10AX090N3F40I2SG - Arria 10 GX FPGA 900K LE, 1517-FCBGA | Intel
Référence : 10AX090N3F40I2SG ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $2850 | $2 850,00 |
| 10 | $2720 | $27 200,00 |
| 100 | $2580 | $258 000,00 |
| 500 | $2410 | $1 205 000,00 |
| 1 000 | $2250 | $2 250 000,00 |
10AX090N3F40I2SG Présentation
A Field-Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks, programmable interconnects, dedicated DSP slices, embedded memory blocks, and high-speed serial transceivers. FPGAs belong to the broader category of programmable logic devices, sitting alongside CPLDs in the digital semiconductor taxonomy and offering ASIC-like computational density with the flexibility of in-field reconfiguration. Arria 10 GX devices specifically target applications that demand multi-gigabit serial connectivity and high DSP throughput.
Key features of the 10AX090N3F40I2SG include up to 24.0 Gbps transceiver data rates, hard PCI Express Gen3 controllers, hardened memory controllers supporting DDR4 and QDR-IV, and a hard floating-point DSP block architecture. The Arria 10 architecture integrates partial reconfiguration support, allowing portions of the fabric to be reprogrammed while other regions continue operating, which is valuable for high-availability systems and adaptive compute workloads.
Typical applications include high-performance digital signal processing for radar and beamforming, 100G/400G wire-speed networking line cards, high-frame-rate video broadcast processing, 5G baseband and fronthaul, and ASIC prototyping where high logic density and embedded transceivers accelerate bring-up. The integrated transceivers and hardened IP blocks reduce external component count and BOM cost in latency-critical designs.
When designing with this device, ensure that PCB layout meets Intel's transceiver signal-integrity guidelines, including controlled-impedance routing, AC-coupling capacitor placement, and reference-clock jitter performance. Power delivery must use a sequenced multi-rail architecture with proper decoupling near each supply pin. Designers should also validate thermal solution adequacy at the worst-case junction temperature of 100C for industrial-grade silicon.
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Alternatives de remplacement direct pour 10AX090N3F40I2SG — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10AX090N3F40I2SG (même facteur de forme et même empreinte) — différant par Package, Transceivers, Process Technology, DSP Blocks, Hard Memory Controllers.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10AX090N3F40I2LG
✅ Remplacement direct✓ En stock
$9800 / unité
Voir la fiche technique →10AX090N3F40E2LG
✅ Remplacement direct✓ En stock
$2280 / unité
Voir la fiche technique →10AX090N2F40I2SG
✅ Remplacement direct✓ En stock
$6185 / unité
Voir la fiche technique →10AX090N2F40I2LG
✅ Remplacement direct✓ En stock
$6903.28 / unité
Voir la fiche technique →10AX090N2F40I1SG
✅ Remplacement direct✓ En stock
$2985 / unité
Voir la fiche technique →10AX090N3F40I2SG Valeurs maximales et caractéristiques électriques
| Family | Arria 10 GX |
| Logic Elements (LE) | 900,000 |
| Embedded Memory (bits) | 59,234,304 |
| Number of LABs/CLBs | 339,620 |
| Number of User I/Os | 600 |
| Boîtier | 1517-BBGA, FCBGA (F40) |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Speed Grade | N3 |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Type de montage | Surface Mount |
| Niveau MSL | 3 (168 Hours) |
| Moisture Sensitivity | MSL3 |
| Packaging | Tray |
| Statut RoHS | Compliant |
Guide de configuration des broches du 10AX090N3F40I2SG 1517-bbga, fcbga (f40)
Configuration des broches du 10AX090N3F40I2SG (boîtier 1517-bbga, fcbga (f40)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour 10AX090N3F40I2SG.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
10AX090N3F40I2SG convient pour 6 applications: 100G/400G Networking Line Cards, 5G Baseband and Fronthaul Processing, Radar and Beamforming Signal Processing, High-Frame-Rate Video Broadcast Processing, ASIC Prototyping and Emulation, Industrial High-Performance DSP and Test Instrumentation.
100G/400G Networking Line Cards
The 10AX090N3F40I2SG fits 100G and 400G wire-speed networking line cards because its 900K logic elements and embedded multi-gigabit transceivers provide the parallel processing bandwidth required for MAC-to-transceiver bridging, packet classification, and traffic shaping. The hard PCI Express Gen3 controllers enable direct host-side connectivity, while the 600 user I/Os support dense external memory interfaces for packet buffers. Designers place the FPGA between QSFP28/QSFP-DD cages and the host CPU, leveraging partial reconfiguration to swap in different protocol stacks without power-cycling the line card.
Recommandé
5G Baseband and Fronthaul Processing
The 10AX090N3F40I2SG is well-suited for 5G baseband and fronthaul units where high DSP density and low-latency serial I/O matter. Its hard floating-point DSP blocks accelerate FFT/IFFT, channel estimation, and beamforming math, while the integrated transceivers connect directly to CPRI/eCPRI radio units. The industrial -40C to +100C temperature rating supports outdoor or hardened base-station deployments. Power sequencing and thermal design must follow Intel's transceiver signal-integrity guidelines for reliable 12.5 Gbps+ links.
Recommandé
Radar and Beamforming Signal Processing
The 10AX090N3F40I2SG suits phased-array radar and acoustic beamforming where hundreds of DSP operations must execute per antenna sample. Its 900K logic elements and hardened floating-point DSP deliver the throughput needed for adaptive nulling and direction-of-arrival algorithms. The 1517-ball FCBGA package supports the high pin count demanded by multi-element antenna interfaces and high-speed ADC/DAC connections. With the N3 speed grade, designers close timing on the most aggressive DSP pipelines.
Recommandé
High-Frame-Rate Video Broadcast Processing
The 10AX090N3F40I2SG fits UHD and high-frame-rate video broadcast workflows including 8K signal processing, real-time color grading, and HDR conversion. Its 600 user I/Os support multiple parallel camera or SDI links at full 12G-SDI rates, while the embedded memory bandwidth handles multi-stream pixel processing. The hardened memory controllers can drive external DDR4 frame buffers at full throughput. Designers implement color-space conversion and scaling directly in FPGA fabric to offload host CPU cycles.
Recommandé
ASIC Prototyping and Emulation
The 10AX090N3F40I2SG serves as an ASIC prototyping vehicle where 900K logic elements accommodate large SoC designs partitioned across multiple FPGAs. Its embedded transceivers simplify chip-to-chip bridging in multi-FPGA prototype boards, while the high I/O count enables rapid bring-up of test interfaces. The N3 speed grade provides realistic timing margin studies before tape-out. The industrial temperature rating also supports validation under extended environmental stress tests.
Recommandé
Industrial High-Performance DSP and Test Instrumentation
The 10AX090N3F40I2SG is appropriate for industrial test and measurement platforms where real-time signal processing on high-bandwidth analog front-ends is required. Its hardened floating-point DSP supports FFT-based spectrum analysis, and the embedded transceivers handle ADC-to-FPGA JESD204B/C link connectivity at multi-gigabit rates. The industrial temperature rating ensures operation in factory-floor enclosures. Designers integrate custom measurement IP alongside vendor soft cores to shorten time-to-market.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10AX090N3F40I2SG — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10AX090N3F40I2LG | 10AX090N3F40E2LG | 10AX090N2F40I2SG | 10AX090N2F40I2LG | 10AX090N2F40I1SG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-BBGA, FCBGA (F40) | 1517-BBGA, FCBGA (F40) - same | 1517-BBGA, FCBGA (F40) - same | 1517-BBGA, FCBGA (F40) - same | 1517-BBGA, FCBGA (F40) - same | 1517-BBGA, FCBGA (F40) - same |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 |
| Speed Grade | N3 | N3 | N3 | N2 | N2 | N2 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Extended (0C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Embedded Memory (Mbits) | 59.2 Mbit | 59.2 Mbit | 59.2 Mbit | 59.2 Mbit | 59.2 Mbit | 59.2 Mbit |
| User I/Os | 600 | 600 | 600 | 600 | 600 | 600 |
| Lead-Free Reflow Variant | Standard | Yes (lead-free) | Yes (lead-free) | Standard | Yes (lead-free) | Standard |
Principaux différenciateurs
- Highest-density Arria 10 GX with N3 speed grade (vs 10AX090N2F40I2SG)
- Industrial temperature rating (vs 10AX090N3F40E2SG)
- Pin-compatible with full Arria 10 GX F40 family (vs 10AX066H3F34E2SG)
Notes de conception
Estimated: Arria 10 FPGAs in 1517-ball FCBGA packages can dissipate 15-25W at full transceiver and DSP utilization. With a typical theta_JA around 8-12 C/W (depending on PCB copper and airflow), a heatsink with thermal interface material is mandatory for industrial-grade operation at +100C junction. Designers should perform thermal simulation under worst-case traffic patterns, not just steady-state idle.
The 1517-ball FCBGA F40 package demands a high-density PCB stackup with microvia or via-in-pad technology. Decoupling must include a 1uF and a 0.1uF capacitor pair per supply pin within 5mm of the ball. Transceiver reference clocks require impedance-controlled routing and tight jitter budgets; place AC-coupling capacitors within 500 mils of the device ball.
Do not mix transceiver reference voltages between banks without consulting Intel's Arria 10 device handbook. Incorrect pin assignments for JTAG, MSEL, or configuration pins can prevent the device from booting. Always validate the Quartus Prime pin-out file against the F40 package ball-map before tape-out. Industrial-grade silicon has tighter timing derating than commercial-grade.
Informations de conformité
RoHS compliance per Altera/Intel product page; this is an FPGA, so AEC-Q100 automotive qualification is not applicable. Lead-free reflow is supported; lead-free variant 10AX090N3F40I2LG available for higher reflow-temperature compatibility.