10AX115R2F40I2LG - Arria 10 GX FPGA 1.15M LE FCFBGA-1517 | Intel
Référence : 10AX115R2F40I2LG ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $5200 | $5 200,00 |
| 10 | $4985 | $49 850,00 |
| 100 | $4750 | $475 000,00 |
| 500 | $4525 | $2 262 500,00 |
| 1 000 | $4310 | $4 310 000,00 |
10AX115R2F40I2LG Présentation
An FPGA (Field Programmable Gate Array) is a reconfigurable semiconductor device containing an array of programmable logic blocks, configurable interconnect, and dedicated silicon resources such as transceivers, DSP blocks, and block RAM. FPGAs sit within the broader category of programmable logic devices (PLDs), themselves a sub-class of digital integrated circuits used for high-speed parallel processing, hardware acceleration, and rapid prototyping that ASICs cannot economically match. The Arria 10 family specifically targets mid-range transceiver-rich applications between Cyclone (low cost) and Stratix (maximum performance).
Key features of the 10AX115R2F40I2LG include 1.15M logic elements, 68.86 Mbits of on-site M20K block RAM, integrated 28.05 Gbps transceivers, variable-precision DSP blocks, hard memory controllers, and PCI Express hard IP blocks. The 1517-ball package exposes 24 transceiver channels and supports up to 342 general-purpose I/O running LVDS, LVCMOS, and memory interfaces such as DDR4.
Architecturally, Arria 10 GX combines an adaptive logic module (ALM) fabric with hard IP cores to deliver balanced logic, memory, and serial bandwidth. The 20 nm process and 0.9 V core lower total power versus prior 28 nm Stratix V generations while sustaining comparable throughput, making the part popular for high-throughput wireless, broadcast, and test-and-measurement systems.
Typical applications include 100G/400G optical line cards, wireless baseband and remote-radio-head (RRH) digital front-end processing, military radar and SIGINT, medical imaging accelerators, and high-end ASIC prototyping. The GX transceiver support is particularly valued for backhaul, fronthaul (CPRI/OBSAI), and PCIe Gen3 system integration.
When designing, ensure the 1517-ball FC-FBGA land pattern matches the PCB footprint exactly, route the 0.9 V core and 1.8 V/2.5 V/3.3 V auxiliary supplies per the Intel pin connection guidelines, and respect the transceiver reference-clock jitter budget. Thermal management is critical - the device dissipates substantial power at full transceiver utilization, requiring a heatsink and adequate airflow.
This page synthesizes distributor pricing, drop-in alternatives from the same Arria 10 family, and design guidance not found in the standalone manufacturer datasheet.
Alternatives de remplacement direct pour 10AX115R2F40I2LG — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10AX115R2F40I2LG (même facteur de forme et même empreinte) — différant par Package, DSP Blocks, Temperature Grade, PCIe Hard IP, Family.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10AX115R2F40I1SG
✅ Remplacement direct✓ En stock
$3490 / unité
Voir la fiche technique →10AX115R2F40I2SG
✅ Remplacement direct✓ En stock
$7189.2 / unité
Voir la fiche technique →10AX115R2F40E2LG
✅ Remplacement direct✓ En stock
$10300 / unité
Voir la fiche technique →10AX115R2F40E2SG
✅ Remplacement direct✓ En stock
$5410 / unité
Voir la fiche technique →10AX115R2F40E1SG
✅ Remplacement direct✓ En stock
$6875 / unité
Voir la fiche technique →10AX115R1F40I1SG
✅ Remplacement direct✓ En stock
$7232.71 / unité
Voir la fiche technique →10AX115R2F40I2LG Valeurs maximales et caractéristiques électriques
| Series | Arria 10 GX |
| Family | Intel Arria 10 |
| Logic Elements (LE) | 1,150,000 |
| Embedded Memory Bits | 68,857,856 bits (68.86 Mbit) |
| User I/O Pins | 342 |
| Transceiver Channels | 24 (up to 28.05 Gbps) |
| PCI Express Hard IP | Yes (Gen3 x8 capable) |
| Process Node | 20 nm TSMC |
| Core Voltage | 0.9 V |
| Boîtier | 1517-ball FC-FBGA |
| Package Code | F40 (FCFBGA-1517) |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
Guide de configuration des broches du 10AX115R2F40I2LG f40 (fcfbga-1517)
Configuration des broches du 10AX115R2F40I2LG (boîtier f40 (fcfbga-1517)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour 10AX115R2F40I2LG.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
10AX115R2F40I2LG convient pour 6 applications: 100G/400G Optical Line Card Processing, Wireless Baseband and Fronthaul (RRH) Processing, Military Radar and SIGINT Signal Processing, Medical Imaging Accelerator Boards, ASIC Prototyping and Emulation, Broadcast Video Processing and IP Contribution.
100G/400G Optical Line Card Processing
The 10AX115R2F40I2LG's 24 transceivers at 28.05 Gbps directly support 100G Ethernet and 400G (via bonding) optical line cards. With 1.15M logic elements and 68.86 Mbit of on-chip memory, it absorbs MAC, framer, and forward-error-correction logic without external ASICs. The hard PCIe Gen3 block simplifies backplane interfacing to a switch ASIC, while the FC-FBGA thermal envelope supports sustained line-rate processing.
Recommandé
Wireless Baseband and Fronthaul (RRH) Processing
In 4G LTE and 5G NR remote-radio-head and base-station designs, the 10AX115R2F40I2LG aggregates CPRI/OBSAI links through its 28.05 Gbps transceivers and executes PHY-layer DSP in its variable-precision DSP blocks. The 1.15M logic density supports multi-sector, multi-antenna baseband processing on a single device. Industrial temperature grade (-40C to +100C) handles outdoor cabinet thermal stress in telecom deployments.
Recommandé
Military Radar and SIGINT Signal Processing
The 10AX115R2F40I2LG is widely used in defense electronic-warfare, radar, and SIGINT subsystems where 24 high-speed transceivers capture wideband digitized RF and 1.15M LEs execute pulse-compression, beamforming, and FFT pipelines. Hard memory controllers feed DDR4 buffers, while PCI Express Gen3 links connect to host CPUs. Industrial grade suits ground-mobile platforms; aerospace customers select the -E2 extended grade for higher operating temperature.
Recommandé
Medical Imaging Accelerator Boards
In CT, MRI, ultrasound, and digital X-ray imaging platforms, the 10AX115R2F40I2LG accelerates image reconstruction (back-projection, iterative reconstruction) using its parallel DSP fabric and 68.86 Mbit memory. The PCIe Gen3 hard IP moves reconstructed frames to host processors at line rate. Industrial temperature rating supports operating-room and bedside equipment, and FC-FBGA thermals are well-characterized for fan-cooled medical chassis.
Recommandé
ASIC Prototyping and Emulation
Engineers use the 10AX115R2F40I2LG as an ASIC prototype or pre-silicon emulator given its 1.15M LEs, abundant M20K memory, and high-speed serial links that mirror modern ASIC I/O. Multiple FPGAs can be tiled via transceivers to emulate multi-million-gate ASICs. Quartus Prime synthesis supports ASIC-equivalent coding styles (SystemVerilog, VHDL) and constraint-driven timing closure.
Recommandé
Broadcast Video Processing and IP Contribution
In broadcast studios and IP-based video contribution networks, the 10AX115R2F40I2LG performs HEVC/H.264 encode/decode acceleration, multi-stream transcoding, and SMPTE ST 2110 IP gateway functions. The 28.05 Gbps transceivers carry uncompressed SDI-over-IP and compressed JPEG XS streams, while 342 user I/Os support HDMI/SDI bridge chips. The 1.15M LEs process 4K/UHD with HDR metadata in real time.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10AX115R2F40I2LG — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10AX115R2F40I1SG | 10AX115R2F40I2SG | 10AX115R2F40E2LG | 10AX115R1F40I1SG |
|---|---|---|---|---|---|
| Package | 1517-ball FC-FBGA (F40) | 1517-ball FC-FBGA (F40) - same | 1517-ball FC-FBGA (F40) - same | 1517-ball FC-FBGA (F40) - same | 1517-ball FC-FBGA (F40) - same |
| Brand | Intel (Altera) | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 |
| Embedded Memory | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits |
| User I/O | 342 | 342 | 342 | 342 | 342 |
| Transceiver Count | 24 (up to 28.05 Gbps) | 24 (28.05 Gbps) | 24 (28.05 Gbps) | 24 (28.05 Gbps) | 0 (logic only, no transceivers) |
| Temperature Grade | Industrial -2 (-40C to +100C) | Commercial -1 (0C to +85C) | Industrial -2 (-40C to +100C) | Extended -E2 | Commercial -1 (0C to +85C) |
| Solder Balls | Lead-free (LG) | Lead-free (SG) | SnPb (SG suffix) | Lead-free (LG) | Lead-free (SG) |
Principaux différenciateurs
- 1.15M logic elements with full 24-channel 28.05 Gbps transceiver complement (vs 10AX115R1F40I1SG)
- Industrial -40C to +100C temperature grade (vs 10AX115R2F40I1SG)
- Lead-free solder balls (LG suffix) (vs 10AX115R2F40I2SG)
Notes de conception
The Arria 10 GX 10AX115R2F40I2LG dissipates 15 to 25 W typical and can exceed 35 W with all 24 transceivers active at 28.05 Gbps and high DSP utilization. Use a thermal interface material (TIM) rated for at least 3 W/m-K and a heatsink with a minimum 0.5 C/W thermal resistance; ensure chassis airflow exceeds 200 LFM for industrial temperature operation. Always reference the Intel Arria 10 thermal management guidelines for the F40 package theta_JB and theta_JC values.
The 1517-ball F40 FC-FBGA requires a PCB with microvia build-up (any-layer or stagger via) and a 1.0 mm or finer ball pitch. Route high-speed transceiver differential pairs as 85-ohm or 100-ohm impedance with reference planes unbroken beneath. Place AC-coupling capacitors within 200 mil of the transmitter balls; keep them on the same layer where possible to avoid via stubs that degrade 28 Gbps eye performance.
Power the 0.9 V core rail last in the sequence, after 1.8 V and 2.5 V/3.3 V rails are stable. Use a controller with monotonic rise and Power-On-Reset (POR) sequencing per Intel's recommended start-up profile. Decouple every supply pin with 0.1 uF plus bulk decoupling (typically 10 uF + 22 uF) within 100 mil; provide separate ground return paths for noisy PLL supplies to avoid jitter degradation in transceivers.
Do not assume all Arria 10 F40 packages share a unified pinout - silicon revisions and speed grades can shift transceiver ball mapping. Always verify against the latest Intel pin connection guidelines before layout freeze. Also note that configuration via JTAG requires a valid VID chain supply voltage during programming; use the Intel programming tool (Quartus Prime Programmer) and confirm the MSEL pins are set to the correct mode (AS, PS, JTAG) for your boot source.
Informations de conformité
RoHS-compliant per Altera/Intel product page (LG suffix). Halogen-free status not confirmed in the verified web data and set to unknown. AEC-Q100 is not applicable for FPGAs - this part is qualified per Intel's own internal reliability program rather than automotive-specific AEC standards.
