10M16DCF484C7G - MAX 10 FPGA, 16K LE, 484-FBGA | Intel
Référence : 10M16DCF484C7G ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $46.64 | $46,64 |
| 10 | $42.5 | $425,00 |
| 100 | $38.2 | $3 820,00 |
| 500 | $34.75 | $17 375,00 |
| 1 000 | $31.8 | $31 800,00 |
10M16DCF484C7G Présentation
A Field Programmable Gate Array (FPGA) is a programmable logic device (PLD) that lets engineers implement custom digital circuits through configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware blocks. FPGAs sit within the broader taxonomy: programmable logic -> PLD -> semiconductor IC. MAX 10 is Intel/Altera's entry-tier non-volatile FPGA family, positioned below Cyclone V and Arria/Versus families, offering instant-on operation, integrated ADC, and on-chip flash for configuration storage.
Key features of the 10M16DCF484C7G include 16,000 logic elements (LEs) backed by 247 Kbits (Kb) of embedded SRAM (M9K blocks), an embedded Multiplier block set supporting 18x18 multipliers for DSP-style operations, up to 320 general-purpose I/Os supporting LVDS and various single-ended standards, and dual-configuration flash with self-reconfiguration capability. The integrated hard ADC (12-bit, up to 17 channels on select variants) and on-chip temperature sensing diode remove the need for external mixed-signal components.
The architecture pairs 6-input adaptive logic modules (ALMs) with a versatile routing network and dedicated memory blocks. Maximum internal clock frequency reaches 472.5 MHz, while embedded DSP blocks deliver aggregate throughput exceeding 60 GMACs. The on-die flash removes boot-time latency and supports dual-image storage for fail-safe field updates, a defining feature that distinguishes MAX 10 from SRAM-based Cyclone families.
Typical applications include industrial motor control, video bridging and display interfaces, I/O expansion and protocol bridging (I2C/SPI/UART-to-LVDS), portable instrumentation, and low-cost video processing. The combination of high I/O count (320 pins) and 1.2 V core operation makes it well suited to compact designs with many parallel buses.
Designers should pay attention to the FPGA core supply and I/O bank sequencing: the device supports a 1.2 V core with separate VCCIO rails per bank. Quartus Prime software is required for synthesis and place-and-route, and JTAG-based in-system programming is supported via the dedicated configuration pins on the F484 package.
This page synthesizes distributor pricing, MAX 10 family drop-in alternatives, and practical Quartus Prime design notes not found in the manufacturer datasheet, enabling faster part selection for industrial and consumer FPGA designs.
Alternatives de remplacement direct pour 10M16DCF484C7G — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10M16DCF484C7G (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Configuration, Embedded Memory, Mounting Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10M16DCF484A7G
✅ Remplacement direct✓ En stock
$51 / unité
Voir la fiche technique →10M16DAF484C7G
✅ Remplacement direct✓ En stock
$55.5 / unité
Voir la fiche technique →10M16DAF484I7G
✅ Remplacement direct✓ En stock
$60.4 / unité
Voir la fiche technique →10M16DAF484I7P
✅ Remplacement direct✓ En stock
$53.05 / unité
Voir la fiche technique →10M16DCF484A7G
✅ Remplacement direct✓ En stock
$51 / unité
Voir la fiche technique →10M16DCF484C7G Valeurs maximales et caractéristiques électriques
| Family | MAX 10 |
| Series / Sub-family | MAX 10 FPGA |
| Logic Elements (LE) | 16,000 |
| Logic Array Blocks (LAB) | 1,000 |
| Embedded Memory (M9K blocks) | 247 Kb / 562,176 bits |
| Embedded Multiplier (18x18) | Yes (DSP blocks) |
| Maximum User I/O | 320 |
| Maximum Internal Clock Frequency | 472.5 MHz |
| Process Technology | 55 nm |
| Core Supply Voltage | 1.2 V |
| Boîtier | 484-ball FBGA (F484) |
| Configuration | Non-volatile (on-chip flash, dual-image) |
| Operating Temperature Grade | Commercial (0C to +85C) |
| Type de montage | Surface Mount (BGA) |
| Statut RoHS | Compliant |
Guide de configuration des broches du 10M16DCF484C7G 484-ball fbga (f484)
Configuration des broches du 10M16DCF484C7G (boîtier 484-ball fbga (f484)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour 10M16DCF484C7G.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
10M16DCF484C7G convient pour 8 applications: Industrial Motor Control, Video Bridging & Display Interfaces, I/O Expansion & Protocol Bridging, Portable Test & Measurement Instrumentation, Consumer Electronics & IoT Gateways, Automotive Infotainment & Telematics (Non-Safety), LED Lighting & Display Controllers, Educational & Development Platforms.
Industrial Motor Control
The Intel 10M16DCF484C7G's 16,000 logic elements, 320 GPIO and integrated 12-bit ADC make it ideal for industrial motor control designs. The non-volatile MAX 10 flash delivers instant-on field deployment without an external boot PROM, while the 472.5 MHz maximum internal clock handles PWM generation and encoder feedback at high update rates. The F484 package exposes sufficient I/O banks to interface directly with Hall sensors, QEI encoders, gate drivers, and isolated CAN/RS-485 transceivers, reducing external component count.
Recommandé
Video Bridging & Display Interfaces
The 10M16DCF484C7G's 320 user I/Os are well suited for video bridge applications such as RGB-to-LVDS, MIPI DSI conversion, or HDMI/DVI pre-processing. Embedded 18x18 multiplier blocks enable real-time scaling and color-space conversion (RGB->YCrCb) while the 247 Kb M9K memory serves as line buffer for deinterlacing. The 55 nm process keeps dynamic power low for compact display modules, and the on-chip flash eliminates boot latency for fast panel wake-up.
Recommandé
I/O Expansion & Protocol Bridging
With 16K LEs and 320 GPIOs, the 10M16DCF484C7G excels as an I/O expansion FPGA bridging SPI, I2C, UART, I2S, and parallel buses to LVDS or RGMII interfaces. Designers can implement multi-port USB-UART bridges, industrial GPIO expanders, or legacy-to-modern protocol converters in a single chip. The 472.5 MHz fabric clocks most UART oversampling schemes, and the dual-image flash supports fail-safe field firmware updates critical for industrial protocols like Modbus, PROFINET, and EtherCAT.
Recommandé
Portable Test & Measurement Instrumentation
The 10M16DCF484C7G is well matched to handheld oscilloscopes, logic analyzers, and bench-top DMMs where its integrated ADC, non-volatile boot, and high GPIO count reduce BOM. The 1.2 V core plus selectable VCCIO per bank allow direct interfacing with 1.8 V, 2.5 V, 3.3 V, and 5 V mixed-signal front ends. On-chip temperature-sensing diode supports over-temperature shutdown without an external sensor, and dual-image flash enables secure firmware recovery in field-deployed instruments.
Recommandé
Consumer Electronics & IoT Gateways
The 10M16DCF484C7G's low cost-per-LE and integrated ADC fit smart-home hubs and consumer IoT gateways that aggregate multiple wireless protocols (BLE, Zigbee, LoRa, Wi-Fi). The MAX 10 instant-on flash means the gateway boots within milliseconds of power-up, and the 320 I/Os handle multiple PMOD-style daughter cards for protocol expansion. The 55 nm process keeps dynamic power low enough for fanless enclosures, while the small 484-FBGA footprint fits 4-layer consumer PCBs.
Recommandé
Automotive Infotainment & Telematics (Non-Safety)
For non-safety automotive functions such as infotainment head-unit signal routing, rear-seat entertainment bridging, and telematics data aggregation, the 10M16DCF484C7G serves as a flexible interface hub. The 320 GPIOs support multiple camera inputs, LVDS displays, and CAN/LIN bus aggregation. Designers targeting AEC-Q100 environments should select the automotive-temp MAX 10 variant 10M16DAF484I7P from the Site MPN list rather than the commercial 10M16DCF484C7G.
Recommandé
LED Lighting & Display Controllers
The 10M16DCF484C7G can drive large addressable LED matrices through its 320 GPIO outputs, generating multiple PWM channels for color and brightness control. The 16K LEs support addressable protocols such as WS2812B, APA102, and DMX512 simultaneously, and the on-chip flash supports fast field updates for lighting program presets. The integrated ADC enables ambient-light sensing for automatic brightness adjustment in architectural and stage lighting applications.
Recommandé
Educational & Development Platforms
With 16K LEs, 320 GPIOs, and integrated ADC, the 10M16DCF484C7G is an excellent learning platform for students and engineers exploring FPGA design through Quartus Prime. The on-chip flash supports one-step programming through a low-cost JTAG programmer like the USB-Blaster clone, and the 55 nm process keeps tool-required learning kits affordable. The 484-ball FBGA exposes enough I/Os to drive breakout boards, breadboards, and PMOD peripherals in a single educational board.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10M16DCF484C7G — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Select the 10M16DCF484A7G if you need slightly slower timing grades (within 10%) at lower cost, or the 10M16DAF484C7G if you need the integrated 12-bit ADC. For industrial (-40C to +100C) deployment, switch to 10M16DAF484I7G or 10M16DAF484I7P.
Do not use 10M16DCF484C7G in safety-critical automotive applications - it is commercial temperature grade. For AEC-Q100 environments, evaluate Cyclone V or higher-density MAX 10 variants with the automotive prefix.
Comparaison avec les alternatives
| Paramètre | Ce produit | 10M16DCF484A7G | 10M16DAF484C7G | 10M16DAF484I7G | 10M16DAF484I7P | 10M16DCF484A7G |
|---|---|---|---|---|---|---|
| Package | 484-ball FBGA (F484) | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | MAX 10 | MAX 10 | MAX 10 | MAX 10 | MAX 10 | MAX 10 |
| Logic Elements | 16,000 | 16,000 | 16,000 | 16,000 | 16,000 | 16,000 |
| Embedded Memory | 247 Kb / 562,176 bits | 247 Kb | 247 Kb | 247 Kb | 247 Kb | 247 Kb |
| Maximum User I/O | 320 | 320 | 320 | 320 | 320 | 320 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) |
| ADC Subsystem | Optional (variant dependent) | Optional | Integrated 12-bit ADC | Integrated 12-bit ADC | Integrated 12-bit ADC | Optional |
| Configuration Flash | Dual-image on-chip flash | Dual-image on-chip flash | Dual-image on-chip flash | Dual-image on-chip flash | Dual-image on-chip flash | Dual-image on-chip flash |
Principaux différenciateurs
- Non-volatile instant-on configuration with dual-image flash (vs Cyclone IV EP4CE10F484)
- Integrated 12-bit ADC on DA sub-series variants (vs Lattice ECP5 LFE5U-25F484)
- 320 user I/Os in a single 484-ball FBGA (vs 10M16DCF256C7G)
Notes de conception
The MAX 10 FPGA core operates from a 1.2 V supply. Estimated: at 50% logic utilization and 100 MHz toggle rate, core current is typically 200-400 mA, yielding 0.24-0.48 W core dissipation. Use the Quartus Prime Early Power Estimator (EPE) for accurate modeling of your specific design. Decouple VCC with at least one 10 uF bulk, four 0.1 uF ceramics spread across the BGA, and one 0.01 uF HF bypass near each VCC pin to suppress switching noise.
The 484-ball FBGA requires a 1.0 mm ball pitch layout with microvia or laser-drilled via-in-pad technology for reliable assembly. Use a 4 to 6 layer PCB stack-up with continuous ground and power planes. Per the Altera MAX 10 hardware design guidelines, all VCCINT and VCCIO balls must be individually decoupled; do not share decoupling capacitors across balls. Leave a generous thermal copper pour under the FBGA to dissipate the 1-2 W typical load.
Avoid mixing 1.2 V VCCINT with 3.3 V VCCIO without proper level shifting or bank-voltage sequencing - the MAX 10 datasheet specifies a maximum VCCIO-to-VCCINT delta of 2.5 V during power-up. Always use the dedicated JTAG pins (TCK, TMS, TDI, TDO) for in-system programming; the SDM (Secure Device Manager) pins should be left in their default JTAG mode unless using Active Serial configuration. Failure to provide a clean 1.2 V supply can cause configuration failures at boot.
Route differential pairs (LVDS) with 100 ohm differential impedance and match trace lengths within 5 mils to preserve timing margins. The MAX 10 hardware design guide recommends using inner signal layers between ground planes for high-speed LVDS routes, and routing all clock signals on inner stripline layers for better EMI suppression. Avoid routing high-speed signals over split power planes to prevent return-path discontinuities.
The MAX 10 output drivers support LVDS, LVCMOS, SSTL, and HSTL I/O standards with programmable drive strength and slew rate. Estimated: enabling slow slew rate on switching I/Os reduces ground bounce by approximately 30% at the cost of 1-2 ns edge delay. Enable Schmitt trigger inputs on noise-sensitive asynchronous inputs such as external interrupt or reset lines to prevent false triggering.
Informations de conformité
RoHS compliant per Altera/Intel product page. Lead-free 'G' suffix in the OPN. Not AEC-Q100 qualified - this is a commercial-temperature part. For AEC-Q100 designs, use the 'I' grade variants such as 10M16DAF484I7P.