10M16DCF484C7G - MAX 10 FPGA, 16K LE, 484-FBGA | Intel
MPN: 10M16DCF484C7G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $46.64 | $46.64 |
| 10 | $42.5 | $425.00 |
| 100 | $38.2 | $3,820.00 |
| 500 | $34.75 | $17,375.00 |
| 1,000 | $31.8 | $31,800.00 |
Drop-in alternatives for 10M16DCF484C7G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10M16DCF484A7G
✅ Drop-In✓ In Stock
$51 / Unit
View Datasheet →10M16DAF484C7G
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$55.5 / Unit
View Datasheet →10M16DAF484I7G
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$60.4 / Unit
View Datasheet →10M16DAF484I7P
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$53.05 / Unit
View Datasheet →10M16DCF484A7G
✅ Drop-In✓ In Stock
$51 / Unit
View Datasheet →10M16DCF484C7G Maximum Ratings & Electrical Characteristics
| Family | MAX 10 |
| Series / Sub-family | MAX 10 FPGA |
| Logic Elements (LE) | 16,000 |
| Logic Array Blocks (LAB) | 1,000 |
| Embedded Memory (M9K blocks) | 247 Kb / 562,176 bits |
| Embedded Multiplier (18x18) | Yes (DSP blocks) |
| Maximum User I/O | 320 |
| Maximum Internal Clock Frequency | 472.5 MHz |
| Process Technology | 55 nm |
| Core Supply Voltage | 1.2 V |
| Package | 484-ball FBGA (F484) |
| Configuration | Non-volatile (on-chip flash, dual-image) |
| Operating Temperature Grade | Commercial (0C to +85C) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
10M16DCF484C7G 484-ball fbga (f484) Pin Configuration Guide
Complete pinout information for 10M16DCF484C7G (484-ball fbga (f484) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M16DCF484C7G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M16DCF484C7G is suitable for 8 applications: Industrial Motor Control, Video Bridging & Display Interfaces, I/O Expansion & Protocol Bridging, Portable Test & Measurement Instrumentation, Consumer Electronics & IoT Gateways, Automotive Infotainment & Telematics (Non-Safety), LED Lighting & Display Controllers, Educational & Development Platforms.
Industrial Motor Control
The Intel 10M16DCF484C7G's 16,000 logic elements, 320 GPIO and integrated 12-bit ADC make it ideal for industrial motor control designs. The non-volatile MAX 10 flash delivers instant-on field deployment without an external boot PROM, while the 472.5 MHz maximum internal clock handles PWM generation and encoder feedback at high update rates. The F484 package exposes sufficient I/O banks to interface directly with Hall sensors, QEI encoders, gate drivers, and isolated CAN/RS-485 transceivers, reducing external component count.
Recommended
Video Bridging & Display Interfaces
The 10M16DCF484C7G's 320 user I/Os are well suited for video bridge applications such as RGB-to-LVDS, MIPI DSI conversion, or HDMI/DVI pre-processing. Embedded 18x18 multiplier blocks enable real-time scaling and color-space conversion (RGB->YCrCb) while the 247 Kb M9K memory serves as line buffer for deinterlacing. The 55 nm process keeps dynamic power low for compact display modules, and the on-chip flash eliminates boot latency for fast panel wake-up.
Recommended
I/O Expansion & Protocol Bridging
With 16K LEs and 320 GPIOs, the 10M16DCF484C7G excels as an I/O expansion FPGA bridging SPI, I2C, UART, I2S, and parallel buses to LVDS or RGMII interfaces. Designers can implement multi-port USB-UART bridges, industrial GPIO expanders, or legacy-to-modern protocol converters in a single chip. The 472.5 MHz fabric clocks most UART oversampling schemes, and the dual-image flash supports fail-safe field firmware updates critical for industrial protocols like Modbus, PROFINET, and EtherCAT.
Recommended
Portable Test & Measurement Instrumentation
The 10M16DCF484C7G is well matched to handheld oscilloscopes, logic analyzers, and bench-top DMMs where its integrated ADC, non-volatile boot, and high GPIO count reduce BOM. The 1.2 V core plus selectable VCCIO per bank allow direct interfacing with 1.8 V, 2.5 V, 3.3 V, and 5 V mixed-signal front ends. On-chip temperature-sensing diode supports over-temperature shutdown without an external sensor, and dual-image flash enables secure firmware recovery in field-deployed instruments.
Recommended
Consumer Electronics & IoT Gateways
The 10M16DCF484C7G's low cost-per-LE and integrated ADC fit smart-home hubs and consumer IoT gateways that aggregate multiple wireless protocols (BLE, Zigbee, LoRa, Wi-Fi). The MAX 10 instant-on flash means the gateway boots within milliseconds of power-up, and the 320 I/Os handle multiple PMOD-style daughter cards for protocol expansion. The 55 nm process keeps dynamic power low enough for fanless enclosures, while the small 484-FBGA footprint fits 4-layer consumer PCBs.
Recommended
Automotive Infotainment & Telematics (Non-Safety)
For non-safety automotive functions such as infotainment head-unit signal routing, rear-seat entertainment bridging, and telematics data aggregation, the 10M16DCF484C7G serves as a flexible interface hub. The 320 GPIOs support multiple camera inputs, LVDS displays, and CAN/LIN bus aggregation. Designers targeting AEC-Q100 environments should select the automotive-temp MAX 10 variant 10M16DAF484I7P from the Site MPN list rather than the commercial 10M16DCF484C7G.
Recommended
LED Lighting & Display Controllers
The 10M16DCF484C7G can drive large addressable LED matrices through its 320 GPIO outputs, generating multiple PWM channels for color and brightness control. The 16K LEs support addressable protocols such as WS2812B, APA102, and DMX512 simultaneously, and the on-chip flash supports fast field updates for lighting program presets. The integrated ADC enables ambient-light sensing for automatic brightness adjustment in architectural and stage lighting applications.
Recommended
Educational & Development Platforms
With 16K LEs, 320 GPIOs, and integrated ADC, the 10M16DCF484C7G is an excellent learning platform for students and engineers exploring FPGA design through Quartus Prime. The on-chip flash supports one-step programming through a low-cost JTAG programmer like the USB-Blaster clone, and the 55 nm process keeps tool-required learning kits affordable. The 484-ball FBGA exposes enough I/Os to drive breakout boards, breadboards, and PMOD peripherals in a single educational board.
Recommended
Recommended Products Summary
Engineering reference data for 10M16DCF484C7G — comparison, design guidance, and compliance information.
Selection Guide
Select the 10M16DCF484A7G if you need slightly slower timing grades (within 10%) at lower cost, or the 10M16DAF484C7G if you need the integrated 12-bit ADC. For industrial (-40C to +100C) deployment, switch to 10M16DAF484I7G or 10M16DAF484I7P.
Do not use 10M16DCF484C7G in safety-critical automotive applications - it is commercial temperature grade. For AEC-Q100 environments, evaluate Cyclone V or higher-density MAX 10 variants with the automotive prefix.
Comparison with Alternatives
| Parameter | This Product | 10M16DCF484A7G | 10M16DAF484C7G | 10M16DAF484I7G | 10M16DAF484I7P | 10M16DCF484A7G |
|---|---|---|---|---|---|---|
| Package | 484-ball FBGA (F484) | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | MAX 10 | MAX 10 | MAX 10 | MAX 10 | MAX 10 | MAX 10 |
| Logic Elements | 16,000 | 16,000 | 16,000 | 16,000 | 16,000 | 16,000 |
| Embedded Memory | 247 Kb / 562,176 bits | 247 Kb | 247 Kb | 247 Kb | 247 Kb | 247 Kb |
| Maximum User I/O | 320 | 320 | 320 | 320 | 320 | 320 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) |
| ADC Subsystem | Optional (variant dependent) | Optional | Integrated 12-bit ADC | Integrated 12-bit ADC | Integrated 12-bit ADC | Optional |
| Configuration Flash | Dual-image on-chip flash | Dual-image on-chip flash | Dual-image on-chip flash | Dual-image on-chip flash | Dual-image on-chip flash | Dual-image on-chip flash |
Key Differentiators
- Non-volatile instant-on configuration with dual-image flash (vs Cyclone IV EP4CE10F484)
- Integrated 12-bit ADC on DA sub-series variants (vs Lattice ECP5 LFE5U-25F484)
- 320 user I/Os in a single 484-ball FBGA (vs 10M16DCF256C7G)
Design Notes
The MAX 10 FPGA core operates from a 1.2 V supply. Estimated: at 50% logic utilization and 100 MHz toggle rate, core current is typically 200-400 mA, yielding 0.24-0.48 W core dissipation. Use the Quartus Prime Early Power Estimator (EPE) for accurate modeling of your specific design. Decouple VCC with at least one 10 uF bulk, four 0.1 uF ceramics spread across the BGA, and one 0.01 uF HF bypass near each VCC pin to suppress switching noise.
The 484-ball FBGA requires a 1.0 mm ball pitch layout with microvia or laser-drilled via-in-pad technology for reliable assembly. Use a 4 to 6 layer PCB stack-up with continuous ground and power planes. Per the Altera MAX 10 hardware design guidelines, all VCCINT and VCCIO balls must be individually decoupled; do not share decoupling capacitors across balls. Leave a generous thermal copper pour under the FBGA to dissipate the 1-2 W typical load.
Avoid mixing 1.2 V VCCINT with 3.3 V VCCIO without proper level shifting or bank-voltage sequencing - the MAX 10 datasheet specifies a maximum VCCIO-to-VCCINT delta of 2.5 V during power-up. Always use the dedicated JTAG pins (TCK, TMS, TDI, TDO) for in-system programming; the SDM (Secure Device Manager) pins should be left in their default JTAG mode unless using Active Serial configuration. Failure to provide a clean 1.2 V supply can cause configuration failures at boot.
Route differential pairs (LVDS) with 100 ohm differential impedance and match trace lengths within 5 mils to preserve timing margins. The MAX 10 hardware design guide recommends using inner signal layers between ground planes for high-speed LVDS routes, and routing all clock signals on inner stripline layers for better EMI suppression. Avoid routing high-speed signals over split power planes to prevent return-path discontinuities.
The MAX 10 output drivers support LVDS, LVCMOS, SSTL, and HSTL I/O standards with programmable drive strength and slew rate. Estimated: enabling slow slew rate on switching I/Os reduces ground bounce by approximately 30% at the cost of 1-2 ns edge delay. Enable Schmitt trigger inputs on noise-sensitive asynchronous inputs such as external interrupt or reset lines to prevent false triggering.
Compliance Information
RoHS compliant per Altera/Intel product page. Lead-free 'G' suffix in the OPN. Not AEC-Q100 qualified - this is a commercial-temperature part. For AEC-Q100 designs, use the 'I' grade variants such as 10M16DAF484I7P.
