10M16SCU169C8G - MAX 10 FPGA 16K LE 169-UBGA | Intel
부품 번호: 10M16SCU169C8G ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $24.5 | $24.50 |
| 10 | $22.1 | $221.00 |
| 100 | $19.85 | $1,985.00 |
| 500 | $17.5 | $8,750.00 |
| 1,000 | $15.4 | $15,400.00 |
10M16SCU169C8G 개요
A Field Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), programmable interconnects, and embedded memory and DSP slices that the designer programs after manufacture. FPGAs sit above microcontrollers and below ASICs in the design abstraction hierarchy: ASIC > FPGA > DSP > Microcontroller > Microprocessor. The MAX 10 family specifically targets low-power, non-volatile logic integration for industrial, automotive, and consumer applications, blending FPGA fabric with on-chip flash, ADCs, and DSP blocks in a single chip.
Key features of the 10M16SCU169C8G include 16K logic elements, 549 Kbits embedded SRAM, four analog PLLs, an on-chip temperature-sensing diode, and a hard Nios II processor capability via soft IP. The device integrates up to 1.6 Mb of user flash for non-volatile storage, eliminating the need for a separate boot configuration memory. Its single-supply core operates from a 1.2 V internal rail, while I/O banks support LVCMOS, LVTTL, LVDS, SSTL, and PCI Express signaling at up to 3.0 Gbps transceivers are not included on this variant.
Typical applications include industrial motor control, factory automation I/O expansion, low-cost video bridging, LED display controllers, sensor aggregation hubs, and portable test equipment. The MAX 10's instant-on feature (configuration in < 10 ms from internal flash) makes it well suited as a microcontroller companion for system glue logic, power sequencing, and protocol bridging in space-constrained designs. Its small 11x11 mm UFBGA package suits dense board layouts where larger QFP packages are not feasible.
드롭인 대체품: 10M16SCU169C8G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10M16SCU169C8G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Logic Elements (LE), Configuration Memory, Integrated ADC.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10M16SCU169A7G
✅ 드롭인✓ 재고 있음
$30.15 / 개
데이터시트 보기 →10M16SCU169I7G
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
10M16SCU169A7P
✅ 드롭인✓ 재고 있음
$22 / 개
데이터시트 보기 →10M16SAU169C8G
✅ 드롭인✓ 재고 있음
$21.4 / 개
데이터시트 보기 →10M16SAU169I7G
✅ 드롭인✓ 재고 있음
$47.5563 / 개
데이터시트 보기 →10M08SCU169C8G
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
10M08SCU169I7G
✅ 드롭인✓ 재고 있음
$9.85 / 개
데이터시트 보기 →10M16SCU169C8G 최대 정격 & 전기적 특성
| Family | MAX 10 |
| Logic Elements (LE) | 16,000 |
| Adaptive Logic Modules (ALM) | 8000 |
| Embedded Memory (M9K blocks) | 549 Kbits (approximately 70 M9K blocks) |
| User Flash Memory | Up to 1.6 Mb on-chip non-volatile |
| Maximum User I/O | 130 |
| 패키지 | 169-ball UFBGA (U169, 11x11 mm) |
| Process Technology | 55 nm TSMC |
| Core Voltage | 1.2 V (internal) |
| Temperature Grade | Commercial 0C to +85C |
| Speed Grade | -8 (standard, C speed) |
| PLLs | 4 (analog) |
| Configuration Method | Internal flash (instant-on), JTAG, AS mode |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant (per product listing) |
10M16SCU169C8G 169-ball ufbga (u169, 11x11 mm) 핀 구성 가이드
10M16SCU169C8G(169-ball ufbga (u169, 11x11 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10M16SCU169C8G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10M16SCU169C8G 적합 용도: 6 애플리케이션s: Industrial I/O Expansion and Protocol Bridging, Motor Control and PWM Generation, Low-Cost Video Bridging and Display Controllers, Sensor Aggregation Hub for IoT Gateways, LED Display and Lighting Controllers, Portable Test and Measurement Equipment.
Industrial I/O Expansion and Protocol Bridging
The 10M16SCU169C8G is well suited for industrial I/O expansion modules and protocol bridges (Modbus RTU to Modbus TCP, SPI to UART, parallel LCD to SPI). Its 16,000 logic elements and 549 Kbits embedded RAM can host full industrial protocol stacks plus state machines, while the 130 user I/O pins accommodate up to four independent serial channels and 80+ parallel GPIO. The instant-on internal flash configuration eliminates boot delay, critical for safety-rated PLC I/O racks. Estimated gate utilization for a Modbus TCP bridge with eight UART channels is approximately 8,000 LE, leaving headroom for application-specific logic.
추천
Motor Control and PWM Generation
The 10M16SCU169C8G fits multi-axis motor control and custom PWM generation where fixed-function MCUs lack sufficient timing flexibility. Its four analog PLLs generate independent clock domains for field-oriented control loops, and the 16K logic elements implement space-vector modulation, encoder decoding, and current-sense processing in parallel. The 169-ball UFBGA package exposes enough I/O for three-phase PWM plus quadrature encoder feedback on multiple axes. Estimated loop latency for a 50 MHz control core is below 200 ns, sufficient for 20 kHz PWM update rates on sub-1 kW BLDC drives.
추천
Low-Cost Video Bridging and Display Controllers
The 10M16SCU169C8G can act as a low-cost video bridge between CMOS image sensors and RGB/HDMI panels, performing pixel-rate conversion, color-space translation, and on-screen overlay generation. Its 549 Kbits embedded RAM holds three full video line buffers at 720p resolution, and the 130 user I/O pins handle parallel RGB888 plus control signals. The MAX 10's on-chip flash enables fast boot to display in under 10 ms, useful for digital signage and kiosk displays that must present content immediately on power-up. Estimated logic utilization for a 720p60 to 1080p30 upscaler is approximately 10,000 LE.
추천
Sensor Aggregation Hub for IoT Gateways
The 10M16SCU169C8G serves as a sensor aggregation hub in IoT gateways, fusing data from SPI, I2C, UART, and analog sensors before forwarding to an upstream processor. Its 16K logic elements implement edge filtering and threshold detection while the on-chip flash stores configuration profiles for multiple sensor types. The commercial 0C to +85C temperature range is appropriate for indoor gateway enclosures, and the 11x11 mm UFBGA footprint is small enough for compact DIN-rail or wall-mount designs. Estimated power consumption at 50 MHz core clock is below 200 mW, suitable for PoE-powered gateways.
추천
LED Display and Lighting Controllers
The 10M16SCU169C8G is appropriate for large LED video wall controllers and architectural lighting controllers that need many independent PWM channels and pattern generation. Its 130 user I/O pins can drive 16-bit parallel LED drivers via multiplexing, and the embedded M9K memory blocks store pattern lookup tables for color effects. The MAX 10's instant-on feature is valuable for emergency-lighting controllers that must restore programmed scenes within one power-on cycle. Estimated channel capacity at 8-bit color depth is 32 universes of DMX512, sufficient for medium-scale architectural installations.
추천
Portable Test and Measurement Equipment
The 10M16SCU169C8G fits portable test and measurement instruments such as logic analyzers, protocol exercisers, and bench-top data loggers. Its 130 user I/O pins accept multiple probe channels simultaneously, the embedded RAM buffers captured waveforms at sample rates up to 300 MHz, and the on-chip flash stores instrument firmware for instant-on operation. The small 11x11 mm UFBGA package supports handheld form factors, while the commercial temperature range covers typical lab environments. Estimated logic utilization for a 16-channel 200 MHz logic analyzer is approximately 9,000 LE.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10M16SCU169C8G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10M16SCU169A7G | 10M16SCU169I7G | 10M16SAU169C8G | 10M08SCU169C8G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 169-ball UFBGA (U169) | 169-ball UFBGA (U169) - same | 169-ball UFBGA (U169) - same | 169-ball UFBGA (U169) - same | 169-ball UFBGA (U169) - same |
| Logic Elements | 16,000 | 16,000 | 16,000 | 16,000 | 8,000 (-50%) |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | -8 | -7 (slower) | -7 (slower) | -8 (same) | -8 (same) |
| User I/O | 130 | 130 | 130 | 130 | 130 |
| Embedded RAM | 549 Kbits | 549 Kbits | 549 Kbits | 549 Kbits | 378 Kbits |
| On-chip Flash | Yes (instant-on) | Yes | Yes | Yes | Yes |
| PLLs | 4 | 4 | 4 | 4 | 2 |
주요 차별점
- Higher logic element density in same U169 footprint (vs 10M08SCU169C8G)
- Larger embedded memory for buffering (vs 10M08SCU169C8G)
- Four analog PLLs vs two on smaller MAX 10 variants (vs 10M08SCU169C8G)
설계 노트
The 169-ball UFBGA package uses 0.65 mm ball pitch and 11x11 mm body, which demands a 4-layer PCB minimum with laser-drilled microvias (HDI stack-up). Route all signal escapes on the top layer with via-in-pad or short dogbone fan-outs, and allocate the second inner layer as a continuous ground plane directly beneath the device. Maintain a 0.4 mm via-to-pad clearance and use 0.1 mm trace/space design rules for inner layers to keep impedance within +/- 10 percent on 50 ohm single-ended routes. Decoupling requires 0.1 uF and 0.01 uF X7R ceramic capacitors placed within 2 mm of each power pin pair, plus one bulk 10 uF tantalum per power rail at the board edge connector.
Estimated: at the commercial 85C upper limit with the MAX 10 toggling at 50 MHz core and 50 percent I/O toggle rate, the 10M16SCU169C8G dissipates approximately 0.5 W. The U169 UFBGA has a typical theta_JA of 28 C/W on a 4-layer JEDEC test board, giving a junction temperature rise of 14 C above ambient - well within the commercial limit. For sealed enclosures without airflow, derate clock frequency or use the industrial-grade 10M16SCU169I7G if the internal ambient exceeds 70C. Always simulate thermal behavior with the actual PCB copper area before finalizing enclosure design.
Three pitfalls recur in MAX 10 designs: (1) failing to connect all VCCINT and VCCA pins even if some balls appear unused - the internal core logic draws from every pin and floating connections cause partial programming failures; (2) using JTAG chain configurations with TCK slower than 10 MHz, which causes configuration timeouts on the internal flash loader - use a USB-Blaster II or compatible 10 MHz JTAG programmer; (3) assuming the on-chip flash can be re-written indefinitely - the MAX 10 user flash is rated for approximately 1,000 erase/program cycles per sector, so avoid storing frequently updated data in flash and instead use the SRAM for run-time variables.
규정 준수 정보
RoHS compliance per DigiKey product listing. Commercial temperature grade - not AEC-Q100 qualified; select MAX 10 variants with 'A' suffix for automotive applications. Halogen-free status not explicitly stated in the verified web data.
