10AX090R3F40I2SG - Arria 10 GX FPGA 900K LE 1517-FCBGA | Intel
Référence : 10AX090R3F40I2SG ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $6889.94 | $6 889,94 |
| 10 | $6200.95 | $62 009,50 |
| 100 | $5511.95 | $551 195,00 |
| 500 | $4822.96 | $2 411 480,00 |
| 1 000 | $4133.96 | $4 133 960,00 |
10AX090R3F40I2SG Présentation
A Field-Programmable Gate Array (FPGA) is a semiconductor IC whose logic fabric, routing, and I/O behavior are configured by the user after manufacture. FPGAs sit at the intersection of ASIC-grade performance and software-like programmability, bridging general-purpose microcontrollers and custom silicon. Arria 10 GX parts specifically target mid-range, transceiver-rich applications - between Intel Cyclone (low-cost) and Intel Stratix (high-performance) families - and are widely deployed in wireless, broadcast, military, and high-performance computing.
Key features of the 10AX090 device include 342 user I/O pins, dedicated hardware DSP blocks for fixed- and floating-point arithmetic, on-chip transceivers with adaptive equalization, and hard memory controllers for DDR3/DDR4. The -3 speed grade offers the highest transceiver toggle and core performance within the Arria 10 family, while the industrial temperature rating supports operation from -40C to +100C ambient. The FCBGA package integrates a high-density ball grid that enables 96 transceiver channels plus parallel I/O on a single substrate.
The Arria 10 architecture combines a logic fabric, M20K memory blocks, MLAB logic arrays, variable-precision DSP, and hardened IP for PCIe Gen3, 10GbE MAC, and external memory interfaces. This integration lets designers reduce BOM cost and PCB area by replacing multiple discrete ASSPs with a single programmable device. Quartus Prime software provides synthesis, place-and-route, and timing closure.
Typical applications include 4K video processing and broadcast encoders, software-defined radio platforms, PCIe accelerator cards, test and measurement instrumentation, military radar and electronic warfare, and 100G line-card prototyping. Designers leverage the parallel DSP throughput for FIR filtering and FFT acceleration, while the transceiver lanes handle high-speed serial links.
Key design considerations include power budgeting - thermal dissipation at full transceiver utilization often requires a heatsink or chassis airflow - and signal-integrity care for the 1517-ball FCBGA escape routing. Use Intel's Arria 10 transceiver toolkits and reference designs to validate channel performance before committing to layout.
This page synthesizes distributor pricing, drop-in Arria 10 alternatives within the same F40 FCBGA footprint, and PCB-layout guidance not duplicated in the Altera/Intel datasheet.
Alternatives de remplacement direct pour 10AX090R3F40I2SG — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10AX090R3F40I2SG (même facteur de forme et même empreinte) — différant par Package, Process Technology, Core Voltage, Operating Temperature, Temperature Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10AX090R3F40I2LG
✅ Remplacement direct✓ En stock
$3640 / unité
Voir la fiche technique →10AX090R3F40E2SG
✅ Remplacement direct✓ En stock
$5400 / unité
Voir la fiche technique →10AX090R2F40I2SG
✅ Remplacement direct✓ En stock
$6290.55 / unité
Voir la fiche technique →10AX090R2F40I2LG
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →10AX090R1F40I1SG
✅ Remplacement direct✓ En stock
$3783 / unité
Voir la fiche technique →10AX090R3F40I2SG Valeurs maximales et caractéristiques électriques
| Family | Arria 10 GX |
| Logic Elements (LE) | 900,000 |
| Embedded Memory (bits) | 59,234,304 |
| Process Technology | 20 nm TSMC |
| User I/O Count | 342 |
| Boîtier | 1517-BBGA, FCBGA (F40), 40 x 40 mm |
| Speed Grade | -3 |
| Temperature Grade | Industrial (I) |
| Statut RoHS | Compliant |
| Type de montage | Surface Mount |
| Supply Voltage (Core) | 0.9 V |
| Température de fonctionnement | -40C to +100C |
Guide de configuration des broches du 10AX090R3F40I2SG 1517-bbga, fcbga (f40), 40 x 40 mm
Configuration des broches du 10AX090R3F40I2SG (boîtier 1517-bbga, fcbga (f40), 40 x 40 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour 10AX090R3F40I2SG.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
10AX090R3F40I2SG convient pour 6 applications: 4K Video Processing and Broadcast Encoder, Software-Defined Radio Platform, PCIe Gen3 Accelerator Card, Test and Measurement Instrumentation, Military Radar and Electronic Warfare, 100G Line-Card Prototyping and MAC Aggregation.
4K Video Processing and Broadcast Encoder
The 10AX090R3F40I2SG's 900,000 logic elements and 59.2 Mbits of embedded memory make it ideal for 4K video processing and broadcast encoder pipelines where multi-stream parallel processing is required. The -3 speed grade supports the high clock rates needed for real-time HEVC/H.264 encoding, while the Arria 10 GX transceiver fabric enables SDI, HDMI 2.0, and 12G-SDI I/O without external ASSPs. Designers typically instantiate multiple encoder cores plus color-space conversion blocks; the 1517-ball FCBGA F40 package delivers 342 user I/O for parallel video data paths and GPIO expansion. A typical 4K mezzanine card uses 60-70% of logic and 50% of transceivers, leaving headroom for run-time reconfigurable overlays.
Recommandé
Software-Defined Radio Platform
For software-defined radio (SDR) platforms, the 10AX090R3F40I2SG delivers the DSP throughput and transceiver density required for multi-channel wideband baseband processing. The device's variable-precision DSP blocks implement parallel FIR filtering and FFT cores directly in fabric, while the Arria 10 GX transceivers handle ADC/DAC JESD204B/C links and antenna data aggregation. With 900K LE available, designers can run multiple concurrent channels at rates up to 245.76 Msps in LTE or 5G NR configurations. The industrial temperature grade supports outdoor base-station deployments where ambient swings exceed commercial limits.
Recommandé
PCIe Gen3 Accelerator Card
The 10AX090R3F40I2SG is a strong fit for PCIe Gen3 accelerator cards that need both hard IP for PCIe and abundant programmable fabric for custom compute kernels. Intel integrates hardened PCIe Gen3 controllers in Arria 10 GX, eliminating soft-IP timing risks while the 900K LE budget supports HLS-generated compute pipelines such as cryptography, compression, or ML inference. The transceiver count accommodates x8 Gen3 plus sideband SERDES for multi-card scaling. The FCBGA F40 footprint is compatible with standard PCIe card mechanical envelopes when paired with the appropriate heatsink and airflow.
Recommandé
Test and Measurement Instrumentation
Test and measurement instruments - logic analyzers, protocol testers, arbitrary waveform generators - benefit from the 10AX090R3F40I2SG's combination of high logic density, abundant transceivers, and ample M20K memory for deep capture buffers. Industrial temperature rating suits production-floor burn-in racks, while the -3 speed grade enables fast acquisition rates and real-time protocol decoding. Designers leverage the FPGA's parallelism to implement multi-channel pattern generation and error detection simultaneously. The 1517-FCBGA package's 342 user I/O support wide LVDS banks and parallel ADCs/DACs without external muxes.
Recommandé
Military Radar and Electronic Warfare
Defense radar and electronic-warfare systems rely on the 10AX090R3F40I2SG for its high logic capacity, hardened transceivers, and industrial temperature rating that survives harsh airborne and shipboard environments. The device hosts digital beamforming, pulse compression, and adaptive filtering at multi-GHz effective sample rates. Its DDR3/DDR4 hard memory controllers feed beamforming memory matrices at line-rate, while the high pin count supports parallel RF ADC/DAC interfaces. The industrial temperature grade combined with Intel's reliability data suits mission-critical defense platforms.
Recommandé
100G Line-Card Prototyping and MAC Aggregation
The 10AX090R3F40I2SG enables prototyping of 100G Ethernet line cards where transceiver density and parallel MAC processing must coexist. Arria 10 GX devices deliver multiple 10/25 Gbps channels simultaneously, and the 900K LE budget absorbs full soft-MAC implementations plus classification, policing, and oversubscription logic. Combined with 59 Mbits of embedded RAM for packet buffering, the device can act as a single-chip 100G aggregation block. Designers move from prototype to production on the same footprint, shortening NPI cycles.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10AX090R3F40I2SG — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10AX090R3F40I2LG | 10AX090R3F40E2SG | 10AX090R2F40I2SG | 10AX090R2F40I2LG | 10AX090R1F40I1SG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-BBGA, FCBGA (F40) 40x40 mm | 1517-BBGA, FCBGA (F40) - same | 1517-BBGA, FCBGA (F40) - same | 1517-BBGA, FCBGA (F40) - same | 1517-BBGA, FCBGA (F40) - same | 1517-BBGA, FCBGA (F40) - same |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 |
| Embedded Memory (Mbits) | 59.23 | 59.23 | 59.23 | 59.23 | 59.23 | 59.23 |
| Speed Grade | -3 | -3 | -3 | -2 | -2 | -1 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Extended (-40C to +125C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Ball Finish | Lead-free (RoHS) | Leaded (SnPb) | Lead-free (RoHS) | Lead-free (RoHS) | Leaded (SnPb) | Lead-free (RoHS) |
| User I/O | 342 | 342 | 342 | 342 | 342 | 342 |
Principaux différenciateurs
- Highest-density Arria 10 GX in a single package (vs 10AX066N3F40I2SG)
- -3 speed grade delivers highest Fmax within Arria 10 family (vs 10AX090R2F40I2SG)
- Industrial temperature rating vs commercial (vs 10AX090R3F40C2SG (commercial variant))
Notes de conception
Estimated: at full transceiver utilization the 10AX090R3F40I2SG can dissipate 15-25 W depending on toggle rate. Use a thermal interface material (TIM) and a heatsink with at least 1 C/W thermal resistance, or design chassis airflow of 200 LFM minimum. Junction temperature must stay below 100C for the I2 industrial rating; derate from 125C maximum to 100C by budgeting 25C margin. Arria 10 GX thermal models are available in Intel's thermal advisor tool within Quartus Prime.
The 1517-ball FCBGA F40 package requires a 12+ layer PCB stack-up with 1 oz copper on outer layers and 0.5 oz on inner layers, microvia-in-pad for the inner-row ball escape, and matched impedance (100 ohm differential for transceivers, 50 ohm SE for general I/O). Use Intel's pin-out files (.pin) to verify the exact ball map for the 10AX090 variant. Decoupling: place 0.1 uF and 10 uF capacitors on every VCC/VCCIO/GND pair within 100 mil of the ball.
Arria 10 GX transceivers require matched-length routing within 0.127 mm (5 mil) tolerance for the longest/shortest trace pair to keep intra-pair skew below 0.15 UI at 10.3125 Gbps. Reference Intel's Arria 10 Transceiver Layout Guide (UG-1034) for via pattern, AC coupling capacitor placement, and PCB material recommendations. Use the Quartus Prime Transceiver Toolkit to validate link BER after layout.
Common pitfalls: (1) using a -2 speed grade part when the design needs -3 timing, causing hold-time violations at high transceiver rates; (2) missing the configuration mode pins (MSEL) selection resistor network, which causes configuration failure on power-up; (3) ignoring the POR (power-on reset) delay and not sequencing the 0.9 V core before the 1.8 V/2.5 V/3.3 V rails; (4) not programming the AS configuration device properly, leaving the FPGA in JTAG fallback.
Use the Intel PowerPlay Early Power Estimator (EPE) spreadsheet before PCB layout to budget regulator sizing. The 10AX090R3F40I2SG typically needs a 0.9 V core regulator rated 15-25 A, plus VCCIO and VCCR/VCCP rails for transceivers. Add a sequencer IC such as the LTC2977 or use FPGA-controlled rails. Validate that the inrush current of all rails combined does not exceed the bulk capacitor bank's ESR budget at startup.
Informations de conformité
RoHS compliance per the G-suffix in the Altera OPN decoder (lead-free). Industrial temperature rating is per the I2 suffix. AEC-Q100 does not apply (FPGA is not an automotive-qualified part per Altera/Intel catalog).
