10M16SCU169C8G - MAX 10 FPGA 16K LE 169-UBGA | Intel
MPN: 10M16SCU169C8G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $24.5 | $24.50 |
| 10 | $22.1 | $221.00 |
| 100 | $19.85 | $1,985.00 |
| 500 | $17.5 | $8,750.00 |
| 1,000 | $15.4 | $15,400.00 |
Drop-in alternatives for 10M16SCU169C8G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10M16SCU169A7G
✅ Drop-In✓ In Stock
$30.15 / Unit
View Datasheet →10M16SCU169I7G
✅ Drop-In📋 Reference alternative (not in catalog)
10M16SCU169A7P
✅ Drop-In✓ In Stock
$22 / Unit
View Datasheet →10M16SAU169C8G
✅ Drop-In✓ In Stock
$21.4 / Unit
View Datasheet →10M16SAU169I7G
✅ Drop-In✓ In Stock
$47.5563 / Unit
View Datasheet →10M08SCU169C8G
✅ Drop-In📋 Reference alternative (not in catalog)
10M08SCU169I7G
✅ Drop-In✓ In Stock
$9.85 / Unit
View Datasheet →10M16SCU169C8G Maximum Ratings & Electrical Characteristics
| Family | MAX 10 |
| Logic Elements (LE) | 16,000 |
| Adaptive Logic Modules (ALM) | 8000 |
| Embedded Memory (M9K blocks) | 549 Kbits (approximately 70 M9K blocks) |
| User Flash Memory | Up to 1.6 Mb on-chip non-volatile |
| Maximum User I/O | 130 |
| Package | 169-ball UFBGA (U169, 11x11 mm) |
| Process Technology | 55 nm TSMC |
| Core Voltage | 1.2 V (internal) |
| Temperature Grade | Commercial 0C to +85C |
| Speed Grade | -8 (standard, C speed) |
| PLLs | 4 (analog) |
| Configuration Method | Internal flash (instant-on), JTAG, AS mode |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant (per product listing) |
10M16SCU169C8G 169-ball ufbga (u169, 11x11 mm) Pin Configuration Guide
Complete pinout information for 10M16SCU169C8G (169-ball ufbga (u169, 11x11 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10M16SCU169C8G.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10M16SCU169C8G is suitable for 6 applications: Industrial I/O Expansion and Protocol Bridging, Motor Control and PWM Generation, Low-Cost Video Bridging and Display Controllers, Sensor Aggregation Hub for IoT Gateways, LED Display and Lighting Controllers, Portable Test and Measurement Equipment.
Industrial I/O Expansion and Protocol Bridging
The 10M16SCU169C8G is well suited for industrial I/O expansion modules and protocol bridges (Modbus RTU to Modbus TCP, SPI to UART, parallel LCD to SPI). Its 16,000 logic elements and 549 Kbits embedded RAM can host full industrial protocol stacks plus state machines, while the 130 user I/O pins accommodate up to four independent serial channels and 80+ parallel GPIO. The instant-on internal flash configuration eliminates boot delay, critical for safety-rated PLC I/O racks. Estimated gate utilization for a Modbus TCP bridge with eight UART channels is approximately 8,000 LE, leaving headroom for application-specific logic.
Recommended
Motor Control and PWM Generation
The 10M16SCU169C8G fits multi-axis motor control and custom PWM generation where fixed-function MCUs lack sufficient timing flexibility. Its four analog PLLs generate independent clock domains for field-oriented control loops, and the 16K logic elements implement space-vector modulation, encoder decoding, and current-sense processing in parallel. The 169-ball UFBGA package exposes enough I/O for three-phase PWM plus quadrature encoder feedback on multiple axes. Estimated loop latency for a 50 MHz control core is below 200 ns, sufficient for 20 kHz PWM update rates on sub-1 kW BLDC drives.
Recommended
Low-Cost Video Bridging and Display Controllers
The 10M16SCU169C8G can act as a low-cost video bridge between CMOS image sensors and RGB/HDMI panels, performing pixel-rate conversion, color-space translation, and on-screen overlay generation. Its 549 Kbits embedded RAM holds three full video line buffers at 720p resolution, and the 130 user I/O pins handle parallel RGB888 plus control signals. The MAX 10's on-chip flash enables fast boot to display in under 10 ms, useful for digital signage and kiosk displays that must present content immediately on power-up. Estimated logic utilization for a 720p60 to 1080p30 upscaler is approximately 10,000 LE.
Recommended
Sensor Aggregation Hub for IoT Gateways
The 10M16SCU169C8G serves as a sensor aggregation hub in IoT gateways, fusing data from SPI, I2C, UART, and analog sensors before forwarding to an upstream processor. Its 16K logic elements implement edge filtering and threshold detection while the on-chip flash stores configuration profiles for multiple sensor types. The commercial 0C to +85C temperature range is appropriate for indoor gateway enclosures, and the 11x11 mm UFBGA footprint is small enough for compact DIN-rail or wall-mount designs. Estimated power consumption at 50 MHz core clock is below 200 mW, suitable for PoE-powered gateways.
Recommended
LED Display and Lighting Controllers
The 10M16SCU169C8G is appropriate for large LED video wall controllers and architectural lighting controllers that need many independent PWM channels and pattern generation. Its 130 user I/O pins can drive 16-bit parallel LED drivers via multiplexing, and the embedded M9K memory blocks store pattern lookup tables for color effects. The MAX 10's instant-on feature is valuable for emergency-lighting controllers that must restore programmed scenes within one power-on cycle. Estimated channel capacity at 8-bit color depth is 32 universes of DMX512, sufficient for medium-scale architectural installations.
Recommended
Portable Test and Measurement Equipment
The 10M16SCU169C8G fits portable test and measurement instruments such as logic analyzers, protocol exercisers, and bench-top data loggers. Its 130 user I/O pins accept multiple probe channels simultaneously, the embedded RAM buffers captured waveforms at sample rates up to 300 MHz, and the on-chip flash stores instrument firmware for instant-on operation. The small 11x11 mm UFBGA package supports handheld form factors, while the commercial temperature range covers typical lab environments. Estimated logic utilization for a 16-channel 200 MHz logic analyzer is approximately 9,000 LE.
Recommended
Recommended Products Summary
Engineering reference data for 10M16SCU169C8G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10M16SCU169A7G | 10M16SCU169I7G | 10M16SAU169C8G | 10M08SCU169C8G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 169-ball UFBGA (U169) | 169-ball UFBGA (U169) - same | 169-ball UFBGA (U169) - same | 169-ball UFBGA (U169) - same | 169-ball UFBGA (U169) - same |
| Logic Elements | 16,000 | 16,000 | 16,000 | 16,000 | 8,000 (-50%) |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | -8 | -7 (slower) | -7 (slower) | -8 (same) | -8 (same) |
| User I/O | 130 | 130 | 130 | 130 | 130 |
| Embedded RAM | 549 Kbits | 549 Kbits | 549 Kbits | 549 Kbits | 378 Kbits |
| On-chip Flash | Yes (instant-on) | Yes | Yes | Yes | Yes |
| PLLs | 4 | 4 | 4 | 4 | 2 |
Key Differentiators
- Higher logic element density in same U169 footprint (vs 10M08SCU169C8G)
- Larger embedded memory for buffering (vs 10M08SCU169C8G)
- Four analog PLLs vs two on smaller MAX 10 variants (vs 10M08SCU169C8G)
Design Notes
The 169-ball UFBGA package uses 0.65 mm ball pitch and 11x11 mm body, which demands a 4-layer PCB minimum with laser-drilled microvias (HDI stack-up). Route all signal escapes on the top layer with via-in-pad or short dogbone fan-outs, and allocate the second inner layer as a continuous ground plane directly beneath the device. Maintain a 0.4 mm via-to-pad clearance and use 0.1 mm trace/space design rules for inner layers to keep impedance within +/- 10 percent on 50 ohm single-ended routes. Decoupling requires 0.1 uF and 0.01 uF X7R ceramic capacitors placed within 2 mm of each power pin pair, plus one bulk 10 uF tantalum per power rail at the board edge connector.
Estimated: at the commercial 85C upper limit with the MAX 10 toggling at 50 MHz core and 50 percent I/O toggle rate, the 10M16SCU169C8G dissipates approximately 0.5 W. The U169 UFBGA has a typical theta_JA of 28 C/W on a 4-layer JEDEC test board, giving a junction temperature rise of 14 C above ambient - well within the commercial limit. For sealed enclosures without airflow, derate clock frequency or use the industrial-grade 10M16SCU169I7G if the internal ambient exceeds 70C. Always simulate thermal behavior with the actual PCB copper area before finalizing enclosure design.
Three pitfalls recur in MAX 10 designs: (1) failing to connect all VCCINT and VCCA pins even if some balls appear unused - the internal core logic draws from every pin and floating connections cause partial programming failures; (2) using JTAG chain configurations with TCK slower than 10 MHz, which causes configuration timeouts on the internal flash loader - use a USB-Blaster II or compatible 10 MHz JTAG programmer; (3) assuming the on-chip flash can be re-written indefinitely - the MAX 10 user flash is rated for approximately 1,000 erase/program cycles per sector, so avoid storing frequently updated data in flash and instead use the SRAM for run-time variables.
Compliance Information
RoHS compliance per DigiKey product listing. Commercial temperature grade - not AEC-Q100 qualified; select MAX 10 variants with 'A' suffix for automotive applications. Halogen-free status not explicitly stated in the verified web data.
