10M16SCU169C8G - MAX 10 FPGA 16K LE 169-UBGA | Intel
Référence : 10M16SCU169C8G ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $24.5 | $24,50 |
| 10 | $22.1 | $221,00 |
| 100 | $19.85 | $1 985,00 |
| 500 | $17.5 | $8 750,00 |
| 1 000 | $15.4 | $15 400,00 |
10M16SCU169C8G Présentation
A Field Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), programmable interconnects, and embedded memory and DSP slices that the designer programs after manufacture. FPGAs sit above microcontrollers and below ASICs in the design abstraction hierarchy: ASIC > FPGA > DSP > Microcontroller > Microprocessor. The MAX 10 family specifically targets low-power, non-volatile logic integration for industrial, automotive, and consumer applications, blending FPGA fabric with on-chip flash, ADCs, and DSP blocks in a single chip.
Key features of the 10M16SCU169C8G include 16K logic elements, 549 Kbits embedded SRAM, four analog PLLs, an on-chip temperature-sensing diode, and a hard Nios II processor capability via soft IP. The device integrates up to 1.6 Mb of user flash for non-volatile storage, eliminating the need for a separate boot configuration memory. Its single-supply core operates from a 1.2 V internal rail, while I/O banks support LVCMOS, LVTTL, LVDS, SSTL, and PCI Express signaling at up to 3.0 Gbps transceivers are not included on this variant.
Typical applications include industrial motor control, factory automation I/O expansion, low-cost video bridging, LED display controllers, sensor aggregation hubs, and portable test equipment. The MAX 10's instant-on feature (configuration in < 10 ms from internal flash) makes it well suited as a microcontroller companion for system glue logic, power sequencing, and protocol bridging in space-constrained designs. Its small 11x11 mm UFBGA package suits dense board layouts where larger QFP packages are not feasible.
Alternatives de remplacement direct pour 10M16SCU169C8G — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10M16SCU169C8G (même facteur de forme et même empreinte) — différant par Package, Process Technology, Logic Elements (LE), Configuration Memory, Integrated ADC.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10M16SCU169A7G
✅ Remplacement direct✓ En stock
$30.15 / unité
Voir la fiche technique →10M16SCU169I7G
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
10M16SCU169A7P
✅ Remplacement direct✓ En stock
$22 / unité
Voir la fiche technique →10M16SAU169C8G
✅ Remplacement direct✓ En stock
$21.4 / unité
Voir la fiche technique →10M16SAU169I7G
✅ Remplacement direct✓ En stock
$47.5563 / unité
Voir la fiche technique →10M08SCU169C8G
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
10M08SCU169I7G
✅ Remplacement direct✓ En stock
$9.85 / unité
Voir la fiche technique →10M16SCU169C8G Valeurs maximales et caractéristiques électriques
| Family | MAX 10 |
| Logic Elements (LE) | 16,000 |
| Adaptive Logic Modules (ALM) | 8000 |
| Embedded Memory (M9K blocks) | 549 Kbits (approximately 70 M9K blocks) |
| User Flash Memory | Up to 1.6 Mb on-chip non-volatile |
| Maximum User I/O | 130 |
| Boîtier | 169-ball UFBGA (U169, 11x11 mm) |
| Process Technology | 55 nm TSMC |
| Core Voltage | 1.2 V (internal) |
| Temperature Grade | Commercial 0C to +85C |
| Speed Grade | -8 (standard, C speed) |
| PLLs | 4 (analog) |
| Configuration Method | Internal flash (instant-on), JTAG, AS mode |
| Type de montage | Surface Mount (BGA) |
| Statut RoHS | Compliant (per product listing) |
Guide de configuration des broches du 10M16SCU169C8G 169-ball ufbga (u169, 11x11 mm)
Configuration des broches du 10M16SCU169C8G (boîtier 169-ball ufbga (u169, 11x11 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour 10M16SCU169C8G.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
10M16SCU169C8G convient pour 6 applications: Industrial I/O Expansion and Protocol Bridging, Motor Control and PWM Generation, Low-Cost Video Bridging and Display Controllers, Sensor Aggregation Hub for IoT Gateways, LED Display and Lighting Controllers, Portable Test and Measurement Equipment.
Industrial I/O Expansion and Protocol Bridging
The 10M16SCU169C8G is well suited for industrial I/O expansion modules and protocol bridges (Modbus RTU to Modbus TCP, SPI to UART, parallel LCD to SPI). Its 16,000 logic elements and 549 Kbits embedded RAM can host full industrial protocol stacks plus state machines, while the 130 user I/O pins accommodate up to four independent serial channels and 80+ parallel GPIO. The instant-on internal flash configuration eliminates boot delay, critical for safety-rated PLC I/O racks. Estimated gate utilization for a Modbus TCP bridge with eight UART channels is approximately 8,000 LE, leaving headroom for application-specific logic.
Recommandé
Motor Control and PWM Generation
The 10M16SCU169C8G fits multi-axis motor control and custom PWM generation where fixed-function MCUs lack sufficient timing flexibility. Its four analog PLLs generate independent clock domains for field-oriented control loops, and the 16K logic elements implement space-vector modulation, encoder decoding, and current-sense processing in parallel. The 169-ball UFBGA package exposes enough I/O for three-phase PWM plus quadrature encoder feedback on multiple axes. Estimated loop latency for a 50 MHz control core is below 200 ns, sufficient for 20 kHz PWM update rates on sub-1 kW BLDC drives.
Recommandé
Low-Cost Video Bridging and Display Controllers
The 10M16SCU169C8G can act as a low-cost video bridge between CMOS image sensors and RGB/HDMI panels, performing pixel-rate conversion, color-space translation, and on-screen overlay generation. Its 549 Kbits embedded RAM holds three full video line buffers at 720p resolution, and the 130 user I/O pins handle parallel RGB888 plus control signals. The MAX 10's on-chip flash enables fast boot to display in under 10 ms, useful for digital signage and kiosk displays that must present content immediately on power-up. Estimated logic utilization for a 720p60 to 1080p30 upscaler is approximately 10,000 LE.
Recommandé
Sensor Aggregation Hub for IoT Gateways
The 10M16SCU169C8G serves as a sensor aggregation hub in IoT gateways, fusing data from SPI, I2C, UART, and analog sensors before forwarding to an upstream processor. Its 16K logic elements implement edge filtering and threshold detection while the on-chip flash stores configuration profiles for multiple sensor types. The commercial 0C to +85C temperature range is appropriate for indoor gateway enclosures, and the 11x11 mm UFBGA footprint is small enough for compact DIN-rail or wall-mount designs. Estimated power consumption at 50 MHz core clock is below 200 mW, suitable for PoE-powered gateways.
Recommandé
LED Display and Lighting Controllers
The 10M16SCU169C8G is appropriate for large LED video wall controllers and architectural lighting controllers that need many independent PWM channels and pattern generation. Its 130 user I/O pins can drive 16-bit parallel LED drivers via multiplexing, and the embedded M9K memory blocks store pattern lookup tables for color effects. The MAX 10's instant-on feature is valuable for emergency-lighting controllers that must restore programmed scenes within one power-on cycle. Estimated channel capacity at 8-bit color depth is 32 universes of DMX512, sufficient for medium-scale architectural installations.
Recommandé
Portable Test and Measurement Equipment
The 10M16SCU169C8G fits portable test and measurement instruments such as logic analyzers, protocol exercisers, and bench-top data loggers. Its 130 user I/O pins accept multiple probe channels simultaneously, the embedded RAM buffers captured waveforms at sample rates up to 300 MHz, and the on-chip flash stores instrument firmware for instant-on operation. The small 11x11 mm UFBGA package supports handheld form factors, while the commercial temperature range covers typical lab environments. Estimated logic utilization for a 16-channel 200 MHz logic analyzer is approximately 9,000 LE.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10M16SCU169C8G — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10M16SCU169A7G | 10M16SCU169I7G | 10M16SAU169C8G | 10M08SCU169C8G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 169-ball UFBGA (U169) | 169-ball UFBGA (U169) - same | 169-ball UFBGA (U169) - same | 169-ball UFBGA (U169) - same | 169-ball UFBGA (U169) - same |
| Logic Elements | 16,000 | 16,000 | 16,000 | 16,000 | 8,000 (-50%) |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | -8 | -7 (slower) | -7 (slower) | -8 (same) | -8 (same) |
| User I/O | 130 | 130 | 130 | 130 | 130 |
| Embedded RAM | 549 Kbits | 549 Kbits | 549 Kbits | 549 Kbits | 378 Kbits |
| On-chip Flash | Yes (instant-on) | Yes | Yes | Yes | Yes |
| PLLs | 4 | 4 | 4 | 4 | 2 |
Principaux différenciateurs
- Higher logic element density in same U169 footprint (vs 10M08SCU169C8G)
- Larger embedded memory for buffering (vs 10M08SCU169C8G)
- Four analog PLLs vs two on smaller MAX 10 variants (vs 10M08SCU169C8G)
Notes de conception
The 169-ball UFBGA package uses 0.65 mm ball pitch and 11x11 mm body, which demands a 4-layer PCB minimum with laser-drilled microvias (HDI stack-up). Route all signal escapes on the top layer with via-in-pad or short dogbone fan-outs, and allocate the second inner layer as a continuous ground plane directly beneath the device. Maintain a 0.4 mm via-to-pad clearance and use 0.1 mm trace/space design rules for inner layers to keep impedance within +/- 10 percent on 50 ohm single-ended routes. Decoupling requires 0.1 uF and 0.01 uF X7R ceramic capacitors placed within 2 mm of each power pin pair, plus one bulk 10 uF tantalum per power rail at the board edge connector.
Estimated: at the commercial 85C upper limit with the MAX 10 toggling at 50 MHz core and 50 percent I/O toggle rate, the 10M16SCU169C8G dissipates approximately 0.5 W. The U169 UFBGA has a typical theta_JA of 28 C/W on a 4-layer JEDEC test board, giving a junction temperature rise of 14 C above ambient - well within the commercial limit. For sealed enclosures without airflow, derate clock frequency or use the industrial-grade 10M16SCU169I7G if the internal ambient exceeds 70C. Always simulate thermal behavior with the actual PCB copper area before finalizing enclosure design.
Three pitfalls recur in MAX 10 designs: (1) failing to connect all VCCINT and VCCA pins even if some balls appear unused - the internal core logic draws from every pin and floating connections cause partial programming failures; (2) using JTAG chain configurations with TCK slower than 10 MHz, which causes configuration timeouts on the internal flash loader - use a USB-Blaster II or compatible 10 MHz JTAG programmer; (3) assuming the on-chip flash can be re-written indefinitely - the MAX 10 user flash is rated for approximately 1,000 erase/program cycles per sector, so avoid storing frequently updated data in flash and instead use the SRAM for run-time variables.
Informations de conformité
RoHS compliance per DigiKey product listing. Commercial temperature grade - not AEC-Q100 qualified; select MAX 10 variants with 'A' suffix for automotive applications. Halogen-free status not explicitly stated in the verified web data.
