10AS066K2F35I2LG - 660K LE, 1.5GHz SoC FPGA | Intel
MPN: 10AS066K2F35I2LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5650.15 | $5,650.15 |
| 10 | $5650.15 | $56,501.50 |
| 100 | $5650.15 | $565,015.00 |
| 500 | $5650.15 | $2,825,075.00 |
| 1,000 | $5650.15 | $5,650,150.00 |
Drop-in alternatives for 10AS066K2F35I2LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →10AS066K2F35I2LG Maximum Ratings & Electrical Characteristics
| Manufacturer | Altera / Intel |
| Product Type | System-on-chip FPGA |
| Family | Arria 10 SX |
| Logic Elements | 660000 logic elements |
| Processor Cores | Dual ARM Cortex-A9 MPCore |
| CoreSight Technology | Included |
| Operating Frequency | 1.5 GHz |
| Package | 1152-ball FCBGA |
| Package Dimensions | 35 mm x 35 mm |
| Terminal Count | 1152 balls |
| Terminal Form | Ball |
| Temperature Grade | Industrial |
| Process Technology | 20 nm |
| Stated Operating Voltage | 0.9 V |
| Logic Element Count | 660K |
| Mounting Type | Surface mount |
| Package Shape | Square |
| Configuration | FPGA and embedded processor SoC |
10AS066K2F35I2LG square Pin Configuration Guide
Complete pinout information for 10AS066K2F35I2LG (square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS066K2F35I2LG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS066K2F35I2LG is suitable for 6 applications: Industrial Automation Controller, Medical Signal-Processing Platform, Communications Infrastructure Equipment, Test and Measurement Instrument, Embedded Vision and Image Processing, Aerospace and UAV Control System.
Industrial Automation Controller
10AS066K2F35I2LG fits industrial automation systems that need both deterministic programmable logic and processor-based control. Its verified 660,000 logic elements support configurable interfaces, sequencing, filtering, and motion or machine-control datapaths, while the dual ARM Cortex-A9 MPCore processors can run supervisory software, communications, diagnostics, and protocol stacks. CoreSight technology supports system-level development and debug. The listed industrial temperature grade makes the device relevant to factory environments, but designers must confirm the exact ambient and junction limits, supported operating modes, and reliability requirements in the official documentation before production release.
Recommended
Medical Signal-Processing Platform
10AS066K2F35I2LG is a potential platform component for medical equipment requiring high-density signal processing and embedded control. The 660,000 logic elements can be configured for acquisition pipelines, filtering, data reduction, and interface logic, while the dual ARM Cortex-A9 MPCore processors can manage device control, data movement, and user-interface functions. The verified 1.5 GHz device description indicates a high-performance SoC positioning. Medical designs also require system-level safety, validation, traceability, and regulatory evidence beyond component specifications; the supplied data does not provide medical certification or functional-safety claims, so those must be confirmed separately.
Recommended
Communications Infrastructure Equipment
10AS066K2F35I2LG can support communications equipment that combines packet processing, protocol handling, and hardware acceleration. Its 660,000 logic elements provide configurable resources for datapaths, framing, buffering control, and interface adaptation, while the dual ARM Cortex-A9 MPCore subsystem can handle control-plane software and system management. CoreSight technology provides a development and trace framework for embedded software. The package is a 1152-ball FCBGA measuring 35 mm by 35 mm, so board implementation must address high-density escape routing, signal integrity, power integrity, and thermal management. Detailed transceiver, memory, and interface resources are not provided and require official datasheet review.
Recommended
Test and Measurement Instrument
10AS066K2F35I2LG suits test and measurement designs that require simultaneous high-speed data handling, configurable measurement logic, and processor-based instrument control. The verified 660,000 logic elements can implement acquisition, triggering, timing, filtering, and data-formatting functions, while the dual ARM Cortex-A9 processors can manage user interfaces, calibration, storage, and communications. CoreSight technology assists embedded software development and diagnostics. The part is listed as an Arria 10 SX SoC FPGA with 1.5 GHz frequency and an industrial temperature grade. Exact analog performance, ADC or DAC integration, I/O standards, memory configuration, and power limits are not included in the supplied data and must be validated.
Recommended
Embedded Vision and Image Processing
10AS066K2F35I2LG can serve as the processing and control centerpiece in an embedded vision system. Its 660,000 logic elements can accelerate image pipelines, sensor-interface adaptation, filtering, region-of-interest operations, and data formatting, while the dual ARM Cortex-A9 MPCore processors can run camera control, protocol management, and application software. The verified 1.5 GHz frequency and SoC architecture support partitioning between parallel hardware and software tasks. Designers must evaluate available memory bandwidth, external memory interfaces, sensor I/O standards, configuration support, and power dissipation from the manufacturer documentation because those values are not present in the supplied search data.
Recommended
Aerospace and UAV Control System
10AS066K2F35I2LG may be evaluated for UAV and aerospace control systems that combine sensor acquisition, control loops, communications, and embedded software. The 660,000 logic elements support configurable control and signal-processing hardware, while the dual ARM Cortex-A9 MPCore processors support supervisory control and application execution. CoreSight technology can assist software debugging and system trace. The verified data identifies an industrial temperature grade and a 1152-ball FCBGA package, but it does not establish aerospace qualification, radiation performance, reliability data, or mission-profile support. Those requirements require qualification evidence and exact manufacturer documentation; the part should not be selected from package capacity alone.
Recommended
Recommended Products Summary
Engineering reference data for 10AS066K2F35I2LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS066K2F35E2SG | 10AS066K2F35E2LG | 10AS066K2F35E1HG | 10AS066K1F35I1HG | 10AS066H4F34I3SG |
|---|---|---|---|---|---|---|
| Brand | Altera / Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-ball FCBGA, 35 mm x 35 mm | 1152-ball FCBGA | 1152-ball FCBGA | 1152-ball FCBGA | 1152-ball FCBGA | 1152-ball FCBGA |
| Logic Elements | 660000 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Processor Subsystem | Dual ARM Cortex-A9 MPCore | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Operating Frequency | 1.5 GHz | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Temperature Grade | Industrial | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Process Technology | 20 nm | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Stated Operating Voltage | 0.9 V | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Terminal Count | 1152 balls | 1152 | 1152 | 1152 | 1152 | 1152 |
| Terminal Form | Ball | Ball | Ball | Ball | Ball | Ball |
Key Differentiators
- Integrated dual ARM Cortex-A9 MPCore processing with FPGA fabric (vs 10AS066K2F35E2SG)
- Industrial temperature-grade identification (vs 10AS066K2F35E2LG)
- High-density 1152-ball FCBGA implementation (vs 10AS066H4F34I3SG)
Design Notes
The verified package is a 1152-ball FCBGA measuring 35 mm by 35 mm. Before schematic release, obtain the official land pattern, ball map, via recommendations, escape-routing guidance, and manufacturing rules for 10AS066K2F35I2LG. Do not derive a footprint from a generic BGA library. Confirm whether the selected PCB stack-up supports the required ball pitch, dogbone or via-in-pad construction, via reliability, plane transitions, and impedance targets for the actual I/O implementation.
The provided data states 0.9 V for one part listing, but it does not provide the complete power-supply table, current requirements, ramp sequence, tolerance, or power-up behavior for 10AS066K2F35I2LG. Treat 0.9 V as an unconfirmed single-source descriptor, not a complete design value. Use the manufacturer documentation to define rail voltages, sequencing, decoupling, transient response, and brownout handling. Keep high-frequency decoupling close to the relevant power balls and use verified plane and via structures for the 1152-ball package.
Although the source data identifies an industrial temperature grade, it does not provide junction-temperature limits, thermal resistance, allowable power, airflow conditions, or derating curves. Thermal analysis must therefore use the official device data and the board-level environment. Estimate only after obtaining power dissipation and package thermal models, then correlate the model with the assembled PCB, enclosure, neighboring components, airflow, and expected worst-case ambient. Do not infer reliability from the industrial label alone.
Plan the board implementation around both the 1152-ball package and the exact I/O bank assignments. Separate high-speed or noisy interfaces from sensitive clocks and processor-related signals, maintain continuous reference planes, and use short controlled-impedance routes where the design requires them. Configuration, reset, clock, and debug connections should be assigned according to the exact manufacturer ball map. Because the supplied data does not include the complete pinout or I/O bank table, those details are marked as data needed.
A common integration mistake is to treat 10AS066K2F35I2LG as a generic 660,000-logic-element FPGA without validating configuration, software, processor, memory, and power requirements. The ordering code, package, temperature designation, and 1.5 GHz descriptor must all be checked against the official ordering table. Do not assume that a related 10AS066 family code is a drop-in replacement, and do not use a 1152-ball package description as a substitute for the exact ball-out or land pattern.
Compliance Information
The verified search results identify the manufacturer ordering page and describe the part as an Altera or Intel programmable logic device, but they do not provide verified RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals declarations. Compliance values are therefore unknown. AEC-Q100 is not applicable to the provided data only as a classification placeholder; qualification is not established.
