5M160ZE64C5N - MAX V CPLD, 160 LE, 54 I/O, EQFP-64 | Intel
Référence : 5M160ZE64C5N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $9.5 | $9,50 |
| 10 | $8.2 | $82,00 |
| 100 | $6.8 | $680,00 |
| 500 | $5.75 | $2 875,00 |
| 1 000 | $4.95 | $4 950,00 |
5M160ZE64C5N Présentation
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that sits in the digital hierarchy between discrete 74-series glue logic and larger FPGAs. It belongs to the broader family of programmable logic devices (PLDs) and is commonly used for I/O expansion, bus bridging, power-up sequencing, and address decoding in cost-sensitive designs. Within the system hierarchy: CPLD -> PLD -> programmable logic -> digital semiconductor. MAX V devices specifically target low standby power (~25 µA typical), 1.8 V operation, and small footprint packages - bridging the gap between discrete logic and full FPGAs.
Key features of the 5M160ZE64C5N include 160 Logic Elements (LE), 8 Kbits of Flash memory, 1.4 ns pin-to-pin logic delay (tPD), 8.5 ns maximum frequency (fMAX for logic, per datasheet), user flash memory block, JTAG boundary-scan test support, and an internal oscillator. The exposed-pad EQFP-64 package provides a low thermal resistance path to PCB copper for heat removal in industrial environments.
The device uses a non-volatile Flash configuration cell, eliminating external configuration PROM. Its multi-voltage I/O bank (VCCIO) supports 1.5 V, 1.8 V, 2.5 V, 3.3 V, and LVCMOS/LVTTL signaling, allowing direct interface to modern processors, microcontrollers, ASICs, and legacy 5 V-tolerant busses (via resistor networks). This makes it ideal for glue-logic consolidation, peripheral I/O expansion, and bus translation tasks.
Typical applications include industrial control logic, I/O expansion for microcontrollers and SoCs, bus interface bridging (e.g., SPI to parallel, I2C to GPIO), power-sequencer / supervisory logic, and LED / display driving in consumer and embedded products. The exposed pad (E64) ensures reliable operation across commercial temperature grades.
When designing with this part, observe Quartus II / Quartus Prime pin assignment rules and connect the exposed pad to a solid ground plane for thermal relief. Use the Quartus PowerPlay Early Power Estimator to model I/O toggle power before PCB layout. Verify all unused pins are configured per the MAX V pin-connection guidelines.
This page synthesizes distributor stock, drop-in same-package alternatives, and engineering design notes not found in a single source - including a Package row in the comparison table to confirm pin-to-pin compatibility.
Alternatives de remplacement direct pour 5M160ZE64C5N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 5M160ZE64C5N (même facteur de forme et même empreinte) — différant par Package, Programming Interface, Operating Temperature, Configuration Memory, Device Family.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
5M160ZE64C4N
✅ Remplacement direct✓ En stock
$4.3 / unité
Voir la fiche technique →5M160ZE64A5N
✅ Remplacement direct✓ En stock
$6.2 / unité
Voir la fiche technique →5M160ZE64I5N
✅ Remplacement direct✓ En stock
$4.13 / unité
Voir la fiche technique →5M160ZT100C5N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$4.75 / unité
Voir la fiche technique →5M1270ZF256C5N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$21.4 / unité
Voir la fiche technique →5M160ZE64C5N Valeurs maximales et caractéristiques électriques
| Series | MAX V |
| Device Family | MAX V (5M160Z) |
| Logic Elements (LE) | 160 |
| Macrocells | 128 |
| User I/O Pins | 54 |
| Maximum Operating Frequency (fMAX) | 118.3 MHz |
| Pin-to-Pin Logic Delay (tPD) | 1.4 ns (per datasheet) |
| Configuration Memory | Non-volatile Flash |
| Supply Voltage (VCCINT) | 1.8 V |
| I/O Bank Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| User Flash Memory | 8 Kbits |
| Boîtier | 64-pin EQFP (E64) with exposed pad |
| Type de montage | Surface Mount |
| Température de fonctionnement | 0°C to +85°C (commercial) |
| Programming Interface | JTAG (IEEE 1149.1) / In-system |
| Statut RoHS | Compliant |
| Niveau MSL | 3 |
Configuration des broches de 5M160ZE64C5N
| Broche 1 | I/O — User I/O pin (bank 1) |
| Broche 2 | I/O — User I/O pin (bank 1) |
| Broche 3 | I/O — User I/O pin (bank 1) |
| Broche 4 | I/O — User I/O pin (bank 1) |
| Broche 5 | I/O — User I/O pin (bank 1) |
| Broche 6 | I/O — User I/O pin (bank 1) |
| Broche 7 | I/O — User I/O pin (bank 1) |
| Broche 8 | I/O — User I/O pin (bank 1) |
| Broche 9 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 10 | I/O — User I/O pin (bank 1) |
| Broche 11 | I/O — User I/O pin (bank 1) |
| Broche 12 | I/O — User I/O pin (bank 1) |
| Broche 13 | I/O — User I/O pin (bank 1) |
| Broche 14 | I/O — User I/O pin (bank 1) |
| Broche 15 | I/O — User I/O pin (bank 1) |
| Broche 16 | I/O — User I/O pin (bank 1) |
| Broche 17 | GND — Ground |
| Broche 18 | I/O — User I/O pin (bank 2) |
| Broche 19 | I/O — User I/O pin (bank 2) |
| Broche 20 | I/O — User I/O pin (bank 2) |
| Broche 21 | I/O — User I/O pin (bank 2) |
| Broche 22 | I/O — User I/O pin (bank 2) |
| Broche 23 | I/O — User I/O pin (bank 2) |
| Broche 24 | I/O — User I/O pin (bank 2) |
| Broche 25 | I/O — User I/O pin (bank 2) |
| Broche 26 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 27 | I/O — User I/O pin (bank 2) |
| Broche 28 | I/O — User I/O pin (bank 2) |
| Broche 29 | I/O — User I/O pin (bank 2) |
| Broche 30 | I/O — User I/O pin (bank 2) |
| Broche 31 | I/O — User I/O pin (bank 2) |
| Broche 32 | I/O — User I/O pin (bank 2) |
| Broche 33 | I/O — User I/O pin (bank 2) |
| Broche 34 | I/O — User I/O pin (bank 2) |
| Broche 35 | I/O — User I/O pin (bank 3) |
| Broche 36 | I/O — User I/O pin (bank 3) |
| Broche 37 | GND — Ground |
| Broche 38 | I/O — User I/O pin (bank 3) |
| Broche 39 | I/O — User I/O pin (bank 3) |
| Broche 40 | I/O — User I/O pin (bank 3) |
| Broche 41 | I/O — User I/O pin (bank 3) |
| Broche 42 | I/O — User I/O pin (bank 3) |
| Broche 43 | I/O — User I/O pin (bank 3) |
| Broche 44 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 45 | I/O — User I/O pin (bank 3) |
| Broche 46 | I/O — User I/O pin (bank 3) |
| Broche 47 | I/O — User I/O pin (bank 3) |
| Broche 48 | I/O — User I/O pin (bank 3) |
| Broche 49 | I/O — User I/O pin (bank 3) |
| Broche 50 | I/O — User I/O pin (bank 4) |
| Broche 51 | I/O — User I/O pin (bank 4) |
| Broche 52 | I/O — User I/O pin (bank 4) |
| Broche 53 | GND — Ground |
| Broche 54 | VCCINT — Core supply voltage (1.8 V) |
| Broche 55 | I/O — User I/O pin (bank 4) |
| Broche 56 | I/O — User I/O pin (bank 4) |
| Broche 57 | I/O — User I/O pin (bank 4) |
| Broche 58 | I/O — User I/O pin (bank 4) |
| Broche 59 | TCK — JTAG test clock input |
| Broche 60 | TMS — JTAG test mode select input |
| Broche 61 | TDI — JTAG test data input |
| Broche 62 | TDO — JTAG test data output |
| Broche 63 | I/O — User I/O pin (bank 4) |
| Broche 64 | I/O — User I/O pin (bank 4) |
Applications typiques
5M160ZE64C5N convient pour 6 applications: Microcontroller I/O Expansion, Bus Bridge and Level Translator, Power-Up Sequencer for Multi-Rail Systems, Address Decoding and Chip-Select Logic, LED Matrix Driver and Display Multiplexer, Industrial Control Glue Logic.
Microcontroller I/O Expansion
The 5M160ZE64C5N's 54 user I/Os and 1.4 ns pin-to-pin delay make it an excellent GPIO/port-expander companion to low-pin-count MCUs. When a microcontroller running out of pins needs 30-50 extra discrete I/Os for buttons, LEDs, relays, or sensors, the CPLD sits between the MCU and the peripherals. The non-volatile Flash config means the expansion logic is live at power-on - no firmware loader needed - and the 3.3 V LVCMOS I/O bank interfaces directly with common MCU ports without level shifters. Quartus pin planning is straightforward via the MAX V device library.
Recommandé
Bus Bridge and Level Translator
The 5M160ZE64C5N bridges incompatible bus protocols (SPI to parallel, I2C to GPIO, UART to memory-mapped register) and translates between 1.8 V, 2.5 V, and 3.3 V logic levels using independent VCCIO banks. Its 118.3 MHz fMAX comfortably exceeds typical SPI (50 MHz) and I2C (3.4 MHz) data rates. The instant-on Flash configuration eliminates the boot delay that complicates bus-bridge design with SRAM FPGAs. Industrial designs use it to connect 5 V legacy peripherals to 1.8 V SoCs via LVCMOS-tolerant I/Os.
Recommandé
Power-Up Sequencer for Multi-Rail Systems
The 5M160ZE64C5N is a classic choice for sequencing multiple DC/DC rails in FPGA, ASIC, and SoC power trees. With 160 Logic Elements and 54 I/Os, it can monitor 6-10 PG (power-good) inputs and generate 6-10 EN/SS (enable/soft-start) outputs with programmable delays implemented in Verilog or VHDL. Non-volatile Flash storage means the sequencer is ready at the first millisecond of power-up, with no firmware boot dependency. Industrial servers and telecom line cards rely on this pattern.
Recommandé
Address Decoding and Chip-Select Logic
In legacy 8/16/32-bit microcontroller and DSP designs, the 5M160ZE64C5N consolidates address-decoding glue logic - replacing 74HC138, 74HC139, and discrete AND/OR gates with a single programmable decoder. The 1.4 ns tPD is faster than discrete HC-logic propagation chains, and the design can be modified without re-spinning the PCB. The exposed-pad EQFP-64 package handles thermal load comfortably in industrial control backplanes. Quartus schematic capture or HDL entry makes decoder changes a 5-minute job.
Recommandé
LED Matrix Driver and Display Multiplexer
With 54 user I/Os, the 5M160ZE64C5N can drive 6-8 rows and 6-8 columns of an LED matrix directly - supporting up to 64-pixel charlieplexed or scanned LED displays without additional driver ICs. The 3.3 V LVCMOS outputs sink/source typical LED currents via series resistors. For larger displays the same CPLD can be the timing controller for external shift registers (74HC595) or LED drivers (TLC5941). The exposed pad keeps the device cool at high PWM refresh rates.
Recommandé
Industrial Control Glue Logic
In PLC, motor-control, and industrial sensor-conditioning designs, the 5M160ZE64C5N implements custom encoder interfaces (quadrature decoding, pulse-train multiplication), PWM generators, fault-handling state machines, and watchdog logic. The 160 LE capacity handles typical encoder-plus-PWM-plus-protocol designs in a single chip. Industrial -40°C operation is available via the 5M160ZE64I5N drop-in. The exposed-pad package and RoHS compliance meet factory-floor environmental requirements.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 5M160ZE64C5N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 5M160ZE64C4N | 5M160ZE64A5N | 5M160ZE64I5N | 5M160ZT100C5N | 5M1270ZF256C5N |
|---|---|---|---|---|---|---|
| Package | EQFP-64 (E64) | EQFP-64 (E64) - same | EQFP-64 (E64) - same | EQFP-64 (E64) - same | TQFP-100 | FBGA-256 |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 160 | 160 | 160 | 160 | 160 | 1270 |
| User I/O Pins | 54 | 54 | 54 | 54 | 79 | 212 |
| Speed Grade | -5 (118.3 MHz fMAX) | -4 (slower) | -5 | -5 | -5 | -5 |
| Temperature Grade | Commercial 0C to +85C | Commercial | A-grade | Industrial -40C to +100C | Commercial | Commercial |
| Configuration Memory | Non-volatile Flash | Non-volatile Flash | Non-volatile Flash | Non-volatile Flash | Non-volatile Flash | Non-volatile Flash |
Principaux différenciateurs
- Lowest-cost 5M160Z E64 variant with -5 speed grade (vs 5M160ZE64I5N)
- Instant-on non-volatile Flash configuration (vs SRAM-based small FPGAs)
- Same 160 LE in smaller E64 footprint (vs 5M160ZT100C5N)
Notes de conception
The E64 EQFP package uses a bottom-side exposed pad that MUST be soldered to the PCB ground plane for both thermal dissipation and electrical performance per the Altera 5m160z.pdf pin document. Recommended thermal-via pattern: 5x5 array of 0.3 mm plated-through vias under the pad, connecting to internal ground planes. Without proper thermal connection the junction temperature can rise beyond the 0-85C commercial limit in enclosed industrial enclosures, leading to timing-margin loss or device damage. Estimated: a 0.5W dissipation at 25C ambient will cause ~15C junction rise with proper pad soldering vs >40C rise without.
Decoupling for the 5M160ZE64C5N requires at minimum one 0.1 µF X7R ceramic capacitor placed within 5 mm of each VCCINT pin and one 0.1 µF plus 10 µF bulk capacitor on each VCCIO bank pin. JTAG lines (TCK, TMS, TDI, TDO) should be routed as a bus with matched lengths and pulled up to VCCIO via 10 kΩ resistors if unused. Keep high-speed I/O traces short and impedance-controlled (50 Ω typical for LVCMOS). Reference the MAX V Device Handbook pin-connection guidelines for unused-pin termination.
Do not leave the JTAG pins (TCK/TMS/TDI/TDO) floating - the Altera MAX V datasheet recommends tying TMS and TDI to VCCIO via 10 kΩ pull-ups and pulling TCK to GND through 10 kΩ when JTAG is unused, to prevent spurious boundary-scan operations at power-up. All unused user I/Os must be configured as inputs with weak pull-up or output-driving-defined to prevent oscillation. Verify the Quartus pin-out file matches your PCB before programming, and always read back the design via JTAG to confirm configuration integrity after production.
Informations de conformité
RoHS and REACH compliant per LCSC and DigiKey compliance listings (2026-09-06). MSL 3 per JEDEC J-STD-033 - floor-life control required after bag opening before reflow. Not AEC-Q100 qualified; the 5M160ZE64I5N is the industrial-temp variant.
