10AX090R3F40I2LG - Arria 10 GX FPGA, 900K LE, 1517-BGA | Intel
MPN: 10AX090R3F40I2LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4850 | $4,850.00 |
| 10 | $4520 | $45,200.00 |
| 100 | $4180 | $418,000.00 |
| 500 | $3895 | $1,947,500.00 |
| 1,000 | $3640 | $3,640,000.00 |
Drop-in alternatives for 10AX090R3F40I2LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10AX090R3F40E2LG
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$5750 / Unit
View Datasheet →10AX090R2F40I2LG
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View Datasheet →10AX090R3F40E2SG
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$5400 / Unit
View Datasheet →10AX090R2F40I2SG
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View Datasheet →10AX090R2F40I1SG
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View Datasheet →10AX090R3F40I2LG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Logic Elements (LE) | 900,000 |
| Embedded Block RAM (M20K) | 24.33 Mbit |
| Transceivers | 24 channels |
| Max Transceiver Data Rate | 17.4 Gbps |
| Hard Processor System | Not integrated (FPGA only) |
| PCI Express Hard IP | Gen3 hard IP |
| External Memory Interface | DDR4 / DDR3 / QDRIV / RLDRAM3 |
| Process Technology | 20 nm |
| Package | 1517-BBGA, FCBGA (F40) |
| Operating Temperature | -40C to +100C (Industrial) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
10AX090R3F40I2LG 1517-bbga, fcbga (f40) Pin Configuration Guide
Complete pinout information for 10AX090R3F40I2LG (1517-bbga, fcbga (f40) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX090R3F40I2LG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX090R3F40I2LG is suitable for 6 applications: Wireless Baseband Processing, Radar Signal Processing, Medical Imaging Accelerator, High-Speed Test and Measurement, Broadcast Video Processing, ASIC Prototyping and Emulation.
Wireless Baseband Processing
The 10AX090R3F40I2LG suits wireless baseband processing where 24 transceiver channels at 17.4 Gbps enable CPRI/OBSAI fronthaul, JESD204B/C links to RF ADCs and DACs, and 10G Ethernet backhaul. With 900K logic elements and hardened floating-point IEEE 754 single-precision DSP, the device performs FFT/iFFT, channel estimation, and beamforming weights on antenna arrays in 4G/5G base stations. The Arria 10 GX family's hard PCIe Gen3 IP blocks accelerate coprocessor links to host processors.
Recommended
Radar Signal Processing
In phased-array and synthetic-aperture radar systems, the 10AX090R3F40I2LG processes multi-channel ADC data through 900K logic elements and hardened single-precision floating-point DSP. The 24 embedded transceivers at 17.4 Gbps aggregate digitized antenna streams from high-speed JESD204B ADCs, while the industrial -40C to +100C temperature grade supports outdoor airborne and naval radar enclosures. Hardened memory controllers interface directly to DDR4 sample buffers.
Recommended
Medical Imaging Accelerator
CT, MRI, and ultrasound imaging systems benefit from the 10AX090R3F40I2LG's 24.33 Mbit embedded block RAM and variable-precision DSP blocks performing real-time image reconstruction, beamforming, and FIR convolution. The PCI Express Gen3 hard IP links to host CPUs for system-level data flow, while the 17.4 Gbps transceivers interface to high-resolution analog front ends. Industrial temperature grading allows deployment in clinical imaging carts and ruggedized field equipment.
Recommended
High-Speed Test and Measurement
Automated test equipment and protocol analyzers use the 10AX090R3F40I2LG to capture, generate, and analyze multi-gigabit serial traffic via its 24 transceivers at 17.4 Gbps. The 900K logic elements implement custom protocol decode, BERT pattern generation, and real-time analytics, while the PCI Express Gen3 hard IP provides the host interface for high-volume data upload. Hardened DDR4 controllers buffer captured traces before offload.
Recommended
Broadcast Video Processing
Broadcast studios deploy the 10AX090R3F40I2LG for 4K/UHD video format conversion, frame-rate conversion, and IP-based SDI/2022-6/2110 transport over 10G/25G Ethernet using the 17.4 Gbps transceivers. The 900K logic elements and abundant DSP support real-time HDR/Dolby Vision LUT transforms, while the embedded block RAM stores multiple reference frames for temporal noise reduction. PCI Express Gen3 hard IP links to host video processing servers.
Recommended
ASIC Prototyping and Emulation
Semiconductor design teams use multi-board 10AX090R3F40I2LG systems to prototype and validate large ASIC/SoC designs before tape-out. The 900K logic elements provide high gate-count capacity per device, while 24 transceivers at 17.4 Gbps enable chip-to-chip and board-to-board high-speed links at near-SoC clock rates. Industrial temperature grading supports accelerated life-test benches in production validation flows.
Recommended
Recommended Products Summary
Engineering reference data for 10AX090R3F40I2LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX090R3F40E2LG | 10AX090R2F40I2LG | 10AX090R3F40E2SG | 10AX090R2F40I2SG | 10AX090R2F40I1SG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-BBGA, FCBGA (F40) | 1517-BBGA, FCBGA (F40) - same | 1517-BBGA, FCBGA (F40) - same | 1517-BBGA, FCBGA (F40) - same | 1517-BBGA, FCBGA (F40) - same | 1517-BBGA, FCBGA (F40) - same |
| Logic Elements | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 | 900,000 |
| Speed Grade | -3 | -3 | -2 | -3 | -2 | -2 |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Transceivers | 24 channels | 24 channels | 24 channels | 24 channels | 24 channels | 24 channels |
| Max Transceiver Rate | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | 17.4 Gbps | lower (transceiver rate class -1) |
| Embedded Block RAM | 24.33 Mbit | 24.33 Mbit | 24.33 Mbit | 24.33 Mbit | 24.33 Mbit | 24.33 Mbit |
| PCIe Hard IP | Gen3 | Gen3 | Gen3 | Gen3 | Gen3 | Gen3 |
Key Differentiators
- Highest-speed transceiver bin available for 10AX090 family (vs 10AX090R2F40I2LG)
- Industrial temperature grading for ruggedized deployments (vs 10AX090R3F40E2LG)
- Full 17.4 Gbps transceiver capability (rate class -3) (vs 10AX090R2F40I1SG)
Design Notes
Estimated: the 10AX090R3F40I2LG in the F40 FCBGA package can dissipate tens of watts under full transceiver plus DSP load. The 1517-ball flip-chip BGA exposes the die directly through the substrate thermal interface, requiring a heatsink with thermal interface material and forced airflow for sustained high-power operation. Theta-JA values for the F40 package require a specific PCB land pattern with adequate copper; refer to the Arria 10 packaging handbook for thermal management guidelines.
The 1517-ball FCBGA requires a high-density multilayer PCB (typically 12+ layers) with microvia or stacked-via construction to fan out the BGA pitch. Use Intel Altera's reference design PCB stackup for the F40 package as a starting point, and follow the Quartus Prime pin planner ball assignments exactly to avoid post-layout routing congestion on transceiver and memory interfaces.
Transceiver channels at 17.4 Gbps demand controlled-impedance routing (typically 100 ohm differential), length matching within tight tolerances (often 5 mil), and continuous reference planes. Series AC-coupling capacitors are required on the transmit side per the Arria 10 GX handbook. Perform IBIS-AMI or HSPICE channel simulation on critical links, especially PCI Express Gen3 and 10G/40G KR Ethernet.
Do not mix voltage rails: the 10AX090R3F40I2LG requires separate rails for core, I/O banks, transceiver PLLs, and auxiliary circuits with strict power-up sequencing per the Arria 10 GX handbook. Hot-socketing configuration pins, JTAG TAP placement, and MSEL configuration mode settings must match the intended bitstream loading scheme; mismatches cause boot failures that are difficult to debug without an Altera USB-Blaster II.
Compliance Information
RoHS compliant per Intel Altera product page. The 'G' suffix in the OPN denotes Pb-free / RoHS-compliant lead finish. Not AEC-Q100 qualified - FPGAs of this class typically target commercial/industrial/military markets rather than automotive. Halogen-free status not explicitly listed in verified data.
