10AX115R2F40I1SG - Arria 10 GX FPGA, 1.15M LEs, 1517-BGA | Intel
MPN: 10AX115R2F40I1SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4850 | $4,850.00 |
| 10 | $4520 | $45,200.00 |
| 100 | $4105 | $410,500.00 |
| 500 | $3780 | $1,890,000.00 |
| 1,000 | $3490 | $3,490,000.00 |
Drop-in alternatives for 10AX115R2F40I1SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10AX115R1F40I1SG
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View Datasheet →10AX115R2F40E2SG
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View Datasheet →10AX090R2F40I1SG
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View Datasheet →10AX115N2F40I1SG
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View Datasheet →10AX115R2F40I1SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 GX |
| Logic Elements | 1,150,000 |
| Embedded Memory | 68,857,856 bits (68.86 Mbit) |
| DSP Blocks | 1,518 (variable-precision, hardened FP) |
| 18x19 Multipliers | 2,014 |
| User I/O Count | 342 |
| Transceiver Speed | Up to 14.1 Gbps (chip-dependent) |
| Memory Interfaces | DDR4, QDR-IV, RLDRAM3 (hard controllers) |
| PCIe Hard IP | PCIe Gen3 x8 |
| Process Node | 20 nm TSMC |
| Core Voltage | 0.9 V |
| Package | 1517-ball FCBGA (F40) |
| Temperature Grade | Industrial (-40C to +100C) |
| Speed Grade | I1 (industrial, fastest) |
10AX115R2F40I1SG 1517-ball fcbga (f40) Pin Configuration Guide
Complete pinout information for 10AX115R2F40I1SG (1517-ball fcbga (f40) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AX115R2F40I1SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AX115R2F40I1SG is suitable for 7 applications: 4K Broadcast Video Processing, 100G/400G Optical Transport Networking, Radar and Electronic Warfare Signal Processing, 5G Baseband and Massive-MIMO Prototyping, Medical Imaging and Diagnostics, ASIC Prototyping and Emulation, Industrial Machine Vision.
4K Broadcast Video Processing
The 10AX115R2F40I1SG fits 4K broadcast workflows because its 1,150,000 logic elements and 1,518 variable-precision DSP blocks can sustain 4:4:4 60p HEVC encoding/decoding and chroma resampling in a single device. The 68.86 Mbit embedded memory pool (more than 60 MB on-die) absorbs multiple lines of 4K frame buffers, eliminating external SRAM and shrinking the bill of materials. Hardened PCIe Gen3 x8 links to host CPUs at 8 GT/s, while the F40 BGA exposes 342 user I/Os for SDI, HDMI, and DisplayPort bridging. Quartus reference designs for SMPTE 2022 and ST 2059 timing shorten the path to a broadcast-grade prototype.
Recommended
100G/400G Optical Transport Networking
For 100G and 400G optical line cards, the 10AX115R2F40I1SG combines up to 24 transceivers at 14.1 Gbps to drive OTU4 and 100GbE client interfaces directly, while the hardened Interlaken and 10G Ethernet MACs remove soft-IP overhead. Forward-error-correction (FEC) cores consume only a fraction of the 1,518 DSP blocks, leaving headroom for traffic management and OAM processing. The DDR4 controller with ECC supports 2,400 MT/s line rates, sufficient for 400G packet buffering with deep queue depths. Industrial-grade silicon tolerates the 70C ambient typical of telecom chassis without throttling.
Recommended
Radar and Electronic Warfare Signal Processing
Radar and EW systems favor the 10AX115R2F40I1SG because each variable-precision DSP block can be configured as two 18x19 multipliers or one 27x27 multiplier, simplifying pulse compression, MTI filtering, and DBF beamforming. The 14.1 Gbps transceivers accept multi-channel ADC outputs from AFE7422 or similar converters without external retiming. Floating-point operators implemented in the hardened DSP fabric run 1.5x more efficiently than equivalent soft logic, which translates directly to lower power at the same FFT throughput. The 1517-ball FCBGA also supports the ruggedized underfill required by MIL-STD-810 vibration profiles.
Recommended
5G Baseband and Massive-MIMO Prototyping
5G baseband and massive-MIMO prototyping benefit from the 1,150K logic elements and 1,518 DSP blocks of the 10AX115R2F40I1SG, which can implement LDPC/Polar encoders, 64x64 MIMO detectors, and channel-state-information processors on a single chip. Hardened CPRI and JESD204B/C IP blocks interface directly with RRH radio units at 9.8 Gbps, while the PCIe Gen3 x8 link backhauls processed data to the host CPU. Industrial temperature grade I1 supports the 100C junction that outdoor small-cell enclosures can impose in summer. Quartus Prime DSP Builder accelerates MATLAB-to-bitstream development.
Recommended
Medical Imaging and Diagnostics
Medical imaging platforms such as CT, MRI, and ultrasound use the 10AX115R2F40I1SG to execute back-projection and beamforming pipelines at deterministic latency. The 68.86 Mbit embedded memory holds projection slices without external SRAM, reducing PCB area in space-constrained cart-based systems. Floating-point DSP blocks handle iterative reconstruction kernels 1.5x more efficiently than soft implementations, which keeps thermal output low for IEC 60601 patient-contact temperature limits. Industrial temperature grade (-40C to +100C) supports the thermal envelope of MRI bore rooms and portable ultrasound carts.
Recommended
ASIC Prototyping and Emulation
Engineers prototyping ASICs target the 10AX115R2F40I1SG because the 1.15M LE fabric can map mid-complexity SoCs for pre-silicon software bring-up. Multiple FPGAs can be chained over 14.1 Gbps transceivers to expand capacity for larger designs, using the hardened PCIe Gen3 x8 port as the host bridge. Industrial-grade silicon lets validation labs run continuous stress at elevated temperatures without derating the timing closure. Quartus Prime TimeQuest sign-off delivers ASIC-class static timing reports, accelerating firmware development ahead of tape-out.
Recommended
Industrial Machine Vision
Industrial machine vision lines use the 10AX115R2F40I1SG to run CNN-based defect detection and 2D/3D object classification at line rates above 60 fps. The 1,518 DSP blocks accelerate convolutional kernels, while 14.1 Gbps transceivers aggregate multiple 5 MPixel camera streams through FPD-Link III or CoaXPress interfaces. Industrial temperature grade I1 tolerates the 50C ambient typical of factory floors without forced-air cooling. The 342 I/Os handle GPIO for PLC triggers, lighting controllers, and encoder feedback without external I/O expanders.
Recommended
Recommended Products Summary
Engineering reference data for 10AX115R2F40I1SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AX115R1F40I1SG | 10AX115R2F40E2SG | 10AX115R2F40E1SG | 10AX090R2F40I1SG | 10AX115N2F40I1SG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-ball FCBGA (F40) | 1517-ball FCBGA (F40) - same | 1517-ball FCBGA (F40) - same | 1517-ball FCBGA (F40) - same | 1517-ball FCBGA (F40) - same | 1517-ball FCBGA (F40) - same |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 900,000 (-22%) | 1,150,000 |
| DSP Blocks | 1,518 | 1,518 | 1,518 | 1,518 | ~1,200 (-21%) | 1,518 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Extended | Extended | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Transceiver Speed Bin | R2 (up to 14.1 Gbps) | R1 (lower) | R2 (up to 14.1 Gbps) | R2 (up to 14.1 Gbps) | R2 (up to 14.1 Gbps) | R2 GT variant (no transceivers) |
| Embedded Memory | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | 68,857,856 bits | ~53 Mbit (-23%) | 68,857,856 bits |
| User I/Os | 342 | 342 | 342 | 342 | 342 | 342 |
| Process Node | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
Key Differentiators
- Highest-density Arria 10 GX option in F40 (vs 10AX090R2F40I1SG)
- Industrial temperature grade with fastest I1 bin (vs 10AX115R2F40E2SG)
- Full transceiver complement in F40 (vs 10AX115N2F40I1SG)
Design Notes
Estimated: at the worst-case configuration profile and 100C ambient for the I1 industrial grade, the F40 package's typical core power budget is roughly 30-40 W. Plan a heat-spreader or 4-layer thermal interface covering at least 60 percent of the package top, and keep junction-to-ambient thermal resistance below 2 C/W to stay within the 100C limit. Insufficient thermal headroom is the single most common cause of field failures on industrial Arria 10 designs.
Use a 12-layer stack-up with a dedicated transceiver reference layer directly beneath the F40 BGA, following Intel's AN 775 routing guidelines. Estimated: each 14.1 Gbps transceiver lane requires 100-ohm differential impedance controlled to within 10 percent, with a maximum pre-emphasis of -6 dB at the longest trace. Skip the reference plane under the BGA break-out vias to avoid crosstalk into adjacent transceiver channels. Always confirm the pinout in Quartus Prime before freezing the layout.
The Arria 10 device requires multiple rails (0.9 V core, 1.1 V transceiver, 1.8 V/2.5 V/3.3 V I/O) sourced from a sequence-controlled PMIC such as the LTM4677. Estimated inrush can spike to 30 A for 5-10 ms during configuration, so size the input bulk capacitor bank to at least 1,500 uF of low-ESR ceramic. Decoupling must place 0.1 uF and 1 uF capacitors within 2 mm of every power pin pair; missed pins cause rail collapse and silent JTAG failures.
Do not confuse the Arria 10 GX (R) and GT (N) variants - the GT part (10AX115N2F40I1SG) substitutes the transceivers with a different mix of memory and DSP and is not a true drop-in for high-speed serial interfaces. Also avoid mixing industrial (I) and extended (E) speed grades on the same PCB unless the Quartus fitter explicitly tolerates it; pin-compatible does not always mean timing-compatible. Always re-run TimeQuest sign-off when swapping speed bins.
Compliance Information
RoHS and REACH compliance per Intel product page. AEC-Q100 not applicable (industrial-grade FPGA, not automotive-qualified).
