industrial machine vision systems that combine high-speed image preprocessing with a Linux-class control plane. The FPGA fabric implements Bayer demosaicing, lens distortion correction, and real-time defect detection at line-scan or area-scan sensor rates, while the hard ARM Cortex-A9 subsystem runs the vision application stack over CoaXPress, Camera Link, or GigE Vision interfaces. The 492 user I/Os allow direct connection to multiple parallel image sensors and motor-control feedback paths. Industrial temperature grade (-40 C to +100 C) and long-life Intel Altera support make this part appropriate for factory-floor deployments.
Recommandé
Defense and Avionics Signal Processing
The 10AS066H4F34I3SG's 660K logic elements and hardened DSP blocks support radar, electronic-warfare, and signal-intelligence front-end processing where deterministic latency and high throughput are mandatory. The integrated ARM Cortex-A9 subsystem handles control-plane command parsing, health monitoring, and secure boot, while the FPGA fabric implements matched filters, beamforming, and pulse compression. The Arria 10 SX family supports anti-tamper and design-security features that defense integrators require. Operating from -40 C to +100 C industrial temperature, this part meets typical avionic environmental requirements when paired with a thermally engineered enclosure.
Recommandé
Medical Imaging and Diagnostics
The 10AS066H4F34I3SG fits medical imaging applications such as ultrasound beamforming, CT reconstruction back-ends, and digital X-ray pre-processors. Its 660K logic elements and DSP blocks implement parallel beamforming and filter-back-projection pipelines at clinical frame rates, while the hard ARM Cortex-A9 double-precision floating-point capable cores run image reconstruction, DICOM stack, and user interfaces. The SoC FPGA reduces the bill of materials compared to a discrete FPGA + external processor approach, important for medical device miniaturization. Industrial temperature grade and lead-free packaging satisfy regulatory requirements for medical equipment.
Recommandé
High-Performance Computing Acceleration
The 10AS066H4F34I3SG serves as a co-processor for high-performance compute appliances where PCIe Gen2/Gen3 connectivity and high-density FPGA acceleration are required. The dual-core ARM Cortex-A9 controls DMA, command queuing, and host communication via PCIe, while the FPGA fabric implements custom compute kernels such as financial Monte Carlo simulations, genomic alignment, or scientific FFTs. The 1152-FCBGA package enables routing of multi-gigabit transceivers for low-latency inter-card links inside accelerator chassis. The industrial operating temperature allows deployment in space-constrained edge-compute cabinets.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10AS066H4F34I3SG — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10AS066H4F34I3LG | 10AS066H4F34E3SG | 10AS066H4F34E3LG | 10AS066H4F34I4SGES | 10AS066H3F34I2SG | XC7Z100-2FFG1156 |
|---|---|---|---|---|---|---|---|
| Package | 1152-FCBGA (35x35) | 1152-FCBGA (35x35) - same | 1152-FCBGA (35x35) - same | 1152-FCBGA (35x35) - same | 1152-FCBGA (35x35) - same | 1152-FCBGA (35x35) - same | 1156-FCBGA (35x35 class) - close but ball map differs |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | AMD (Xilinx) |
| Logic Elements | 660,000 | 660,000 | 660,000 | 660,000 | 660,000 | 660,000 | 444,000 |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 28 nm |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 1.0 V |
| HPS Clock | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | ~1 GHz |
| Speed / Temperature Grade | I3 (industrial) | I3L (industrial, lower power) | E3 (extended) | E3L (extended, lower power) | I4 (industrial, faster, ES) | I2 (industrial, slower) | Speed grade -2 industrial |
| User I/Os | 492 | 492 | 492 | 492 | 492 | 492 | 362 |
Principaux différenciateurs
- Highest-density Arria 10 SX with I3 speed grade in this footprint (vs 10AS066H3F34I2SG)
- Integrated dual-core ARM Cortex-A9 hard processor system (vs XC7Z100-2FFG1156)
- RoHS-compliant industrial temperature grade F34 package (vs 10AS066H4F34I4SGES)
Notes de conception
The 10AS066H4F34I3SG requires at least five separate supply rails: 0.9 V core (VCC, VCCP), 1.8 V/2.5 V/3.3 V auxiliary (VCCIO), dedicated transceiver supply (VCCR/VCCT), and a 1.8 V/3.3 V HPS supply. Estimated: with all logic and transceivers active, total board-level power can reach 20-25 W; the VCC core rail alone can demand 15 A under full utilization. Use a multi-phase controller with output inductors selected to keep ripple under 2% of the rail, and place decoupling capacitors as close as possible to the package balls.
The 1152-FCBGA package requires an HDI PCB stack-up with microvias to escape the 0.8 mm or 1.0 mm ball pitch. Designers should target at least 8-12 layers, an ENIG surface finish, and matched-length impedance-controlled traces for the multi-gigabit transceivers. The thermal pad (if present) must be soldered to the PCB using a via-array thermal relief pattern to ensure proper heat extraction from the high-density FPGA fabric.
Always configure unused transceiver channels per the Intel Arria 10 SX pin connection guidelines - floating or improperly terminated transceiver pins cause additional current draw and may corrupt adjacent channels. Decoupling caps must follow the reference design exactly; do not substitute non-recommended capacitors because the FPGA's power supply rejection is sensitive to ESR/ESL values.
Do not assume the HPS bootloader works without a properly programmed QSPI flash - the 10AS066H4F34I3SG expects a valid boot ROM image at POR. Engineers new to the Arria 10 SX often forget that the HPS and FPGA configuration bitstreams are stored separately; plan for both a golden image and a user image in flash to support fail-safe firmware updates.
Informations de conformité
RoHS-compliant per the manufacturer product page. Industrial temperature grade is for -40 C to +100 C junction. AEC-Q100 is not applicable (FPGA, not an automotive discrete).
