10M50DCF256A7G - MAX 10 FPGA, 50K LE, 256-FBGA | Intel
Référence : 10M50DCF256A7G ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $44.87 | $44,87 |
| 10 | $41.2 | $412,00 |
| 100 | $37.55 | $3 755,00 |
| 500 | $33.1 | $16 550,00 |
| 1 000 | $29.8 | $29 800,00 |
10M50DCF256A7G Présentation
A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic fabric, interconnect, and I/O can be programmed by the end user after manufacture. FPGAs sit in the programmable-logic hierarchy between fixed-function ASICs and software-driven microcontrollers: an FPGA delivers hardware-timed parallelism and deterministic latency that microcontrollers cannot, while remaining re-spinable like software. Within Intel's portfolio, the MAX 10 family is a non-volatile, low-cost, single-chip tier positioned above CPLDs and below Cyclone/Cyclone V in density, and is built on a 55 nm TSMC process node.
Key feature of this OPN is its on-chip flash configuration memory: unlike SRAM-based FPGAs that require an external boot PROM, the 10M50DCF256A7G stores its configuration in 1,677,312 bits of embedded flash, enabling instant-on single-chip operation. Additional features include an integrated 12-bit ADC, on-chip temperature-sensing diode, 178 GPIO supporting LVDS/LVCMOS/LVTTL, 4 x PLL, and an integrated 1.2 V core with 3.0/3.3 V-tolerant I/O banks for single-supply or dual-supply operation.
The MAX 10 architecture combines a LAB-based logic fabric (50K LE), 9 Kbit M9K SRAM blocks, 144 x 18 x 18 hardware multipliers, and a flash-backed configuration subsystem. The DCF256 speed grade targets industrial-grade -40 C to +85 C operation, and the 1.0 mm pitch FBGA is a mainstream JEDEC-compliant footprint that PCB designers can route with standard 4-layer stack-ups.
Typical applications include industrial motor control and IO-Link bridges, factory automation PLCs, low-cost video processing for machine vision, protocol bridging (UART/SPI/I2C to Ethernet), and low-volume prototyping that would otherwise justify an ASIC. The integrated ADC and flash also make it a fit for system-management and power-sequencing designs.
When designing with this device, confirm that Quartus Prime (Lite or Standard edition) supports the 10M50DCF256 device symbol and plan JTAG/AS configuration header access for in-system reprogramming. The 1.0 mm pitch FBGA requires NSMD pads with via-in-pad or dog-bone fan-out; verify PCB fab capabilities before committing to layout.
This page synthesizes distributor pricing, drop-in MAX 10 pin-compatible alternatives, and practical board-level design notes that go beyond the manufacturer ordering guide.
Alternatives de remplacement direct pour 10M50DCF256A7G — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10M50DCF256A7G (même facteur de forme et même empreinte) — différant par Package, Process Technology, Logic Elements (LE), Operating Temperature, Speed Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10M25DCF256A7G
✅ Remplacement direct✓ En stock
$42.84 / unité
Voir la fiche technique →10M16DCF256A7G
✅ Remplacement direct✓ En stock
$37.2 / unité
Voir la fiche technique →10M08DCF256A7G
✅ Remplacement direct✓ En stock
$15.2 / unité
Voir la fiche technique →10M04DCF256A7G
✅ Remplacement direct✓ En stock
$11.1 / unité
Voir la fiche technique →10M50DAF256I7G
✅ Remplacement direct✓ En stock
$155.2 / unité
Voir la fiche technique →10M50DAF256C7G
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
10M50DCF256A7G Valeurs maximales et caractéristiques électriques
| Family | MAX 10 |
| Logic Elements (LE) | 50,000 |
| User Flash Memory | 1,677,312 bits |
| User I/O Count | 178 |
| Boîtier | 256-ball FBGA (F256), 17 x 17 mm, 1.0 mm pitch |
| Process Node | 55 nm |
| Core Voltage | 1.2 V |
| I/O Bank Voltages | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V |
| Température de fonctionnement | -40 C to +85 C (industrial) |
| Speed Grade | 7 (DCF = dual-supply, commercial/industrial) |
| Embedded Memory | M9K blocks, 9 Kbits each |
| Embedded Multipliers | 144 x 18 x 18 |
| PLL | 4 |
| On-chip ADC | 12-bit, 1 MSPS, 16 channels |
| Configuration | Internal flash (single-chip, instant-on) |
| Type de montage | Surface Mount (BGA) |
| Statut RoHS | Compliant |
| Niveau MSL | 3 (168 hours) |
Guide de configuration des broches du 10M50DCF256A7G 256-ball fbga (f256), 17 x 17 mm, 1.0 mm pitch
Configuration des broches du 10M50DCF256A7G (boîtier 256-ball fbga (f256), 17 x 17 mm, 1.0 mm pitch). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour 10M50DCF256A7G.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
10M50DCF256A7G convient pour 6 applications: Industrial Motor Control and IO-Link Master, Factory Automation PLC and Edge Gateway, Low-Cost Video Processing and Machine Vision, Protocol Bridging (UART/SPI/I2C to Ethernet), System Management and Power Sequencing, ASIC Prototyping and Low-Volume Production.
Industrial Motor Control and IO-Link Master
The 10M50DCF256A7G's 50K LE plus 144 hardware 18x18 multipliers and 4 PLLs make it ideal for industrial motor-control and IO-Link master designs. Its 1.6 Mbit internal flash stores configuration and IO-Link stack without external PROM, and the integrated 12-bit ADC samples current/voltage feedback at 1 MSPS. The 178 user I/O drive PWM outputs, encoders, and opto-isolated field-bus interfaces. Quoted as of 2026-09-05, the part replaces two-tier discrete MCU+CPLD designs at similar cost.
Recommandé
Factory Automation PLC and Edge Gateway
In PLC and industrial edge-gateway designs, the 10M50DCF256A7G runs EtherCAT, PROFINET, or Modbus TCP soft-IP stacks in parallel with deterministic control logic, leveraging its 50K LE and M9K memory blocks. The 256-ball FBGA supports 178 GPIO for digital inputs, relay outputs, and isolated serial ports. Internal flash enables instant-on recovery after brownout, critical for industrial control loops. Quartus Prime includes the Nios II soft-core, allowing Linux/RTOS hosting on the same die.
Recommandé
Low-Cost Video Processing and Machine Vision
The 10M50DCF256A7G handles 720p video processing, image preprocessing, and feature extraction in low-cost machine vision and smart-camera designs. Its 144 dedicated 18x18 multipliers accelerate convolution kernels, while 50K LE implement Sobel, Canny, and simple CNN inference. LVDS I/O pairs (up to 89) interface directly to image sensors like the Aptina MT9V034 or onsemi Python series. The internal ADC monitors illuminator LED current via current-sense amplifier. As of 2026-09-05, this density tier offers the best LE-per-dollar in the MAX 10 family.
Recommandé
Protocol Bridging (UART/SPI/I2C to Ethernet)
For protocol-bridge designs converting legacy UART/SPI/I2C interfaces to Ethernet, Wi-Fi, or USB, the 10M50DCF256A7G provides ample logic to run both the legacy controller and the Tri-Speed MAC or LwIP TCP/IP stack. Its 50K LE accommodate 4-8 UART ports plus 10/100 Ethernet MAC soft-IP. Internal flash stores web server HTML, eliminating external SPI flash. The 1.0 mm pitch FBGA simplifies routing to RJ45/Magnetics and W5500 Ethernet modules. Industrial temperature rating supports cabinet-mount bridge deployments.
Recommandé
System Management and Power Sequencing
The integrated 12-bit ADC, 4 PLLs, and 50K LE make the 10M50DCF256A7G a fit for system-management controllers that monitor rails, sequence supplies, and log fault events. The on-chip temperature-sensing diode enables local junction monitoring without an external sensor. Internal flash stores fault logs and configuration in non-volatile memory, surviving brownouts. LVCMOS/LVTTL I/O banks interface directly to PMBus, I2C, and SPI power controllers. Compared to an MCU+ADC approach, this consolidates two chips into one, reducing BOM cost and PCB area.
Recommandé
ASIC Prototyping and Low-Volume Production
For ASIC prototyping or low-volume production (under 10K units/year), the 10M50DCF256A7G provides 50K LE of re-spinable logic that an ASIC cannot match in time-to-market. Engineers validate design RTL on MAX 10, then migrate to a structured ASIC for cost-down at higher volumes. Internal flash stores multiple bitstreams for A/B testing or field upgrade, supporting field-programmable design iterations. The 1.0 mm pitch FBGA routes cleanly on 4-layer boards using 0.4 mm trace/space rules, accessible to most commercial PCB fabs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10M50DCF256A7G — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10M25DCF256A7G | 10M16DCF256A7G | 10M08DCF256A7G | 10M04DCF256A7G | 10M50DAF256I7G | 10M50DAF256C7G |
|---|---|---|---|---|---|---|---|
| Package | 256-ball FBGA (F256), 17x17 mm, 1.0 mm pitch | 256-ball FBGA (F256) - same | 256-ball FBGA (F256) - same | 256-ball FBGA (F256) - same | 256-ball FBGA (F256) - same | 256-ball FBGA (F256) - same | 256-ball FBGA (F256) - same |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Logic Elements (LE) | 50,000 | 25,000 | 16,000 | 8,000 | 4,000 | 50,000 | 50,000 |
| Embedded User Flash | 1,677,312 bits | 1,677,312 bits | 1,153,920 bits | 737,280 bits | 295,680 bits | 1,677,312 bits | 1,677,312 bits |
| User I/O | 178 | 178 (fewer bonded) | 178 (fewer bonded) | 178 (fewer bonded) | 178 (fewer bonded) | 178 | 178 |
| Supply Configuration | Dual-supply (separate 1.2 V core + I/O rail) | Dual-supply | Dual-supply | Dual-supply | Dual-supply | Single-supply (internal regulator) | Single-supply (internal regulator) |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +100 C | -40 C to +85 C |
| Pin-to-Pin Compatible with Target | Yes (baseline) | Yes - same F256 ball map | Yes - same F256 ball map | Yes - same F256 ball map | Yes - same F256 ball map | Yes - same F256 ball map | Yes - same F256 ball map |
Principaux différenciateurs
- Highest logic density in MAX 10 family at 50K LE (vs 10M25DCF256A7G)
- Dual-supply option for fine-grained power optimization (vs 10M50DAF256I7G)
- Internal flash configuration eliminates external PROM (vs Cyclone IV EP4CE10F256 (cross-family))
Notes de conception
The 256-ball FBGA at 1.0 mm pitch requires non-solder-mask-defined (NSMD) pads with 0.45-0.50 mm diameter and via-in-pad or dog-bone fan-out to inner layers. Estimated: a 4-layer stack-up with 0.4 mm trace/space and 0.2 mm drill can route this part on most commercial PCB fabs (e.g., JLCPCB 4L 1.6 mm). Below 6-layer stack-ups, signal-integrity margins shrink for LVDS pairs, so consider 6 layers for designs with >50 LVDS pairs. Reference the MAX 10 device datasheet pin connection guidelines for VCCIO/VCCA_FPLL decoupling.
The DCF256 variant requires separate 1.2 V VCCINT and 1.2-3.3 V VCCIO rails; sequence VCCINT before VCCIO to avoid latch-up. Place 0.1 uF X7R 0402/0201 bypass caps within 1 mm of every power pin and 10 uF X5R bulk caps per power island. The internal flash configuration pulls an inrush current of up to 50 mA during instant-on; size the 1.2 V LDO for 1.5x the steady-state MAX 10 core current (~100 mA typical at 50 MHz).
Estimated: at typical 50K LE utilization (70% LUTs, 50% RAM, 25% multipliers) toggling at 100 MHz, the 10M50DCF256A7G dissipates approximately 0.5-1.0 W. The 17 x 17 mm FBGA has theta_JA around 25-30 C/W on a JEDEC 4-layer test board (4 thermal vias to inner ground plane). For sealed enclosures with no airflow, derate to 0.5 W max to keep junction below 100 C. Add thermal vias under the central ball grid for improved heat spreading.
Do not confuse DCF (dual-supply) with DAF (single-supply) when ordering - they are not drop-in from a power-tree perspective: DAF uses an internal regulator from a single 3.0/3.3 V rail, while DCF requires an external 1.2 V LDO. Also note that MAX 10 pin compatibility covers F256 ball map but not all lower-density parts bond out the same number of I/Os - check the pin connection guidelines to confirm sufficient GPIO for your design.
Route JTAG (TCK, TMS, TDI, TDO) and AS configuration pins with 50 ohm controlled impedance and length-matched within 25 mm. Keep configuration-related signals (nCONFIG, nSTATUS, CONF_DONE) away from switching I/O edges. The MSL3 moisture sensitivity requires JEDEC J-STD-033 handling: pre-bake at 125 C for 24 hours if the humidity indicator card shows >10% RH, and reflow within 168 hours of floor life.
Informations de conformité
RoHS and REACH compliant per Altera/Intel product page. Not AEC-Q100 qualified - use 10M50DAF256I7G for extended industrial temperature but it remains non-automotive. MSL3 moisture sensitivity requires JEDEC J-STD-033 handling.
