10M50DCF256A7G - MAX 10 FPGA, 50K LE, 256-FBGA | Intel
部品番号: 10M50DCF256A7G ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $44.87 | $44.87 |
| 10 | $41.2 | $412.00 |
| 100 | $37.55 | $3,755.00 |
| 500 | $33.1 | $16,550.00 |
| 1,000 | $29.8 | $29,800.00 |
10M50DCF256A7G 概要
A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic fabric, interconnect, and I/O can be programmed by the end user after manufacture. FPGAs sit in the programmable-logic hierarchy between fixed-function ASICs and software-driven microcontrollers: an FPGA delivers hardware-timed parallelism and deterministic latency that microcontrollers cannot, while remaining re-spinable like software. Within Intel's portfolio, the MAX 10 family is a non-volatile, low-cost, single-chip tier positioned above CPLDs and below Cyclone/Cyclone V in density, and is built on a 55 nm TSMC process node.
Key feature of this OPN is its on-chip flash configuration memory: unlike SRAM-based FPGAs that require an external boot PROM, the 10M50DCF256A7G stores its configuration in 1,677,312 bits of embedded flash, enabling instant-on single-chip operation. Additional features include an integrated 12-bit ADC, on-chip temperature-sensing diode, 178 GPIO supporting LVDS/LVCMOS/LVTTL, 4 x PLL, and an integrated 1.2 V core with 3.0/3.3 V-tolerant I/O banks for single-supply or dual-supply operation.
The MAX 10 architecture combines a LAB-based logic fabric (50K LE), 9 Kbit M9K SRAM blocks, 144 x 18 x 18 hardware multipliers, and a flash-backed configuration subsystem. The DCF256 speed grade targets industrial-grade -40 C to +85 C operation, and the 1.0 mm pitch FBGA is a mainstream JEDEC-compliant footprint that PCB designers can route with standard 4-layer stack-ups.
Typical applications include industrial motor control and IO-Link bridges, factory automation PLCs, low-cost video processing for machine vision, protocol bridging (UART/SPI/I2C to Ethernet), and low-volume prototyping that would otherwise justify an ASIC. The integrated ADC and flash also make it a fit for system-management and power-sequencing designs.
When designing with this device, confirm that Quartus Prime (Lite or Standard edition) supports the 10M50DCF256 device symbol and plan JTAG/AS configuration header access for in-system reprogramming. The 1.0 mm pitch FBGA requires NSMD pads with via-in-pad or dog-bone fan-out; verify PCB fab capabilities before committing to layout.
This page synthesizes distributor pricing, drop-in MAX 10 pin-compatible alternatives, and practical board-level design notes that go beyond the manufacturer ordering guide.
ドロップイン代替品: 10M50DCF256A7G — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: 10M50DCF256A7G （同一形状・フットプリント） — 相違点: Package, Process Technology, Logic Elements (LE), Operating Temperature, Speed Grade.
クイック比較ツール — 並列比較する代替部品を選択:
10M25DCF256A7G
✅ ドロップイン✓ 在庫あり
$42.84 / 個
データシートを見る →10M16DCF256A7G
✅ ドロップイン✓ 在庫あり
$37.2 / 個
データシートを見る →10M08DCF256A7G
✅ ドロップイン✓ 在庫あり
$15.2 / 個
データシートを見る →10M04DCF256A7G
✅ ドロップイン✓ 在庫あり
$11.1 / 個
データシートを見る →10M50DAF256I7G
✅ ドロップイン✓ 在庫あり
$155.2 / 個
データシートを見る →10M50DAF256C7G
✅ ドロップイン📋 参考代替品（カタログ未掲載）
10M50DCF256A7G 最大定格＆電気的特性
| Family | MAX 10 |
| Logic Elements (LE) | 50,000 |
| User Flash Memory | 1,677,312 bits |
| User I/O Count | 178 |
| パッケージ | 256-ball FBGA (F256), 17 x 17 mm, 1.0 mm pitch |
| Process Node | 55 nm |
| Core Voltage | 1.2 V |
| I/O Bank Voltages | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V |
| 動作温度 | -40 C to +85 C (industrial) |
| Speed Grade | 7 (DCF = dual-supply, commercial/industrial) |
| Embedded Memory | M9K blocks, 9 Kbits each |
| Embedded Multipliers | 144 x 18 x 18 |
| PLL | 4 |
| On-chip ADC | 12-bit, 1 MSPS, 16 channels |
| Configuration | Internal flash (single-chip, instant-on) |
| 実装タイプ | Surface Mount (BGA) |
| RoHS ステータス | Compliant |
| MSLレベル | 3 (168 hours) |
10M50DCF256A7G 256-ball fbga (f256), 17 x 17 mm, 1.0 mm pitch ピン配置ガイド
10M50DCF256A7G (256-ball fbga (f256), 17 x 17 mm, 1.0 mm pitch パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: 10M50DCF256A7G.
詳細は データシート をご参照ください。
主な用途
10M50DCF256A7G の用途: 6 件s: Industrial Motor Control and IO-Link Master, Factory Automation PLC and Edge Gateway, Low-Cost Video Processing and Machine Vision, Protocol Bridging (UART/SPI/I2C to Ethernet), System Management and Power Sequencing, ASIC Prototyping and Low-Volume Production.
Industrial Motor Control and IO-Link Master
The 10M50DCF256A7G's 50K LE plus 144 hardware 18x18 multipliers and 4 PLLs make it ideal for industrial motor-control and IO-Link master designs. Its 1.6 Mbit internal flash stores configuration and IO-Link stack without external PROM, and the integrated 12-bit ADC samples current/voltage feedback at 1 MSPS. The 178 user I/O drive PWM outputs, encoders, and opto-isolated field-bus interfaces. Quoted as of 2026-09-05, the part replaces two-tier discrete MCU+CPLD designs at similar cost.
おすすめ
Factory Automation PLC and Edge Gateway
In PLC and industrial edge-gateway designs, the 10M50DCF256A7G runs EtherCAT, PROFINET, or Modbus TCP soft-IP stacks in parallel with deterministic control logic, leveraging its 50K LE and M9K memory blocks. The 256-ball FBGA supports 178 GPIO for digital inputs, relay outputs, and isolated serial ports. Internal flash enables instant-on recovery after brownout, critical for industrial control loops. Quartus Prime includes the Nios II soft-core, allowing Linux/RTOS hosting on the same die.
おすすめ
Low-Cost Video Processing and Machine Vision
The 10M50DCF256A7G handles 720p video processing, image preprocessing, and feature extraction in low-cost machine vision and smart-camera designs. Its 144 dedicated 18x18 multipliers accelerate convolution kernels, while 50K LE implement Sobel, Canny, and simple CNN inference. LVDS I/O pairs (up to 89) interface directly to image sensors like the Aptina MT9V034 or onsemi Python series. The internal ADC monitors illuminator LED current via current-sense amplifier. As of 2026-09-05, this density tier offers the best LE-per-dollar in the MAX 10 family.
おすすめ
Protocol Bridging (UART/SPI/I2C to Ethernet)
For protocol-bridge designs converting legacy UART/SPI/I2C interfaces to Ethernet, Wi-Fi, or USB, the 10M50DCF256A7G provides ample logic to run both the legacy controller and the Tri-Speed MAC or LwIP TCP/IP stack. Its 50K LE accommodate 4-8 UART ports plus 10/100 Ethernet MAC soft-IP. Internal flash stores web server HTML, eliminating external SPI flash. The 1.0 mm pitch FBGA simplifies routing to RJ45/Magnetics and W5500 Ethernet modules. Industrial temperature rating supports cabinet-mount bridge deployments.
おすすめ
System Management and Power Sequencing
The integrated 12-bit ADC, 4 PLLs, and 50K LE make the 10M50DCF256A7G a fit for system-management controllers that monitor rails, sequence supplies, and log fault events. The on-chip temperature-sensing diode enables local junction monitoring without an external sensor. Internal flash stores fault logs and configuration in non-volatile memory, surviving brownouts. LVCMOS/LVTTL I/O banks interface directly to PMBus, I2C, and SPI power controllers. Compared to an MCU+ADC approach, this consolidates two chips into one, reducing BOM cost and PCB area.
おすすめ
ASIC Prototyping and Low-Volume Production
For ASIC prototyping or low-volume production (under 10K units/year), the 10M50DCF256A7G provides 50K LE of re-spinable logic that an ASIC cannot match in time-to-market. Engineers validate design RTL on MAX 10, then migrate to a structured ASIC for cost-down at higher volumes. Internal flash stores multiple bitstreams for A/B testing or field upgrade, supporting field-programmable design iterations. The 1.0 mm pitch FBGA routes cleanly on 4-layer boards using 0.4 mm trace/space rules, accessible to most commercial PCB fabs.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: 10M50DCF256A7G — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | 10M25DCF256A7G | 10M16DCF256A7G | 10M08DCF256A7G | 10M04DCF256A7G | 10M50DAF256I7G | 10M50DAF256C7G |
|---|---|---|---|---|---|---|---|
| Package | 256-ball FBGA (F256), 17x17 mm, 1.0 mm pitch | 256-ball FBGA (F256) - same | 256-ball FBGA (F256) - same | 256-ball FBGA (F256) - same | 256-ball FBGA (F256) - same | 256-ball FBGA (F256) - same | 256-ball FBGA (F256) - same |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Logic Elements (LE) | 50,000 | 25,000 | 16,000 | 8,000 | 4,000 | 50,000 | 50,000 |
| Embedded User Flash | 1,677,312 bits | 1,677,312 bits | 1,153,920 bits | 737,280 bits | 295,680 bits | 1,677,312 bits | 1,677,312 bits |
| User I/O | 178 | 178 (fewer bonded) | 178 (fewer bonded) | 178 (fewer bonded) | 178 (fewer bonded) | 178 | 178 |
| Supply Configuration | Dual-supply (separate 1.2 V core + I/O rail) | Dual-supply | Dual-supply | Dual-supply | Dual-supply | Single-supply (internal regulator) | Single-supply (internal regulator) |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +100 C | -40 C to +85 C |
| Pin-to-Pin Compatible with Target | Yes (baseline) | Yes - same F256 ball map | Yes - same F256 ball map | Yes - same F256 ball map | Yes - same F256 ball map | Yes - same F256 ball map | Yes - same F256 ball map |
主な差別化要因
- Highest logic density in MAX 10 family at 50K LE （vs 10M25DCF256A7G)
- Dual-supply option for fine-grained power optimization （vs 10M50DAF256I7G)
- Internal flash configuration eliminates external PROM （vs Cyclone IV EP4CE10F256 (cross-family))
設計ノート
The 256-ball FBGA at 1.0 mm pitch requires non-solder-mask-defined (NSMD) pads with 0.45-0.50 mm diameter and via-in-pad or dog-bone fan-out to inner layers. Estimated: a 4-layer stack-up with 0.4 mm trace/space and 0.2 mm drill can route this part on most commercial PCB fabs (e.g., JLCPCB 4L 1.6 mm). Below 6-layer stack-ups, signal-integrity margins shrink for LVDS pairs, so consider 6 layers for designs with >50 LVDS pairs. Reference the MAX 10 device datasheet pin connection guidelines for VCCIO/VCCA_FPLL decoupling.
The DCF256 variant requires separate 1.2 V VCCINT and 1.2-3.3 V VCCIO rails; sequence VCCINT before VCCIO to avoid latch-up. Place 0.1 uF X7R 0402/0201 bypass caps within 1 mm of every power pin and 10 uF X5R bulk caps per power island. The internal flash configuration pulls an inrush current of up to 50 mA during instant-on; size the 1.2 V LDO for 1.5x the steady-state MAX 10 core current (~100 mA typical at 50 MHz).
Estimated: at typical 50K LE utilization (70% LUTs, 50% RAM, 25% multipliers) toggling at 100 MHz, the 10M50DCF256A7G dissipates approximately 0.5-1.0 W. The 17 x 17 mm FBGA has theta_JA around 25-30 C/W on a JEDEC 4-layer test board (4 thermal vias to inner ground plane). For sealed enclosures with no airflow, derate to 0.5 W max to keep junction below 100 C. Add thermal vias under the central ball grid for improved heat spreading.
Do not confuse DCF (dual-supply) with DAF (single-supply) when ordering - they are not drop-in from a power-tree perspective: DAF uses an internal regulator from a single 3.0/3.3 V rail, while DCF requires an external 1.2 V LDO. Also note that MAX 10 pin compatibility covers F256 ball map but not all lower-density parts bond out the same number of I/Os - check the pin connection guidelines to confirm sufficient GPIO for your design.
Route JTAG (TCK, TMS, TDI, TDO) and AS configuration pins with 50 ohm controlled impedance and length-matched within 25 mm. Keep configuration-related signals (nCONFIG, nSTATUS, CONF_DONE) away from switching I/O edges. The MSL3 moisture sensitivity requires JEDEC J-STD-033 handling: pre-bake at 125 C for 24 hours if the humidity indicator card shows >10% RH, and reflow within 168 hours of floor life.
コンプライアンス情報
RoHS and REACH compliant per Altera/Intel product page. Not AEC-Q100 qualified - use 10M50DAF256I7G for extended industrial temperature but it remains non-automotive. MSL3 moisture sensitivity requires JEDEC J-STD-033 handling.
