10CL080ZF484I8G - Cyclone 10 LP FPGA 81K LE | Intel | FBGA-484
Référence : 10CL080ZF484I8G ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $95 | $95,00 |
| 10 | $88.5 | $885,00 |
| 100 | $79 | $7 900,00 |
| 500 | $71.2 | $35 600,00 |
| 1 000 | $64.5 | $64 500,00 |
10CL080ZF484I8G Présentation
A Field Programmable Gate Array (FPGA) is a reconfigurable digital integrated circuit containing an array of programmable logic blocks, interconnect, and dedicated silicon resources (memory blocks, multipliers, PLLs, transceivers) that can be customized after manufacturing. FPGAs sit in the programmable-logic hierarchy between ASICs (high NRE, fixed function) and microcontrollers (instruction-driven, fixed silicon). The Cyclone 10 LP family is Intel's cost-optimized, low-static-power node targeting volume production in industrial, consumer, and automotive-adjacent designs.
Key differentiating specifications for 10CL080ZF484I8G include 81,264 logic elements (the largest in the Cyclone 10 LP family), 4.45 Mbits of M9K embedded block RAM, 489 maximum user I/Os, six high-performance fractional PLLs, and a process node tuned for sub-1W static power. The device supports LVDS, LVCMOS, SSTL, and DDR3 external memory interfaces at up to 400 Mbps. Configuration is handled via fast passive parallel (FPP), active serial (AS), JTAG, or Altera dual-configuration schemes.
Architecturally, the 10CL080 leverages a Logic Array Block (LAB) fabric with 16 LEs per LAB, 32 Kbits of RAM per M9K block, and a MultiTrack interconnect routing fabric. The silicon is built on a low-power process and supports hot-socketing, partial reconfiguration, and SEU-mitigation via the soft error detection IP block - features uncommon in this price tier.
Typical applications include industrial motor control, video bridging (HDMI/DVI aggregation), low-cost software-defined radio front-ends, IoT edge aggregation nodes, factory automation PLCs, and portable medical instrumentation. The combination of 81K LEs and 489 I/Os makes the F484 variant the highest-density pin-compatible option in the 484-BGA footprint.
When designing with this device, plan FPGA pin assignment early and use Intel Quartus Prime Lite Edition or Quartus Prime Standard for synthesis. Decoupling must include 100 nF caps per VCC/GND pair and bulk 10 uF capacitors near each supply rail; the 1.2 V core supply must ramp monotonically to avoid configuration CRC failures.
This page synthesizes distributor pricing, drop-in pin-compatible variants from the Cyclone 10 LP family, and practical Quartus-driven design notes not collected in the datasheet alone.
Alternatives de remplacement direct pour 10CL080ZF484I8G — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10CL080ZF484I8G (même facteur de forme et même empreinte) — différant par Speed Grade, Package, Process Technology, PLLs, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10CL080YU484I7G
✅ Remplacement direct✓ En stock
$152 / unité
Voir la fiche technique →10CL080YU484C8G
✅ Remplacement direct✓ En stock
$450 / unité
Voir la fiche technique →10CL080YU484C6G
✅ Remplacement direct✓ En stock
$34.75 / unité
Voir la fiche technique →10CL080YU484A7G
✅ Remplacement direct✓ En stock
$171 / unité
Voir la fiche technique →10CL080YF484I7G
✅ Remplacement direct✓ En stock
$71.95 / unité
Voir la fiche technique →10CL080ZF484I8G Valeurs maximales et caractéristiques électriques
| Family | Cyclone 10 LP |
| Logic Elements | 81,264 |
| Embedded Memory | 2,810,880 bits (4.45 Mbits) |
| Embedded Multipliers (18x18) | 289 |
| Maximum User I/Os | 289 to 489 (package dependent) |
| PLLs | 6 fractional PLLs |
| Boîtier | 484-ball FBGA (F484) |
| Température de fonctionnement | -40C to +100C (industrial) |
| Speed Grade | 8 |
| Supply Voltage (Core) | 1.2 V |
| Configuration Scheme | FPP / AS / JTAG / Dual-config |
| Process Node | Low-power optimized |
| Transceivers | None (Cyclone 10 LP has no SERDES) |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
| Type de montage | Surface Mount (BGA) |
Guide de configuration des broches du 10CL080ZF484I8G 484-ball fbga (f484)
Configuration des broches du 10CL080ZF484I8G (boîtier 484-ball fbga (f484)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour 10CL080ZF484I8G.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
10CL080ZF484I8G convient pour 6 applications: Industrial Motor Control, Video Bridging and Aggregation, Software-Defined Radio Front-End Aggregation, IoT Edge Aggregation Node, Factory Automation PLC, Portable Medical Instrumentation.
Industrial Motor Control
The 10CL080ZF484I8G is well-suited for multi-axis industrial motor control loops (FOC, PID, encoder feedback). With 81,264 logic elements the device can host 4-6 independent FOC controllers, each consuming roughly 12K LEs plus memory for sensor-fusion and current-loop math. The 289 18x18 hardware multipliers accelerate Park/Clarke transforms and SVPWM modulators, and 2.8 Mbits of embedded M9K memory provide deterministic buffer space for ADC sample pipelines. The -40C to +100C industrial temperature rating is essential for cabinet-mounted drives, and the 289 I/Os support parallel encoder interfaces, gate-driver PWM, and isolated SPI to safety controllers. Quartus Prime DSP Builder IP accelerates development of the control-loop math.
Recommandé
Video Bridging and Aggregation
For HDMI/DVI aggregation and multi-stream video bridging applications, the 10CL080ZF484I8G offers 4.45 Mbits of embedded M9K RAM and 289 user I/Os - ideal for tile-based video processing and color-space conversion pipelines. The device comfortably hosts Altera VIP (Video and Image Processing) suite IP, including scalers, deinterlacers, and color-space converters that consume 5-15K LEs per processing stage. The 289 I/Os support parallel LVCMOS or LVDS input from up to four 24-bit video streams, and the six fractional PLLs provide independent video-clock domains. Industrial temperature rating supports digital signage installations in unconditioned enclosures.
Recommandé
Software-Defined Radio Front-End Aggregation
The 10CL080ZF484I8G enables low-cost SDR front-end aggregation, where multiple RF channels are digitized at IF and routed through FPGA-based DDC (digital down-conversion) and channelizer logic. The 289 hardware multipliers deliver 18x18 signed multiplication required for FIR filtering, and 4.45 Mbits of M9K RAM accommodate deep coefficient tables and sample buffers. With 81K LEs, designs can implement 4-8 wideband DDC channels with half-band and CIC decimators. While the Cyclone 10 LP family lacks SERDES transceivers, parallel LVDS ADC interfaces up to 400 Mbps are supported, making this part a strong match for IF-band SDR aggregation in test equipment and spectrum analyzers.
Recommandé
IoT Edge Aggregation Node
The 10CL080ZF484I8G serves as an IoT edge gateway aggregator, combining multiple sensor bus interfaces (SPI, I2C, UART, CAN) with on-board protocol translation to Ethernet or LTE. The 289 user I/Os support dozens of sensor inputs simultaneously, while 81,264 logic elements host TCP/IP stacks, MQTT brokers, and protocol-conversion state machines. Industrial temperature rating allows outdoor or factory-floor deployment, and the sub-1W static power consumption supports solar or battery-powered edge nodes. Quartus Prime Nios II soft-core integration enables local decision-making, reducing backhaul traffic.
Recommandé
Factory Automation PLC
The 10CL080ZF484I8G powers programmable logic controllers in factory automation, where it handles multi-protocol industrial networking (EtherCAT, PROFINET, Modbus TCP), ladder-logic execution, and machine-vision preprocessing. With 81K LEs it can implement 2-3 independent industrial Ethernet nodes plus ladder-logic interpreters and PID loops in parallel. The 289 I/Os support isolated digital I/O banks, encoder inputs, and high-speed analog front-end interfaces. Industrial -40C to +100C rating is essential for cabinet deployment, and the FBGA-484 package enables compact form factors with high I/O density. Deterministic sub-microsecond interrupt latency supports real-time control loops.
Recommandé
Portable Medical Instrumentation
The 10CL080ZF484I8G enables portable medical instrumentation such as handheld ultrasound, patient monitors, and point-of-care diagnostic devices. The 81,264 logic elements host digital beamforming for ultrasound probes, FFT pipelines, and signal-conditioning IP. The 4.45 Mbits of M9K RAM accommodate sample buffers for multi-channel acquisition, and 289 hardware multipliers accelerate FFT and convolution operations critical to beamforming. Industrial temperature rating supports portable equipment used in varied ambient conditions, while sub-1W static power enables battery operation. The low-power Cyclone 10 LP process node is specifically tuned for medical and portable applications where thermal management is constrained.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10CL080ZF484I8G — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10CL080YU484I7G | 10CL080YU484C8G | 10CL080YU484C6G | 10CL080YU484A7G | 10CL080YF484I7G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-BGA (F484 footprint) | 484-UBGA (F484 footprint) - same | 484-UBGA (F484 footprint) - same | 484-UBGA (F484 footprint) - same | 484-UBGA (F484 footprint) - same | 484-BGA (F484 footprint) - same |
| Logic Elements | 81,264 | 81,264 (same die) | 81,264 (same die) | 81,264 (same die) | 81,264 (same die) | 81,264 (same die) |
| Embedded Memory (bits) | 2,810,880 | 2,810,880 (same) | 2,810,880 (same) | 2,810,880 (same) | 2,810,880 (same) | 2,810,880 (same) |
| 18x18 Multipliers | 289 | 289 (same) | 289 (same) | 289 (same) | 289 (same) | 289 (same) |
| Speed Grade | 8 | 7 | 8 | 6 | 7 | 7 |
| Temperature Range | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +125C (automotive) | -40C to +100C (industrial) |
Principaux différenciateurs
- Highest logic density in Cyclone 10 LP family (vs 10CL055ZF484I8G)
- 289 I/O ballmap with industry temperature grade (vs 10CL080YU484C8G)
- Speed grade 8 for highest timing margin (vs 10CL080YU484C6G)
Notes de conception
The 10CL080ZF484I8G requires three power rails: VCCINT (1.2 V core), VCCIO (1.2 V to 3.3 V I/O banks, bank-dependent), and VCCA (2.5 V PLL analog). Decoupling must include at least one 100 nF ceramic capacitor per VCC pin and 10 uF bulk capacitors per supply rail within 5 mm of the BGA. The VCCINT rail must ramp monotonically within 0.2 ms to 100 ms - faster ramps can trigger PORC (power-on-reset) failures and corrupt configuration. Use a sequenced power controller such as the LM3880 or Intel's recommended power-tree reference design.
For the F484 package at full 81K-LE utilization, estimate static junction-to-ambient thermal resistance theta_JA near 15 C/W on a 4-layer PCB with adequate thermal vias. Use the Quartus Prime Early Power Estimator (EPE) spreadsheet with realistic toggle rates (typically 12.5% for control logic, 25% for memory, 50% for fabric) to compute total power dissipation. Designs exceeding 2 W should attach a heatsink or thermal interface material; high-density F484 packages benefit from 4x4 thermal-via arrays under the exposed die pad.
The F484 1.0 mm pitch BGA requires 4-layer minimum PCB stackup with 0.5 oz copper outer layers and continuous ground planes under the BGA. All BGA balls use NSMD (non-solder mask defined) pads with 0.5 mm diameter. Via-in-pad micro-vias (0.1 mm laser-drilled, filled-and-capped) are preferred for high-speed DDR3 external memory interfaces - this eliminates stub inductance that causes signal-integrity failures above 400 Mbps.
Common design pitfalls: (1) Sharing VCCIO banks between 3.3 V LVCMOS and 1.8 V SSTL interfaces - banks are single-voltage; (2) omitting the configuration mode pull-up/pull-down resistors (MSEL pins must be set before VCCINT ramps); (3) using LVDS without the 100 ohm differential termination - LVDS requires external 100 ohm across the differential pair; (4) routing clocks over the BGA without reference-plane stitching - this can cause 50 MHz+ jitter.
Informations de conformité
RoHS compliant per 'G' suffix in ordering code. AEC-Q100 not qualified - choose 10CL080YU484A7G for automotive applications. Intel product family is REACH and conflict-minerals compliant per corporate sustainability disclosures.