10AX115S1F45I1SG - Arria 10 GX FPGA, 1.15M LE, 1932-FCBGA | Intel
Référence : 10AX115S1F45I1SG ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1 000 | $0 | $0,00 |
10AX115S1F45I1SG Présentation
A Field-Programmable Gate Array (FPGA) is a reprogrammable digital integrated circuit whose logic and routing are defined by user-supplied configuration bitstreams, allowing hardware to be re-architected per use case. FPGAs sit within the broader hierarchy: programmable logic -> ASIC prototyping -> accelerator silicon -> semiconductor. The Arria 10 family targets mid-range applications that need DSP/FPGA integration with transceivers, bridging between low-cost Cyclone parts and high-end Stratix devices.
Key features include 624 general-purpose I/Os, 1560 DSP blocks (18x19), embedded Hard IP for PCI Express Gen3 and 10/40/100 GbE, 14.1 Gbps transceivers, and Hard Memory Controllers for DDR4 with ECC. The 1932-ball FCBGA at 1.0 mm ball pitch is intended for top-tier PCBs with high-density escape routing.
Arria 10 GX combines a mid-density programmable fabric with hardened serial interfaces and memory controllers, balancing flexibility against power efficiency. Its transceiver and PCIe Gen3 hard IPs shorten time-to-protocol-compliance for telecom and broadcast designs.
Typical applications include 100G optical transport, military radar baseband processing, medical imaging accelerators, ASIC prototyping, and high-performance DSP pipelines.
Designers should follow Intel's Arria 10 layout guidelines, including matched-length serial lanes, decoupling on every transceiver supply pin, and pin migration across SX/AX/ST variants when planning second-source.
This page consolidates distributor pricing, same-package Arria 10 drop-in alternatives, and PCB/thermal design guidance not found in the standalone datasheet.
Alternatives de remplacement direct pour 10AX115S1F45I1SG — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10AX115S1F45I1SG (même facteur de forme et même empreinte) — différant par Speed Grade, Package, DSP Blocks, Transceivers, Temperature Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10AX115S1F45E1SG
✅ Remplacement direct✓ En stock
$5850 / unité
Voir la fiche technique →10AX115S1F45I2SG
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
10AX115S2F45I1SG
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
10AX115S1F45I3SG
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
10AX115S3F45I1SG
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
10AX115S1F45I1SG Valeurs maximales et caractéristiques électriques
| Family | Arria 10 GX |
| Logic Elements | 1,150,000 |
| Embedded Memory Bits | 68,857,560 |
| DSP Blocks (18x19 Multipliers) | 1560 |
| Maximum User I/O | 624 |
| Max Transceiver Data Rate | 14.1 Gbps |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Boîtier | 1932-ball FCBGA (F45), 1.0 mm pitch |
| Type de montage | Surface Mount |
| Operating Temperature Grade | Industrial (I1) |
| Speed Grade | I1 (industrial) |
| Hardened IP | PCIe Gen3, 10/40/100 GbE MAC, DDR4 memory controllers |
| RoHS / Lead-Free | RoHS compliant (SG suffix) |
| Supplier | Intel (formerly Altera) |
Guide de configuration des broches du 10AX115S1F45I1SG 1932-ball fcbga (f45), 1.0 mm pitch
Configuration des broches du 10AX115S1F45I1SG (boîtier 1932-ball fcbga (f45), 1.0 mm pitch). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour 10AX115S1F45I1SG.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
10AX115S1F45I1SG convient pour 6 applications: 100G Optical Transport Line Cards, Military Radar Baseband Processing, ASIC Prototyping and Emulation, Medical Imaging Accelerators, Broadcast Video Processing, High-Performance Industrial Computing.
100G Optical Transport Line Cards
The 10AX115S1F45I1SG fits 100G optical transport due to its 14.1 Gbps transceivers that aggregate into 100 GbE pipes via built-in hard MACs. With 1,150,000 logic elements and 1560 DSP 18x19 blocks, it forwards packets, performs OTN framer functions, and executes forward error correction at line rate. The I1 industrial temperature grade ensures operation in carrier-grade central offices where ambient temperatures are uncontrolled. Pin-compatible S2/S3 OPNs allow upward migration when more transceivers are needed for 200G/400G uplinks.
Recommandé
Military Radar Baseband Processing
The 10AX115S1F45I1SG handles radar baseband DSP because its 1560 18x19 multipliers enable pulse-Doppler, MTI, and SAR compression on streaming ADC samples. Industrial temperature grade (I1) suits ground-mobile and naval platforms, and 68,857,560 embedded bits allow large windowing buffers to be co-located with arithmetic. Hardened DDR4 controllers feed post-processed tracks to the host CPU. Designers should reserve per-pin transceiver supplies for IF digitiser links and follow Intel's Arria 10 PCB layout guidelines for matched-length serial lanes.
Recommandé
ASIC Prototyping and Emulation
For ASIC prototyping, the 10AX115S1F45I1SG supplies 1,150,000 logic elements to map large SoC RTL partitions, while its DDR4 hard controllers model external DRAM in real time. Engineers use multi-FPGA partitioning to prototype designs exceeding 2M ASIC gates, leveraging partial reconfiguration to iterate on sub-modules without full bitstream reloads. Hardened PCIe Gen3 and GbE MACs let the prototype talk to real peripherals, accelerating software bring-up. Choose industrial speed grade for prototypes destined for production validation chambers.
Recommandé
Medical Imaging Accelerators
The 10AX115S1F45I1SG accelerates CT, MRI, and ultrasound reconstruction pipelines by running back-projection, beamforming, and denoising kernels across its 1560 DSP blocks. 68 Mbits of embedded memory hold filter coefficients and intermediate slices, reducing off-chip bandwidth. Industrial temperature grade (I1) supports imaging carts in unconditioned clinical spaces. Latency-critical feedback loops benefit from deterministic hard transceivers rather than soft SERDES. Verify IEC 60601 EMI margins during PCB bring-up.
Recommandé
Broadcast Video Processing
Broadcast video processors leverage the 10AX115S1F45I1SG's 14.1 Gbps transceivers for SDI-over-IP (SMPTE 2110) and 4K/8K mezzanine compression. 624 user I/Os drive HDMI/SDI companion chips, while 1560 DSP blocks accelerate deinterlacing and HDR tone-mapping in real time. Hardened 10/40/100 GbE MACs deliver uncompressed 4K streams to broadcast routers. Industrial temperature grade suits outside-broadcast trucks and master-control racks with limited climate control.
Recommandé
High-Performance Industrial Computing
Industrial line cards route high-speed fabric traffic using the 10AX115S1F45I1SG's 14.1 Gbps transceivers for backplane connectivity and PCIe Gen3 endpoints for CPU attachment. With 68 Mbits of on-chip memory, packet headers and queuing metadata stay on-die, reducing external memory accesses. Industrial temperature grade (I1) meets harsh-environment requirements of factory automation and energy substation controllers. The 1932-ball FCBGA exposes enough I/O for parallel legacy interfaces alongside serial links, simplifying hybrid industrial designs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10AX115S1F45I1SG — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10AX115S1F45E1SG | 10AX115S1F45I2SG | 10AX115S2F45I1SG | 10AX115S1F45I3SG | 10AX115S3F45I1SG |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1932-ball FCBGA (F45), 1.0 mm pitch | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same | 1932-ball FCBGA (F45) - same |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 |
| Speed Grade | I1 (industrial) | E1 (commercial) | I2 (industrial, faster) | I1 (industrial) | I3 (industrial, fastest) | I1 (industrial) |
| Transceiver Configuration | S1 | S1 | S1 | S2 (more transceivers) | S1 | S3 (more transceivers) |
| Embedded Memory Bits | 68,857,560 | 68,857,560 | 68,857,560 | 68,857,560 | 68,857,560 | 68,857,560 |
| DSP Blocks (18x19) | 1560 | 1560 | 1560 | 1560 | 1560 | 1560 |
| RoHS / Lead-Free | RoHS compliant (SG) | RoHS compliant (SG) | RoHS compliant (SG) | RoHS compliant (SG) | RoHS compliant (SG) | RoHS compliant (SG) |
Principaux différenciateurs
- Industrial speed grade in the F45 package (vs 10AX115S1F45E1SG)
- Lower-cost entry to the Arria 10 S1 transceiver configuration (vs 10AX115S2F45I1SG)
- Faster upgrade path on the same PCB (vs 10AX115S1F45I2SG)
Notes de conception
The 1932-ball F45 FCBGA at 1.0 mm pitch requires an HDI PCB stack-up with microvia escape and matched-length serial lanes. Follow Intel's Arria 10 layout guidelines: dedicated transceiver reference clock planes, isolation of analog supplies from digital switching, and 4-6 decoupling capacitors per power pin (0.1 uF, 1 uF, 10 uF mix). Stack-up should target 1 oz copper on outer layers and 0.5 oz on inner layers with a low-loss dielectric for 14.1 Gbps signals. Estimated: at full transceiver utilisation the part dissipates roughly 25-35 W, so the PCB thermal solution should include thermal vias to internal copper planes.
Estimated: Arria 10 devices in the F45 FCBGA typically dissipate 15-40 W depending on transceiver utilisation and toggle rate. With industrial temperature grade (I1), junction temperature must stay below 100 C. Use thermal vias under the central ball array and a heatsink with thermal interface material rated for the application environment. Always validate via a thermal simulation using actual activity factors; per-pin power data is in the Arria 10 PowerPlay Early Power Estimator.
Do not confuse SX/GX OPNs with NX OPNs - they share the same package but NX variants replace transceivers with general-purpose I/O. Pin assignments for the S1 transceiver configuration differ from S2/S3, so swapping OPNs without re-fitting the bitstream will cause configuration failure. Always specify the exact OPN in the BOM and validate the configured device ID via JTAG before production release. The 'ES' suffix denotes engineering samples - never ship ES parts to production without FA qualification.
Informations de conformité
RoHS compliance indicated by 'SG' suffix in the OPN per Intel ordering part number conventions. AEC-Q100 not applicable - FPGAs are not AEC-Q100 qualified; industrial temperature grade (I1) is the relevant environmental rating.
