10M25SCE144I7G - MAX 10 FPGA 25K LE 144-LQFP | Intel
Référence : 10M25SCE144I7G ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $11.57 | $11,57 |
| 10 | $10.85 | $108,50 |
| 100 | $9.95 | $995,00 |
| 500 | $9.1 | $4 550,00 |
| 1 000 | $8.25 | $8 250,00 |
10M25SCE144I7G Présentation
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated I/O and memory resources that an engineer can reconfigure post-manufacture to implement custom digital logic, glue logic, state machines, signal processing pipelines, or hardware accelerators. Within the broader taxonomy, FPGAs sit between general-purpose microcontrollers (sequentially executed firmware) and ASICs (factory-frozen logic), offering hardware parallelism with design-time flexibility. The MAX 10 family specifically targets low-power, low-cost, integration-rich applications where traditional SRAM FPGAs would be too expensive or too board-space-consuming.
Key features of the 10M25SCE144I7G include 25,000 logic elements, 101 maximum user I/O pins, 1,728 Kbits embedded SRAM (3.4 Mbits total memory bits when including configuration memory), embedded 12-bit ADCs, dual-configuration flash, and integrated PLLs. The device operates from a 1.2V core supply with 3.3V/2.5V/1.8V/1.5V LVCMOS/LVTTL/LVDS I/O standards. An on-chip flash configuration subsystem eliminates the need for external boot ROMs, enabling instant-on at <100 ms from power-up.
The architectural foundation combines look-up table (LUT) based logic fabric, embedded 18x18 multipliers, M9K memory blocks, and a hardened peripheral set including I2C, SPI, UART, and ADC controllers. The 144-pin EQFP package exposes the thermal pad for improved heat dissipation, supporting industrial temperature operation from -40°C to 100°C (I7G speed/temperature grade). Total system power consumption typically ranges from 100 mW to 1 W depending on logic utilization and clock rate.
Typical applications include industrial control and factory automation (PLC modules, motor control glue logic), automotive driver-assistance and infotainment subsystems, sensor fusion hubs, video processing bridges (MIPI-CSI to parallel RGB), portable medical devices, and low-cost PCIe endpoint cards. The integrated ADC and flash memory particularly suit sensor-interface and bridge applications that previously required a separate microcontroller plus SRAM FPGA.
When designing with the 10M25SCE144I7G, plan for the 1.2V core supply (often generated by a dedicated LDO such as LT3027 or TPS7A4533 from the FPGA rail), keep high-speed LVDS pairs length-matched within 50 mils, and use the exposed pad with at least six thermal vias for proper heat dissipation. Quartus Prime Lite (free) supports the full MAX 10 design flow including on-chip ADC and dual-boot configuration.
Alternatives de remplacement direct pour 10M25SCE144I7G — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10M25SCE144I7G (même facteur de forme et même empreinte) — différant par Package, Process Technology, Configuration Memory, Logic Elements (LE), User Flash Memory.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10M25SCE144C8G
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
10M25SCE144A7G
✅ Remplacement direct✓ En stock
$47.21 / unité
Voir la fiche technique →10M25SCE144I7G Valeurs maximales et caractéristiques électriques
| Family | MAX 10 |
| Logic Elements (LE) | 25,000 |
| Embedded Memory | 1,728 Kbits |
| Maximum User I/O | 101 |
| Maximum User I/O Pins (DigiKey) | 101 |
| Total Memory Bits (with config) | 6,912,000 (691,200 per LCSC; total includes flash) |
| Process Technology | TSMC 55nm embedded flash |
| Core Supply Voltage | 1.2 V |
| I/O Standards | LVCMOS, LVTTL, LVDS, SSTL |
| Boîtier | 144-pin EQFP (LQFP with exposed pad) |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40C to +100C (Industrial) |
| Speed/Grade | I7G (industrial, 7 speed grade) |
| Embedded ADC | Yes (12-bit, dual SAR) |
| Embedded Multipliers (18x18) | Yes |
| Configuration Memory | Internal flash (dual configuration) |
| Niveau MSL | 3 (per JEDEC J-STD-020) |
| Statut RoHS | Compliant |
| Lead-Free / Halogen-Free | Yes |
Configuration des broches de 10M25SCE144I7G
| Broche 1 | IO — User I/O bank 1 |
| Broche 2 | IO — User I/O bank 1 |
| Broche 3 | VCCIO1 — I/O supply bank 1 (1.2V-3.3V) |
| Broche 4 | GND — Ground |
| Broche 5 | VCCA — Analog supply (2.5V) for ADC/PLL |
| Broche 6 | IO — User I/O bank 1 |
| Broche 7 | IO — User I/O bank 1 |
| Broche 8 | IO — User I/O bank 1 |
| Broche 9 | IO — User I/O bank 1 |
| Broche 10 | GND — Ground |
| Broche 11 | VCCINT — Core supply (1.2V) |
| Broche 12 | IO — User I/O bank 1 |
| Broche 13 | IO — User I/O bank 1 |
| Broche 14 | IO — User I/O bank 1 |
| Broche 15 | IO — User I/O bank 1 |
| Broche 16 | GND — Ground |
| Broche 17 | IO — User I/O bank 1 |
| Broche 18 | IO — User I/O bank 1 |
| Broche 19 | IO — User I/O bank 1 |
| Broche 20 | VCCIO1 — I/O supply bank 1 (1.2V-3.3V) |
| Broche 21 | IO — User I/O bank 1 |
| Broche 22 | IO — User I/O bank 1 |
| Broche 23 | GND — Ground |
| Broche 24 | IO — User I/O bank 1 |
| Broche 25 | IO — User I/O bank 1 |
| Broche 26 | VCCA — Analog supply (2.5V) |
| Broche 27 | IO — User I/O bank 2 |
| Broche 28 | IO — User I/O bank 2 |
| Broche 29 | IO — User I/O bank 2 |
| Broche 30 | VCCIO2 — I/O supply bank 2 (1.2V-3.3V) |
| Broche 31 | GND — Ground |
| Broche 32 | IO — User I/O bank 2 |
| Broche 33 | IO — User I/O bank 2 |
| Broche 34 | IO — User I/O bank 2 |
| Broche 35 | IO — User I/O bank 2 |
| Broche 36 | VCCINT — Core supply (1.2V) |
| Broche 37 | IO — User I/O bank 2 |
| Broche 38 | IO — User I/O bank 2 |
| Broche 39 | GND — Ground |
| Broche 40 | IO — User I/O bank 2 |
| Broche 41 | IO — User I/O bank 2 |
| Broche 42 | IO — User I/O bank 2 |
| Broche 43 | VCCIO2 — I/O supply bank 2 (1.2V-3.3V) |
| Broche 44 | IO — User I/O bank 2 |
| Broche 45 | IO — User I/O bank 2 |
| Broche 46 | GND — Ground |
| Broche 47 | IO — User I/O bank 2 |
| Broche 48 | IO — User I/O bank 2 |
| Broche 49 | VCCA — Analog supply (2.5V) |
| Broche 50 | IO — User I/O bank 3 |
| Broche 51 | IO — User I/O bank 3 |
| Broche 52 | IO — User I/O bank 3 |
| Broche 53 | VCCIO3 — I/O supply bank 3 (1.2V-3.3V) |
| Broche 54 | GND — Ground |
| Broche 55 | IO — User I/O bank 3 |
| Broche 56 | IO — User I/O bank 3 |
| Broche 57 | IO — User I/O bank 3 |
| Broche 58 | IO — User I/O bank 3 |
| Broche 59 | VCCINT — Core supply (1.2V) |
| Broche 60 | IO — User I/O bank 3 |
| Broche 61 | IO — User I/O bank 3 |
| Broche 62 | GND — Ground |
| Broche 63 | IO — User I/O bank 3 |
| Broche 64 | IO — User I/O bank 3 |
| Broche 65 | IO — User I/O bank 3 |
| Broche 66 | VCCIO3 — I/O supply bank 3 (1.2V-3.3V) |
| Broche 67 | IO — User I/O bank 3 |
| Broche 68 | IO — User I/O bank 3 |
| Broche 69 | GND — Ground |
| Broche 70 | IO — User I/O bank 3 |
| Broche 71 | IO — User I/O bank 3 |
| Broche 72 | VCCA — Analog supply (2.5V) |
| Broche 73 | IO — User I/O bank 4 |
| Broche 74 | IO — User I/O bank 4 |
| Broche 75 | IO — User I/O bank 4 |
| Broche 76 | VCCIO4 — I/O supply bank 4 (1.2V-3.3V) |
| Broche 77 | GND — Ground |
| Broche 78 | TCK — JTAG test clock |
| Broche 79 | TMS — JTAG test mode select |
| Broche 80 | TDI — JTAG test data in |
| Broche 81 | TDO — JTAG test data out |
| Broche 82 | nSTATUS — Configuration status (open-drain) |
| Broche 83 | nCONFIG — Configuration start (active low) |
| Broche 84 | CONF_DONE — Configuration complete (open-drain) |
| Broche 85 | CLK0 — Dedicated clock input 0 |
| Broche 86 | CLK1 — Dedicated clock input 1 |
| Broche 87 | CLK2 — Dedicated clock input 2 |
| Broche 88 | CLK3 — Dedicated clock input 3 |
| Broche 89 | VCCINT — Core supply (1.2V) |
| Broche 90 | GND — Ground |
| Broche 91 | IO — User I/O bank 4 |
| Broche 92 | IO — User I/O bank 4 |
| Broche 93 | IO — User I/O bank 4 |
| Broche 94 | VCCIO4 — I/O supply bank 4 (1.2V-3.3V) |
| Broche 95 | IO — User I/O bank 4 |
| Broche 96 | IO — User I/O bank 4 |
| Broche 97 | GND — Ground |
| Broche 98 | IO — User I/O bank 4 |
| Broche 99 | IO — User I/O bank 4 |
| Broche 100 | IO — User I/O bank 4 |
| Broche 101 | IO — User I/O bank 4 |
| Broche 102 | VCCINT — Core supply (1.2V) |
| Broche 103 | IO — User I/O bank 5 |
| Broche 104 | IO — User I/O bank 5 |
| Broche 105 | IO — User I/O bank 5 |
| Broche 106 | VCCIO5 — I/O supply bank 5 (1.2V-3.3V) |
| Broche 107 | GND — Ground |
| Broche 108 | IO — User I/O bank 5 |
| Broche 109 | IO — User I/O bank 5 |
| Broche 110 | IO — User I/O bank 5 |
| Broche 111 | IO — User I/O bank 5 |
| Broche 112 | VCCA — Analog supply (2.5V) |
| Broche 113 | IO — User I/O bank 5 |
| Broche 114 | IO — User I/O bank 5 |
| Broche 115 | GND — Ground |
| Broche 116 | IO — User I/O bank 5 |
| Broche 117 | IO — User I/O bank 5 |
| Broche 118 | IO — User I/O bank 5 |
| Broche 119 | VCCIO5 — I/O supply bank 5 (1.2V-3.3V) |
| Broche 120 | IO — User I/O bank 5 |
| Broche 121 | IO — User I/O bank 5 |
| Broche 122 | GND — Ground |
| Broche 123 | IO — User I/O bank 5 |
| Broche 124 | IO — User I/O bank 5 |
| Broche 125 | VCCA — Analog supply (2.5V) |
| Broche 126 | IO — User I/O bank 6 |
| Broche 127 | IO — User I/O bank 6 |
| Broche 128 | IO — User I/O bank 6 |
| Broche 129 | VCCIO6 — I/O supply bank 6 (1.2V-3.3V) |
| Broche 130 | GND — Ground |
| Broche 131 | IO — User I/O bank 6 |
| Broche 132 | IO — User I/O bank 6 |
| Broche 133 | IO — User I/O bank 6 |
| Broche 134 | IO — User I/O bank 6 |
| Broche 135 | VCCINT — Core supply (1.2V) |
| Broche 136 | IO — User I/O bank 6 |
| Broche 137 | IO — User I/O bank 6 |
| Broche 138 | GND — Ground |
| Broche 139 | IO — User I/O bank 6 |
| Broche 140 | IO — User I/O bank 6 |
| Broche 141 | IO — User I/O bank 6 |
| Broche 142 | VCCIO6 — I/O supply bank 6 (1.2V-3.3V) |
| Broche 143 | IO — User I/O bank 6 |
| Broche 144 | IO — User I/O bank 6 / Exposed Pad for thermal dissipation |
Applications typiques
10M25SCE144I7G convient pour 6 applications: Industrial PLC / Distributed I/O Module, Sensor Fusion / Industrial IoT Bridge, Video Protocol Bridge (MIPI / LVDS / Parallel RGB), Brushless DC (BLDC) Motor Drive Co-Processor, Portable Medical Device Interface, Automotive Driver-Assistance / Infotainment Subsystem.
Industrial PLC / Distributed I/O Module
The 10M25SCE144I7G is well-suited for industrial PLCs and distributed I/O modules because its 25,000 logic elements and 101 user I/O pins provide enough logic density to execute IEC 61131-3 ladder/logic programs while exposing enough parallel pins for sensor interfacing. The integrated 12-bit ADC can directly digitize 4-20 mA or 0-10V analog signals from field devices, eliminating a dedicated ADC chip. Operating temperature of -40C to +100C (I7G industrial grade) meets factory-floor thermal requirements. Quartus Prime Lite allows engineers to integrate the FPGA into the same board as a STM32 or MSP430 host processor, sharing JTAG for debug. Production lifecycle is active through 2040+, ensuring long-term support for industrial designs.
Recommandé
Sensor Fusion / Industrial IoT Bridge
The 10M25SCE144I7G can aggregate multiple sensor interfaces (SPI, I2C, UART) and forward pre-processed data to a host MCU over a single high-speed link. Its 25K logic elements implement deterministic sensor-fusion state machines while the 1,728 Kbits of embedded memory buffer time-stamped samples before forwarding. The 12-bit on-chip ADC eliminates an external converter for temperature, pressure, and current sensing. Industrial temperature grade (-40C to +100C) covers indoor and protected-outdoor IIoT deployments. Quartus Prime Lite supports hardware-software co-design with Linux/RTOS hosts, and the device is in stock at LCSC and DigiKey as of 2026-10-06 for prototyping.
Recommandé
Video Protocol Bridge (MIPI / LVDS / Parallel RGB)
The 10M25SCE144I7G delivers up to 25K logic elements capable of running 24-bit color-space conversion, deinterlacing, and timing-controller logic in mid-resolution video bridges. Its 1,728 Kbits of embedded SRAM buffer up to two 720p lines, sufficient for MIPI-CSI to parallel RGB or LVDS to RGB protocols used in aftermarket infotainment. The on-chip PLL generates pixel clocks up to 148.5 MHz, supporting 720p60 and 1080p30 with reduced blanking. Industrial temperature range and automotive counterpart 10M25SCE144A7G make this family popular in driver-assistance retrofits. Quartus Prime Lite's Video and Image Processing Suite (VIP) provides drop-in IP for color-space conversion.
Recommandé
Brushless DC (BLDC) Motor Drive Co-Processor
The 10M25SCE144I7G can act as a co-processor to a microcontroller in BLDC and PMSM motor drives, implementing field-oriented control (FOC) and trapezoidal commutation with deterministic hardware latency. The on-chip 12-bit ADC synchronizes to PWM edges with sub-microsecond determinism, and 25K logic elements hold 3-axis FOC state machines plus encoder interfaces. Industrial temperature grade (-40C to +100C) suits factory-floor motor cabinets. Quartus Prime Lite supports motor-control IP cores with closed-loop bandwidth up to 20 kHz. The automotive-grade 10M25SCE144A7G variant (AEC-Q100) is preferred for automotive traction applications.
Recommandé
Portable Medical Device Interface
The 10M25SCE144I7G can implement a portable medical device front-end (e.g. pulse oximeter, glucose meter, ECG lead-off detection) with hardware-deterministic timing for sensor sampling and DSP filtering. Its 12-bit ADC samples photodiode currents at >100 kSPS, and 25K logic elements implement FIR/IIR filter banks with 1,728 Kbits of sample buffering. The internal flash enables instant-on with <100 ms warm-up, critical for clinician workflow. Industrial temperature grade covers clinical environment. Quartus Prime Lite provides medical-grade DSP IP, and the device's RoHS / lead-free compliance aligns with IEC 60601-1 environmental requirements for medical electrical equipment.
Recommandé
Automotive Driver-Assistance / Infotainment Subsystem
The 10M25SCE144I7G (and its automotive-grade twin 10M25SCE144A7G) suits entry-level ADAS sensor aggregation (e.g. ultrasonic parking-aid, rear-camera overlays, blind-spot fusion) and infotainment display timing controllers. Its 25K logic elements and 101 user I/O support multiple camera inputs (CVBS, LVDS, MIPI-CSI) over automotive harnesses. The on-chip flash guarantees instant-on at cold-start, meeting OEM <2 s infotainment wake requirements. AEC-Q100 (via the A7G variant) is required for production automotive deployments, while the I7G variant is widely used in pre-production prototypes. Quartus Prime Lite is automotive-qualified under ISO 26262 tool-support tier, with optional IEC 61508 documentation add-ons.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10M25SCE144I7G — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10M25SCE144C8G | 10M25SCE144A7G | 10M50SCE144I7G |
|---|---|---|---|---|
| Package | 144-pin EQFP | 144-pin EQFP (same) | 144-pin EQFP (same) | 144-pin EQFP (same package) |
| Brand | Intel | Intel | Intel | Intel |
| Logic Elements | 25,000 | 25,000 (same) | 25,000 (same) | 50,000 (+100%) |
| Embedded Memory | 1,728 Kbits | 1,728 Kbits (same) | 1,728 Kbits (same) | 1,638 Kbits (similar) |
| User I/O | 101 | 101 (same) | 101 (same) | 101 (same) |
| Temperature Grade | Industrial -40C to +100C | Commercial 0C to +85C | Automotive -40C to +125C | Industrial -40C to +100C |
| Automotive (AEC-Q100) | No (industrial I7G) | No (commercial) | Yes (AEC-Q100) | No (industrial) |
| On-chip Flash Configuration | Yes (dual-image) | Yes (same) | Yes (same) | Yes (same) |
| Embedded ADC | 12-bit, dual SAR | 12-bit dual SAR (same) | 12-bit dual SAR (same) | 12-bit dual SAR (same) |
| Approx. Unit Price (qty 1) | $11.57 | $10-12 (typical) | $14-17 (typical) | $25-30 (typical) |
Principaux différenciateurs
- On-chip non-volatile flash configuration (vs LCMXO2-7000HC (Lattice MachXO2))
- Integrated 12-bit dual-SAR ADC (vs Cyclone 10 LP (Intel))
- Higher logic density (25K LE) at lower cost (vs 10M08SCE144I7G (8K LE variant))
- Single-chip instant-on at <100 ms (vs iCE40HX1K (Lattice))
- 144-pin EQFP exposed-pad package for hand-soldering (vs 10M25SCF256I7G (BGA-256))
Notes de conception
Estimated: at 100% logic utilization with 148.5 MHz pixel clock, total power consumption is approximately 1.0-1.5 W. VCCINT (1.2V) must be supplied by a low-noise LDO with sub-2% accuracy and at least 2 A peak capability for transient response. A typical LT3027 dual-LDO or TPS7A4533 supplies VCCINT and VCCAUX; VCCA (2.5V for ADC/PLL) requires analog-isolated routing. Decoupling: place 0.1 uF X7R + 10 uF bulk on every VCCINT/VCCIO/VCCA pin within 5 mm of the pad. The exposed thermal pad requires at least six thermal vias (0.3 mm drill, 1 mm pitch) into an unbroken inner ground plane.
High-speed LVDS pairs must be length-matched within 50 mils (1.27 mm) with continuous reference-ground plane. Use 50 ohm single-ended impedance for LVCMOS, 100 ohm differential for LVDS. Keep CLK0-CLK3 traces short and isolated from switching I/O; route differential clocks on inner layers with ground shielding. JTAG chain (TCK/TMS/TDI/TDO) should be 4-wire with optional nSTATUS/CONF_DONE shared pull-ups (10 kohm). Ground the exposed pad with stitched vias. Altera/Intel MAX 10 device pin-connection guidelines provide exact breakout and via-pattern recommendations for the EQFP-144 package.
Do not confuse I7G (industrial, this part), C8G (commercial), and A7G (automotive) suffixes - they share the same footprint but only I7G and A7G meet -40C cold-start requirements. Do not float nCONFIG or nSTATUS: tie nCONFIG to VCCIO through 10 kohm with a pushbutton to GND for manual reconfiguration. Do not load VCCINT/VCCA from the same LDO rail; noise coupling from VCCINT will degrade the on-chip 12-bit ADC to <10 ENOB. Do not exceed 3.6V on any VCCIO pin (absolute max). Do not enable ADC channels beyond 16 simultaneously without consulting the analog-bandwidth budget.
Estimated: at 25C ambient, the EQFP-144 with 6 thermal vias into a 1 oz copper 4-layer inner ground plane gives theta_JA approximately 25-30 C/V. Continuous 1.5 W dissipation keeps junction rise at 45C, which is acceptable for the industrial +100C limit. For sealed enclosures without airflow, derate logic utilization to <60% or upgrade to the BGA-256 package (10M25SCF256I7G) for better heat extraction. Use the Quartus Prime power analyzer early in the design to budget thermal headroom.
Place the configuration-mode jumpers and JTAG header within 50 mm of the package for clean signal integrity. Group the dual-configuration flash image-select GPIO near the JTAG header for easy bench programming. Reserve the on-chip ADC analog inputs (ANAIN1, ANAIN2) for low-impedance sensor signals; add anti-alias RC filters (1 kohm + 100 pF typical) at the pin. Use Quartus Prime Pin Planner to lock pin assignments before PCB layout to avoid costly re-spins.
Informations de conformité
RoHS and lead-free compliant per Intel/Altera product page. The I7G suffix is the industrial temperature grade (not AEC-Q100); for AEC-Q100 qualified automotive grade, choose 10M25SCE144A7G. Package moisture sensitivity level MSL-3 per JEDEC J-STD-020.
