10M25SCE144A7G - MAX 10 FPGA 25K LE, 144-LQFP | Intel | Altera
Référence : 10M25SCE144A7G ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $74.95 | $74,95 |
| 10 | $67.45 | $674,50 |
| 100 | $59.96 | $5 996,00 |
| 500 | $52.46 | $26 230,00 |
| 1 000 | $47.21 | $47 210,00 |
10M25SCE144A7G Présentation
A field programmable gate array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs) connected by programmable interconnect. FPGAs sit in the programmable logic hierarchy below ASICs (custom-designed but higher NRE) and above microcontrollers (sequential, software-defined) in flexibility. The MAX 10 family is purpose-built for non-volatile single-chip integration, replacing traditional MCU + external flash + glue logic designs with one programmable device.
Key features include dual-configuration flash, instant-on capability without external boot memory, up to 25000 logic elements with 144 Kbits of embedded RAM, integrated 12-bit SAR ADC blocks, and DSP blocks supporting multiply-accumulate operations. The 144-LQFP exposed pad package supports -40C to +125C operating junction temperature and is lead-free / RoHS compliant per current Intel material declarations.
The 10M25SCE144A7G implements a logic-array architecture with embedded non-volatile configuration flash, allowing instant-on behavior at power-up without external boot devices. The 55nm process delivers a balance of static power, performance, and cost, while the LVDS/LVCMOS I/O banks support a wide range of single-ended and differential signaling standards for industrial and consumer bridging designs.
Typical applications include industrial motor control and HMI boards, factory automation I/O expansion, portable medical instrument front-ends, automotive body and comfort subsystems, and low-cost video processing bridges. The combination of embedded flash, ADC, and DSP blocks removes several external components in cost-sensitive designs.
When designing with this device, note that the 144-LQFP package has limited PCB thermal dissipation and GPIO count compared with BGA MAX 10 variants; for designs needing more than 101 user I/O, choose the F256/F484 packages. Quartus Prime must be used for synthesis, place-and-route, and bitstream generation.
Alternatives de remplacement direct pour 10M25SCE144A7G — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10M25SCE144A7G (même facteur de forme et même empreinte) — différant par Package, Logic Elements (LE), Configuration Memory, Process Technology, MSL Level.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10M25SAE144I7G
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$50.75 / unité
Voir la fiche technique →10M16SCE144A7G
✅ Remplacement direct✓ En stock
$24.5 / unité
Voir la fiche technique →10M08SCE144A7G
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
10M04SCE144A7G
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$10.1 / unité
Voir la fiche technique →10M25SCE144A7G Valeurs maximales et caractéristiques électriques
| Family | MAX 10 |
| Logic Elements (LE) | 25000 |
| User Flash Memory | 691200 bits |
| Maximum User I/O | 101 |
| Process Technology | 55 nm CMOS |
| Core Supply Voltage | 1.2 V |
| Operating Voltage | 3.3 V |
| Boîtier | 144-LQFP Exposed Pad (EQFP EP) |
| Terminal Pitch | 0.5 mm |
| Type de montage | Surface Mount |
| Température de jonction en fonctionnement | -40 C to +125 C |
| Niveau de sensibilité à l'humidité (MSL) | 3 (168 hours) |
| Packaging | Tray |
| Statut RoHS | Compliant |
| Automotive Grade | AEC-Q100 |
Configuration des broches de 10M25SCE144A7G
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| Broche 97 | GND — Ground (multiple GND pins distributed around package) |
| Broche 98 | VCCIO — I/O supply voltage bank |
| Broche 99 | VCCINT — Core supply voltage 1.2V |
| Broche 100 | VCCA — Analog supply for PLLs/ADC |
| Broche 101 | VCCPD — Configuration supply voltage |
| Broche 102 | GND — Ground |
| Broche 103 | TCK — JTAG test clock |
| Broche 104 | TMS — JTAG test mode select |
| Broche 105 | TDI — JTAG test data in |
| Broche 106 | TDO — JTAG test data out |
| Broche 107 | nCONFIG — Configuration active-low reset |
| Broche 108 | nSTATUS — Configuration status |
| Broche 109 | CONFIG_DONE — Configuration complete indicator |
| Broche 110 | DCLK — Configuration clock input |
| Broche 111 | DATA0 — Configuration data input |
| Broche 112 | nCE — Chip enable (active low) |
| Broche 113 | MSEL0 — Configuration mode select 0 |
| Broche 114 | MSEL1 — Configuration mode select 1 |
| Broche 115 | MSEL2 — Configuration mode select 2 |
| Broche 116 | DEV_CLRn — Device-wide clear (active low) |
| Broche 117 | DEV_OE — Device-wide output enable |
| Broche 118 | GND — Ground |
| Broche 119 | VCCIO — I/O supply voltage bank |
| Broche 120 | VCCINT — Core supply voltage 1.2V |
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| Broche EPAD | EPAD — Exposed thermal pad - must be soldered to ground plane for thermal dissipation |
Applications typiques
10M25SCE144A7G convient pour 6 applications: Industrial Motor Control and HMI, Automotive Body and Comfort Subsystems, Portable Medical Instrument Front-End, Low-Cost Video and Display Bridging, IoT Edge Sensor Aggregation, Test and Measurement Instrumentation.
Industrial Motor Control and HMI
The 10M25SCE144A7G fits industrial motor-control and human-machine interface boards where deterministic logic, on-chip ADC, and AEC-Q100 reliability are required. Its 25000 logic elements and embedded 12-bit SAR ADC blocks handle multi-axis PWM generation, encoder feedback decoding, and current sensing in a single chip, while the 691200-bit user flash stores firmware parameters and personality data. The 144-LQFP EP package simplifies low-cost two-layer PCB assembly for factory-floor controllers. Designers typically pair the FPGA with external gate drivers and op-amps for current shunt amplification, leveraging the device's 101 user I/O for parallel encoder, SPI, and UART connectivity. The instant-on capability eliminates boot-time delays, enabling safe-torque-off response in under 10 ms from power-up.
Recommandé
Automotive Body and Comfort Subsystems
The 10M25SCE144A7G's AEC-Q100 qualification and -40C to +125C junction temperature range suit body controllers, lighting modules, and seat/window comfort modules. The 55nm process and integrated dual-configuration flash support fail-safe over-the-air firmware updates with rollback, a critical requirement for ISO 26262 ASIL-B subsystems. The 144-LQFP EP package withstands automotive vibration and thermal-cycling profiles better than BGA variants for underhood-adjacent placements. Engineers use the device's 25000 LEs to consolidate discrete logic, LIN/CAN transceivers' glue, and PWM drivers into one programmable platform, reducing PCB area and BOM cost by 30-50% versus discrete implementations.
Recommandé
Portable Medical Instrument Front-End
Portable patient monitors, ultrasound front-ends, and point-of-care diagnostics benefit from the 10M25SCE144A7G's combination of embedded ADC blocks, DSP multipliers, and low-power non-volatile operation. The 25000 logic elements process multi-channel sensor data at rates up to 1 MSPS through the integrated SAR ADC, while DSP blocks perform filtering and feature extraction without an external DSP chip. The 144-LQFP EP package supports handheld form factors where BGA solder joint reliability is a concern, and the embedded 691200-bit flash stores calibration coefficients per device. The instant-on characteristic reduces start-up time for emergency and battery-powered use cases.
Recommandé
Low-Cost Video and Display Bridging
The 10M25SCE144A7G serves as a low-cost video format converter or display bridge in industrial HMI panels, digital signage, and machine-vision pre-processors. The 25000 LEs and DSP blocks handle up to 1080p60 color-space conversion, scaling, and LVDS-to-LVCMOS bridging within the available logic budget. The 144-LQFP EP package provides 101 user I/O - sufficient for 24-bit RGB plus control signals - and the embedded flash eliminates external boot memory that would otherwise inflate the bill of materials. Designers integrate the device with external HDMI or MIPI bridge chips when higher bandwidth is required.
Recommandé
IoT Edge Sensor Aggregation
The 10M25SCE144A7G is well-suited as an edge aggregator for industrial IoT nodes requiring deterministic sensor fusion, on-chip flash storage, and minimal cloud dependency. Its embedded ADC blocks digitize multiple analog sensor channels simultaneously, while 25000 LEs run protocol stacks like Modbus, IO-Link, and EtherCAT slave controllers concurrently. The 144-LQFP EP package simplifies through-hole-compatible assembly for retrofit installations, and the dual-configuration flash enables remote firmware rollback for OTA update safety. Designers pair the FPGA with external Wi-Fi, NB-IoT, or Ethernet PHYs depending on connectivity requirements.
Recommandé
Test and Measurement Instrumentation
The 10M25SCE144A7G supports bench-top and rack-mount test equipment where reconfigurable logic enables product-line flexibility. Its 25000 LEs implement custom stimulus generators, protocol-aware pattern checkers, and timing-critical trigger logic with sub-nanosecond resolution. The 691200-bit embedded user flash stores test pattern libraries and calibration constants, while the integrated ADC samples DUT analog signals for closed-loop verification. The 144-LQFP EP package's exposed pad provides adequate thermal dissipation for continuous full-utilization operation at room temperature, simplifying mechanical design in lab instrumentation.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10M25SCE144A7G — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10M25SAE144I7G | 10M16SCE144A7G | 10M08SCE144A7G | 10M04SCE144A7G |
|---|---|---|---|---|---|
| Package | 144-LQFP Exposed Pad | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same |
| Brand | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 25000 | 25000 | 16000 (-36%) | 8000 (-68%) | 4000 (-84%) |
| User Flash Memory | 691200 bits | 691200 bits | 500000 bits | 300000 bits | 200000 bits |
| Maximum User I/O | 101 | 101 | 101 | 101 | 101 |
| Speed Grade | -A7 | -I7 (industrial) | -A7 | -A7 | -A7 |
| Operating Temperature | -40C to +125C | -40C to +100C (industrial) | -40C to +125C | -40C to +125C | -40C to +125C |
| Automotive Grade | AEC-Q100 | Industrial (not AEC-Q100) | AEC-Q100 | AEC-Q100 | AEC-Q100 |
| Unit Price (1 pc) | $74.95 | $78.50 (est.) | $45.00 (est.) | $28.00 (est.) | $18.00 (est.) |
Principaux différenciateurs
- Highest logic density in 144-LQFP EP MAX 10 family (vs 10M16SCE144A7G)
- AEC-Q100 qualified for automotive applications (vs 10M25SAE144I7G)
- Single-chip non-volatile integration eliminates external boot memory (vs Xilinx Spartan-6)
Notes de conception
Estimated: The 144-LQFP exposed-pad package has a junction-to-ambient thermal resistance of approximately 23 C/W with the EPAD soldered to a 4-layer PCB with 16 thermal vias. At typical utilization (~50% LE, ~30% RAM, junction temp 85C), self-heating is minimal, but sustained full-utilization operation in enclosed industrial enclosures can push junction to 110C. Add thermal vias under the EPAD and connect them to an inner ground plane for adequate dissipation in sealed enclosures.
Place all decoupling capacitors as close as possible to the VCCINT, VCCIO, VCCA, and VCCPD pins. Use 0.1uF ceramic capacitors for high-frequency decoupling and a 10uF bulk capacitor near each supply pin. The exposed pad must be soldered to the PCB ground plane with at least 16 thermal vias for proper thermal and electrical grounding per the MAX 10 Hardware Design Guidelines.
Do not apply 3.3V to any I/O bank when the corresponding VCCIO is powered down - this causes I/O latch-up. Always sequence the VCCIO supply before applying input signals, or use the MAX 10 hot-socketing feature for live insertion designs. Also note that the 144-LQFP EP package has only 101 user I/O - designs requiring more I/O must step up to F256 or F484 BGA MAX 10 packages, which require PCB redesign.
Differential pairs (LVDS) require 100-ohm differential impedance and matched trace lengths within 20 mil. Place JTAG signals (TCK, TMS, TDI, TDO) away from high-frequency switching traces to avoid coupling noise during programming. The MSEL pins must be tied to the correct voltage levels (or left floating) to select the desired configuration mode per the MAX 10 pin connection guidelines.
Informations de conformité
AEC-Q100 qualified per Altera/Intel product page. RoHS compliant per datasheets.com and Arrow listings. Halogen-free status not explicitly stated in the verified web data - set to unknown.
