5M160ZE64A5N - 128 Macro Cell MAX V CPLD, 118.3MHz, 64-EQFP | Altera
Référence : 5M160ZE64A5N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $9.8 | $9,80 |
| 10 | $8.95 | $89,50 |
| 100 | $7.8 | $780,00 |
| 500 | $6.95 | $3 475,00 |
| 1 000 | $6.2 | $6 200,00 |
5M160ZE64A5N Présentation
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic IC that uses flash-backed macro cells and a fixed AND/OR fabric to implement glue logic, interface bridges, and state machines. Compared with SRAM-based FPGAs, CPLDs offer instant-on configuration (no external boot device), deterministic timing, and excellent fit for bus decoding, power-sequencing, and LED/display driving. The MAX V family specifically targets low standby current and pin-rich I/O configurations.
Key features include 128 macro cells (160 logic elements), 54 user I/O pins, 8 Kbits of user flash memory, an internal oscillator, JTAG (IEEE 1149.1) boundary-scan support, and in-system programmability via JTAG or Altera/Altera-Quartus. The non-volatile flash fabric eliminates the need for a separate boot PROM and supports >10,000 program/erase cycles, making the device well suited for factory-floor reprogramming and field updates.
Architecturally, the 5M160ZE64A5N uses Altera's classic LAB (Logic Array Block) topology with 16 macro cells per LAB, an interconnect matrix, and per-pin I/O registers with programmable slew rate, bus-hold, pull-up, and open-drain options. The exposed thermal pad on the EQFP-64 package keeps junction temperatures manageable at industrial -40C to +125C ambient ranges.
Typical applications include I/O expansion and bus bridging in industrial controllers, power-management sequencing for FPGA-based boards, automotive body-electronics modules, motor-control glue logic, and legacy-interface translation (PCI/ISA to modern serial buses). The 64-EQFP footprint offers a balance of I/O count and board-level manufacturability for both hand-soldered prototypes and high-volume reflow lines.
When designing with this part, observe the recommended operating range (1.71 V to 1.89 V for VCCINT) and use the JTAG chain for ISP. Plan decoupling carefully - place 0.1 uF ceramics close to every supply pin and bulk tantalum or polymer caps near the EQFP exposed pad to manage in-rush during flash programming.
This page synthesizes distributor pricing, AEC-Q100 variants, drop-in same-package alternatives, and practical design notes for the MAX V 5M160ZE64A5N that are not collated in the manufacturer datasheet alone.
Alternatives de remplacement direct pour 5M160ZE64A5N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 5M160ZE64A5N (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Programming Interface, User Flash Memory, Configuration Memory.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
5M160ZE64C5N
✅ Remplacement direct✓ En stock
$4.95 / unité
Voir la fiche technique →5M160ZE64I5N
✅ Remplacement direct✓ En stock
$4.13 / unité
Voir la fiche technique →5M160ZE64A5
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
5M160ZE64C4N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$4.3 / unité
Voir la fiche technique →5M160ZE64A5N Valeurs maximales et caractéristiques électriques
| Family | MAX V |
| Device | 5M160ZE64A5N |
| Macro Cells | 128 |
| Logic Elements | 160 |
| User I/O Pins | 54 |
| Maximum Operating Frequency | 118.3 MHz |
| Pin-to-Pin Propagation Delay | 7.5 ns |
| User Flash Memory | 8 Kbits |
| Core Voltage (VCCINT) | 1.8 V (1.71 V to 1.89 V) |
| I/O Voltage Support | 1.5 V, 1.8 V, 2.5 V, 3.3 V |
| Boîtier | 64-pin EQFP (exposed-pad QFP) |
| Température de fonctionnement | -40C to +125C (automotive AEC-Q100) |
| Programming Interface | JTAG (IEEE 1149.1) / ISP |
| Configuration Method | Non-volatile flash, instant-on |
| Statut RoHS | Compliant |
| Type de montage | Surface Mount |
Configuration des broches de 5M160ZE64A5N
| Broche 1 | I/O — User I/O pin (bank 1) |
| Broche 2 | I/O — User I/O pin (bank 1) |
| Broche 3 | I/O — User I/O pin (bank 1) |
| Broche 4 | I/O — User I/O pin (bank 1) |
| Broche 5 | I/O — User I/O pin (bank 1) |
| Broche 6 | I/O — User I/O pin (bank 1) |
| Broche 7 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 8 | I/O — User I/O pin (bank 1) |
| Broche 9 | I/O — User I/O pin (bank 1) |
| Broche 10 | I/O — User I/O pin (bank 1) |
| Broche 11 | GND — Ground |
| Broche 12 | I/O — User I/O pin (bank 2) |
| Broche 13 | I/O — User I/O pin (bank 2) |
| Broche 14 | I/O — User I/O pin (bank 2) |
| Broche 15 | I/O — User I/O pin (bank 2) |
| Broche 16 | I/O — User I/O pin (bank 2) |
| Broche 17 | I/O — User I/O pin (bank 2) |
| Broche 18 | I/O — User I/O pin (bank 2) |
| Broche 19 | I/O — User I/O pin (bank 2) |
| Broche 20 | I/O — User I/O pin (bank 2) |
| Broche 21 | GND — Ground |
| Broche 22 | I/O — User I/O pin (bank 2) |
| Broche 23 | I/O — User I/O pin (bank 2) |
| Broche 24 | I/O — User I/O pin (bank 2) |
| Broche 25 | I/O — User I/O pin (bank 2) |
| Broche 26 | I/O — User I/O pin (bank 2) |
| Broche 27 | I/O — User I/O pin (bank 2) |
| Broche 28 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 29 | I/O — User I/O pin (bank 3) |
| Broche 30 | I/O — User I/O pin (bank 3) |
| Broche 31 | I/O — User I/O pin (bank 3) |
| Broche 32 | I/O — User I/O pin (bank 3) |
| Broche 33 | I/O — User I/O pin (bank 3) |
| Broche 34 | I/O — User I/O pin (bank 3) |
| Broche 35 | I/O — User I/O pin (bank 3) |
| Broche 36 | I/O — User I/O pin (bank 3) |
| Broche 37 | GND — Ground |
| Broche 38 | I/O — User I/O pin (bank 3) |
| Broche 39 | I/O — User I/O pin (bank 3) |
| Broche 40 | I/O — User I/O pin (bank 3) |
| Broche 41 | I/O — User I/O pin (bank 3) |
| Broche 42 | I/O — User I/O pin (bank 3) |
| Broche 43 | I/O — User I/O pin (bank 3) |
| Broche 44 | I/O — User I/O pin (bank 3) |
| Broche 45 | GND — Ground |
| Broche 46 | I/O — User I/O pin (bank 4) |
| Broche 47 | I/O — User I/O pin (bank 4) |
| Broche 48 | I/O — User I/O pin (bank 4) |
| Broche 49 | I/O — User I/O pin (bank 4) |
| Broche 50 | I/O — User I/O pin (bank 4) |
| Broche 51 | I/O — User I/O pin (bank 4) |
| Broche 52 | I/O — User I/O pin (bank 4) |
| Broche 53 | I/O — User I/O pin (bank 4) |
| Broche 54 | VCCIO4 — I/O bank 4 supply voltage |
| Broche 55 | TDI — JTAG test data in |
| Broche 56 | TMS — JTAG test mode select |
| Broche 57 | TCK — JTAG test clock |
| Broche 58 | TDO — JTAG test data out |
| Broche 59 | nSTATUS — Configuration status |
| Broche 60 | nCONFIG — Configuration control |
| Broche 61 | VCCINT — Core supply (1.8 V) |
| Broche 62 | GND — Ground |
| Broche 63 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 64 | I/O — User I/O pin (bank 4) |
| Broche EP | GND — Exposed thermal pad - solder to ground plane |
Applications typiques
5M160ZE64A5N convient pour 6 applications: Industrial I/O Expansion and Bus Bridging, Automotive Body-Electronics Modules, Power-Sequencing and Reset Management, Motor-Control Glue Logic, Legacy Interface Translation (PCI/ISA to Serial), Display and LED Matrix Driving.
Industrial I/O Expansion and Bus Bridging
The 5M160ZE64A5N's 128 macro cells and 54 user I/Os make it well-suited for I/O expansion in industrial controllers, where it bridges legacy parallel buses (PCI, ISA, local bus) to modern serial interfaces. Its 7.5 ns pin-to-pin propagation delay supports deterministic 60 MHz bus cycles, and the non-volatile flash fabric ensures instant-on startup without external boot devices. Placed between an MCU and a parallel ADC, it decodes addresses and latches data with sub-15 ns latency, while the AEC-Q100 grade tolerates -40C to +125C factory-floor ambient.
Recommandé
Automotive Body-Electronics Modules
The 5M160ZE64A5N's 'A' suffix denotes AEC-Q100 qualification with -40C to +125C operation, which suits body-electronics modules (BCM) for seat control, lighting, and door modules. It performs LIN/CAN glue logic, drives LED matrices via PWM, and sequences power rails for downstream MCUs. The non-volatile flash fabric boots in <1 ms, eliminating the in-rush flicker that plagues SRAM FPGAs in interior lighting, while the 8 Kbit user flash block stores configuration plus small calibration tables.
Recommandé
Power-Sequencing and Reset Management
FPGA-based boards require precise rail sequencing to prevent latch-up, and the 5M160ZE64A5N delivers deterministic sequencing at 7.5 ns resolution without external clocks. It monitors PG (power-good) inputs from upstream DC-DC converters and gates downstream enables with user-defined delay chains. The 54 user I/Os comfortably handle 4-rail sequencing plus status LEDs, and the 1.8 V core plus 3.3 V I/O flexibility interfaces directly to most point-of-load regulators.
Recommandé
Motor-Control Glue Logic
The 5M160ZE64A5N is widely deployed in BLDC and stepper motor controllers as the glue layer between an MCU and the gate drivers, handling Hall-sensor decoding, commutation tables, and fault aggregation. Its 118.3 MHz max frequency easily decodes 50 kHz PWM edges, while the AEC-Q100 grade supports under-the-hood temperature swings. The 8 Kbits user flash also stores motor-specific calibration constants, allowing the same CPLD image to be deployed across motor variants by re-flashing.
Recommandé
Legacy Interface Translation (PCI/ISA to Serial)
Many industrial systems still use 5 V PCI/ISA peripherals that must connect to modern 3.3 V processors, and the 5M160ZE64A5N's multi-voltage I/O banks (1.5/1.8/2.5/3.3 V) allow direct level shifting without external buffers. It implements address-decode logic, byte-swapping, and interrupt steering at sub-15 ns latency. The 64-EQFP with exposed pad simplifies thermal design in legacy chassis where ambient reaches +85C.
Recommandé
Display and LED Matrix Driving
The 5M160ZE64A5N's 54 user I/Os and 118.3 MHz bandwidth make it well-suited to drive multiplexed LED matrices, character LCDs, and segment displays with low CPU overhead. Its 1.8 V core reduces power consumption versus 5 V legacy CPLDs, while its 3.3 V-tolerant I/O banks drive modern LED-driver ICs directly. The instant-on flash fabric also eliminates the in-rush flicker that would otherwise reveal uninitialized display columns at power-up.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 5M160ZE64A5N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 5M160ZE64C5N | 5M160ZE64I5N | 5M160ZE64A5 | 5M160ZE64C4N |
|---|---|---|---|---|---|
| Package | 64-pin EQFP | 64-pin EQFP - same | 64-pin EQFP - same | 64-pin EQFP - same | 64-pin EQFP - same |
| Brand | Altera | Altera | Altera | Altera | Altera |
| Macro Cells | 128 | 128 | 128 | 128 | 128 |
| Pin-to-Pin Delay (tPD) | 7.5 ns | 7.5 ns | 7.5 ns | 7.5 ns | 10 ns |
| Max Frequency (fMAX) | 118.3 MHz | 118.3 MHz | 118.3 MHz | 118.3 MHz | Lower (speed grade 4) |
| Operating Temperature | -40C to +125C (automotive) | 0C to +85C (commercial) | -40C to +100C (industrial) | -40C to +125C (automotive) | 0C to +85C (commercial) |
| AEC-Q100 Qualified | Yes | No | No | Yes | No |
| User Flash Memory | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
Principaux différenciateurs
- AEC-Q100 automotive qualification on this part number only (vs 5M160ZE64C5N)
- Same die across A/C/I suffixes for design portability (vs 5M160ZE64I5N)
- Speed-grade 5 yields fastest timing margin (vs 5M160ZE64C4N)
- Non-volatile flash fabric eliminates boot PROM (vs XC2C64A-7VQG44C)
Notes de conception
The 5M160ZE64A5N requires a clean 1.8 V VCCINT rail from 1.71 V to 1.89 V. Place a 0.1 uF ceramic decoupling capacitor within 5 mm of every VCCINT pin, plus a 10 uF bulk ceramic near the EQFP exposed pad. The exposed pad (EP) MUST be soldered to the ground plane to keep junction temperature below +125C at full industrial load. Estimated: at ICCINT ~50 mA typical + 54 I/O switching, plan ~500 mW dissipation.
Route all JTAG signals (TDI, TMS, TCK, TDO) in a single bus with 4.7 kohm pull-ups on TMS and TDI; keep the JTAG chain stub-free and away from switching signals. Provide a 4-pin JTAG header on the production PCB even if programming is via USB-Blaster, to enable field re-flash and FA. Keep nCONFIG and nSTATUS lines routed with 10 kohm pull-up to VCCIO for clean reset behavior.
The EQFP-64 exposed pad provides the primary thermal path. Use thermal vias in a 4x4 grid under the EP to a ground plane - typical design uses 0.3 mm via diameter, 1.0 mm pitch. At +85C ambient, the device can dissipate roughly 1 W; at +125C industrial ambient, derate to ~0.5 W. Without the EP soldered properly, junction temperature can exceed +150C under sustained logic activity.
Do not confuse the MAX V family (non-volatile, instant-on, 1.8 V core) with the older MAX II family (also non-volatile but different JTAG IDs) - mixing programmer files bricks the device. Always verify the Quartus programmer reads back the correct device ID (0x020F for 5M160ZE64) before issuing a Program operation. Also: VCCIO bank supplies must NOT be left floating, or undefined I/O behavior will cause in-rush current at startup.
Separate analog and digital ground returns on a multi-layer PCB; the MAX V does not require a split plane, but sensitive analog references near the device benefit from a quiet ground island tied at one point. Keep high-speed I/O traces matched within 5 mm for parallel interfaces, and use the per-pin programmable slew-rate feature to slow edges on long traces and reduce EMI emissions below CISPR 25 automotive limits.
Informations de conformité
AEC-Q100 qualification per Altera automotive-grade datasheet; RoHS and REACH compliant per distributor listings; lead-free and halogen-free per package materials declaration.
