10AX115S2F45E2SG - Arria 10 GX 1.15M LE FPGA, 28.05 Gbps | Intel
Référence : 10AX115S2F45E2SG ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $8717.2 | $8 717,20 |
| 10 | $8281.34 | $82 813,40 |
| 100 | $7845.48 | $784 548,00 |
| 500 | $7410.62 | $3 705 310,00 |
| 1 000 | $6975.76 | $6 975 760,00 |
10AX115S2F45E2SG Présentation
A field-programmable gate array (FPGA) is a reconfigurable semiconductor device that combines programmable logic blocks, configurable interconnects, and dedicated hardened IP blocks such as transceivers, memory controllers, and DSP slices. FPGAs sit at the top of the programmable logic hierarchy alongside CPLDs and ASICs, and the Arria 10 family occupies Intel's mid-range position between the lower-power Cyclone series and the high-performance Stratix 10 family. The Arria 10 GX adds integrated transceivers supporting backplane, chip-to-chip, and optical-module interconnect.
Key features of the 10AX115S2F45E2SG include 1.5 GHz maximum core fabric performance, 1,518 hardened 18x19 multipliers (2,268 18x18 equivalents) supporting IEEE 754 single-precision floating-point via the Variable Precision DSP block, and 24 transceivers at up to 28.05 Gbps per channel. The 1932-ball FC-FBGA package supports high-density board designs and exposes 624 general-purpose I/Os plus dedicated configuration, clock, and JTAG pins. Two on-chip PCIe Gen3 hard IP blocks support x1/x2/x4/x8 lane configurations.
The 10AX115S2F45E2SG uses TSMC's 20 nm planar process with Intel's Adaptive Logic Module (ALM) architecture, in which each ALM contains eight-input fracturable look-up-tables with adaptive register allocation. The device integrates 4 fractional PLLs, 8 I/O PLLs, and up to 28.05 Gbps serial transceivers with adaptive equalization and pre-emphasis. Hard memory controllers support DDR4, DDR3, QDR II+, and RLDRAM 3 with optional ECC.
Typical applications include 100G optical transport network line cards, 4K broadcast video processing and display walls, ASIC prototyping in the data center, high-performance computing (HPC) fabric bridges, PCIe Gen3 accelerator cards, and 100G Ethernet MAC/PHY bridging. The Arria 10 GX family is also widely deployed in radar signal processing for military and aerospace applications where high logic density and DSP throughput are required.
When designing with this device, follow Intel's Arria 10 GX PCB design guidelines for the F45 package: route all 12 transceiver channels in matched-length differential pairs with controlled 100-ohm differential impedance, provide solid GND stitching vias adjacent to each high-speed signal via, and pair each transceiver with a dedicated 100-ohm AC-coupling capacitor. Use the Quartus Prime Pin Planner to validate pin assignments against the F45 ball-grid map before tape-out, and leverage Intel's Transceiver Toolkit for in-system signal-integrity verification.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives from the Arria 10 GX family, and practical PCB design notes that are not consolidated in any single manufacturer document.
Alternatives de remplacement direct pour 10AX115S2F45E2SG — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10AX115S2F45E2SG (même facteur de forme et même empreinte) — différant par Package, Speed Grade, DSP Blocks, Embedded Memory, PCIe Hard IP.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10AX115S2F45E2LG
✅ Remplacement direct✓ En stock
$7100 / unité
Voir la fiche technique →10AX115S2F45E1SG
✅ Remplacement direct✓ En stock
$5650 / unité
Voir la fiche technique →10AX115S1F45I1SG
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →10AX115S1F45E1SG
✅ Remplacement direct✓ En stock
$5850 / unité
Voir la fiche technique →10AX090S2F45E2SG
✅ Remplacement direct✓ En stock
$2050 / unité
Voir la fiche technique →10AX115S2F45E2SG Valeurs maximales et caractéristiques électriques
| Family | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 |
| Adaptive Logic Modules (ALM) | 427,200 |
| Embedded Memory Bits | 68,857,856 |
| Embedded 18x19 Multipliers | 1,518 |
| Maximum User I/O Pins | 624 |
| Transceiver Count | 24 channels |
| Maximum Transceiver Data Rate | 28.05 Gbps |
| Process Technology | 20 nm TSMC |
| Core Voltage (Vcc) | 0.9 V (nominal) |
| Hard PCIe Gen3 Blocks | 2 |
| Fractional PLLs | 4 |
| I/O PLLs | 8 |
| Boîtier | 1932-ball FC-FBGA (F45) |
| Type de montage | Surface Mount |
| Operating Temperature Grade | E2 (0C to +100C) |
| Statut RoHS | Compliant |
| Speed Grade | 2 (mid) |
Guide de configuration des broches du 10AX115S2F45E2SG 1932-ball fc-fbga (f45)
Configuration des broches du 10AX115S2F45E2SG (boîtier 1932-ball fc-fbga (f45)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour 10AX115S2F45E2SG.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
10AX115S2F45E2SG convient pour 6 applications: 100G OTN Optical Transport Line Cards, 4K Broadcast Video Processing and Display Walls, ASIC Prototyping in the Data Center, PCIe Gen3 Accelerator Cards, Radar and Electronic Warfare Signal Processing, 100G Ethernet MAC/PHY Bridging.
100G OTN Optical Transport Line Cards
The 10AX115S2F45E2SG is purpose-built for 100G OTN optical transport line cards thanks to its 24 transceivers at 28.05 Gbps, which natively drive OTU4 client-side optics and inter-card backplanes without external muxponders. The 1,150,000 LE fabric implements the full OTU4 framer, GFP-F mapper, and OTN FEC decoder, while the two hard PCIe Gen3 blocks offload traffic to co-located switch ASICs. With 1,518 18x19 multipliers, the device also handles real-time OTN performance monitoring and per-channel BER calculations concurrently with line-rate data forwarding.
Recommandé
4K Broadcast Video Processing and Display Walls
The 10AX115S2F45E2SG's 1,150,000 LE fabric and 68,857,856 embedded memory bits make it a strong fit for 4K broadcast video processors that perform real-time scaling, deinterlacing, and color-space conversion across multiple 12G-SDI inputs. The 24 transceivers at 28.05 Gbps handle 12G-SDI (11.88 Gbps) and emerging 24G-SDI protocols over a single coax per channel, reducing connector count and PCB area. With 1,518 DSP multipliers, the device can also implement real-time HDR tone mapping and frame-rate conversion for live broadcast display walls and video wall controllers.
Recommandé
ASIC Prototyping in the Data Center
The 10AX115S2F45E2SG serves as a mid-range ASIC prototyping platform in cloud data centers thanks to its 1,150,000 LE fabric that maps hundreds of millions of ASIC gates for pre-silicon validation. Designers partition ASIC RTL across multiple FPGAs using gigabit transceivers at 28.05 Gbps to wire up chip-to-chip communication, while the two hard PCIe Gen3 blocks interface directly to host server platforms for bring-up and regression testing. The 68,857,856 embedded memory bits approximate typical ASIC SRAM densities without requiring external memory controllers.
Recommandé
PCIe Gen3 Accelerator Cards
The 10AX115S2F45E2SG integrates two hard PCIe Gen3 blocks that natively support x1, x2, x4, and x8 lane configurations, enabling direct deployment in PCIe Gen3 accelerator cards without external PHY silicon. Combined with 1,518 18x19 multipliers and 68,857,856 embedded memory bits, the device can host machine-learning inference engines, scientific computing kernels, or storage offload pipelines that benefit from FPGA-level parallelism. The 24 transceivers also support 10/25/40/100 GbE sideband networking for cluster-scale accelerator fabrics.
Recommandé
Radar and Electronic Warfare Signal Processing
The 10AX115S2F45E2SG's 1,518 18x19 multipliers deliver 2,268 18x18 multiplications per cycle, enabling multi-channel radar FFT pipelines and digital-beamforming on a single device. The 24 transceivers at 28.05 Gbps digitize and forward ADC samples from phased-array antennas directly into the FPGA fabric, while the 1,150,000 LE fabric implements matched filtering, pulse compression, and constant-false-alarm-rate detection. With 68,857,856 embedded memory bits, the device holds multiple FFT windows in real time without external SRAM.
Recommandé
100G Ethernet MAC/PHY Bridging
The 10AX115S2F45E2SG implements 100G Ethernet MAC plus PCS soft logic alongside the integrated 28.05 Gbps transceivers, enabling direct interface to 100G QSFP28 optical modules without external MAC/PHY silicon. The two hard PCIe Gen3 blocks can simultaneously bridge to host CPUs, turning the device into a 100G NIC or smart-NIC offload engine. The 1,150,000 LE fabric adds headroom for inline packet processing, telemetry, or wire-speed encryption alongside the 100G data path.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10AX115S2F45E2SG — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10AX115S2F45E2LG | 10AX115S2F45E1SG | 10AX115S1F45I1SG | 10AX115S1F45E1SG | 10AX090S2F45E2SG |
|---|---|---|---|---|---|---|
| Package | 1932-ball FC-FBGA (F45) | 1932-ball FC-FBGA (F45) - same | 1932-ball FC-FBGA (F45) - same | 1932-ball FC-FBGA (F45) - same | 1932-ball FC-FBGA (F45) - same | 1932-ball FC-FBGA (F45) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 900,000 (-22%) |
| Max Transceiver Data Rate | 28.05 Gbps | 28.05 Gbps | 28.05 Gbps | 17.4 Gbps (-38%) | 17.4 Gbps (-38%) | 28.05 Gbps |
| Speed Grade | -2 (mid) | -2 | -1 (slower) | -1 | -1 | -2 |
| Temperature Grade | E2 (0C to +100C) | E2 | E1 (0C to +100C, lower speed) | I1 (-40C to +100C industrial) | E1 | E2 |
| Lead Finish | Lead-free (G) | Leaded (L) | Lead-free (G) | Lead-free (G) | Lead-free (G) | Lead-free (G) |
| Embedded 18x19 Multipliers | 1,518 | 1,518 | 1,518 | 1,518 | 1,518 | 1,048 (-31%) |
Principaux différenciateurs
- Highest transceiver data rate in the 115K LE Arria 10 GX family at this speed grade (vs 10AX115S2F45E1SG)
- Highest logic density in the F45 Arria 10 GX package at 28.05 Gbps (vs 10AX090S2F45E2SG)
- Lead-free (RoHS-compliant) lead finish by default (vs 10AX115S2F45E2LG)
Notes de conception
Estimated: at 28.05 Gbps per channel, route all 24 transceiver lanes as 100-ohm differential pairs on the top microstrip or stripline layer with matched length to within 0.127 mm (5 mil) intra-pair and 6.4 mm inter-pair. Place AC-coupling capacitors within 3 mm of the FPGA ball, keep the ground plane unbroken under transceiver routes, and use a continuous reference return path. Intel's Arria 10 GX Transceiver User Guide documents the specific via-in-pad rules and loss budget that the F45 package requires.
Estimated: at 0.9 V core and full fabric utilization on the 1,150,000 LE Arria 10 device, supply current can exceed 30 A during peak switching activity. Design a low-impedance 0.9 V VRM using 4-6 parallel phases with ceramic bulk capacitance of at least 2,200 uF on the supply plane, and place decoupling capacitors (100 nF, 10 nF, 1 nF) within 1.5 mm of every Vcc ball. Use Intel's PowerPlay early power estimator in Quartus Prime to size the VRM before schematic capture.
Estimated: the 1932-ball FC-FBGA F45 package has a theta-JA of approximately 6 C/W with top-side air cooling, which means 20 W of dissipation raises the junction by 120 C above ambient. For forced-air cooled telecom designs, attach a heat spreader with thermal interface material (TIM) rated for at least 3 W/mK to the top of the package and ensure 200 LFM airflow. Run the Arria 10 junction-temperature estimation in Quartus Prime to verify thermal margin before committing the PCB stackup.
Estimated: a common pitfall in Arria 10 GX designs is forgetting the 1.8 V or 2.5 V VCCIO bank supply for general-purpose I/O pins, which is independent from the 0.9 V core supply and must be sequenced per Intel's Arria 10 GX Power Management User Guide. Another pitfall is using LVDS signals without enabling the on-chip LVDS serializer/deserializer block in Quartus Prime Pin Planner. Always verify pin assignments against the F45 ball-grid map and run the Quartus Prime I/O Assignment Analysis before generating programming files.
Informations de conformité
RoHS compliance per Intel Arria 10 GX product page (lead-free 'G' suffix). Lead-free finish designates RoHS-compliant termination. Not AEC-Q100 qualified - FPGAs are not subject to automotive stress-test qualification. Conflict-minerals statement available via Intel corporate compliance program.
