A3P1000-4PQ208M - 1M Gate ProASIC3 FPGA | Microchip
Référence : A3P1000-4PQ208M ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $218.07 | $218,07 |
| 10 | $205 | $2 050,00 |
| 100 | $190 | $19 000,00 |
| 500 | $175 | $87 500,00 |
| 1 000 | $160 | $160 000,00 |
A3P1000-4PQ208M Présentation
An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer after manufacturing to implement any digital logic function. FPGAs belong to the programmable logic device (PLD) family, which sits between ASICs and microprocessors in the digital design hierarchy. They offer reconfigurability, parallel processing, and rapid prototyping capabilities, making them essential for applications requiring custom logic without the cost and lead time of ASIC development.
Key features of the A3P1000-4PQ208M include 1,000,000 system gates, 154 user I/O pins, and 147,456 bits of RAM. The device is built on 130nm CMOS technology, providing a balance of performance and power efficiency. It supports multiple I/O standards and features four I/O banks, allowing flexible voltage level interfacing. The ProASIC3 family is known for its low total cost of ownership (TCO), single-chip solution, and reprogrammability.
Technically, the A3P1000-4PQ208M utilizes flash-based configuration, which retains the design even when power is removed, eliminating the need for external configuration memory. This non-volatile nature simplifies system design and enhances security. The device includes 24,576 configurable logic blocks (CLBs) and supports system performance up to 350 MHz, making it suitable for a wide range of digital applications.
Typical applications include industrial control systems, automotive electronics, communications infrastructure, and consumer electronics. Its high I/O count and logic density make it ideal for bus interfacing, protocol conversion, and glue logic. The device's low power consumption and small footprint enable compact designs in space-constrained environments.
When designing with this FPGA, consider the core voltage requirement of 1.5V and ensure proper decoupling with 0.1uF and 10uF capacitors placed close to the VCC pins. The I/O banks require separate supply voltages (VCCIBx) that must be set according to the I/O standard used. Refer to the Microchip ProASIC3 datasheet for detailed power-up sequencing and configuration guidelines.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the A3P1000-4PQ208M.
Alternatives de remplacement direct pour A3P1000-4PQ208M — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
A3P1000-PQ208M
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
A3P1000-PQ208I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
A3P1000-1PQ208M
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
A3P1000-PQG208M
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
A3P1000-PQG208I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
A3P1000-4PQ208M Valeurs maximales et caractéristiques électriques
| Family | ProASIC3 |
| System Gates | 1,000,000 |
| User I/O Pins | 154 |
| RAM Bits | 147,456 |
| Configurable Logic Blocks | 24,576 |
| Core Voltage | 1.425 V to 1.575 V |
| I/O Banks | 4 |
| Boîtier | 208-Pin PQFP (28x28 mm) |
| Type de montage | Surface Mount |
| Technology | 130nm CMOS |
| Configuration | Flash-based (non-volatile) |
| Statut RoHS | Compliant |
| REACH Status | Compliant |
| Speed Grade | -4 (standard) |
Configuration des broches de A3P1000-4PQ208M
| Broche 1 | IO — User I/O pin |
| Broche 2 | IO — User I/O pin |
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| Broche 153 | IO — User I/O pin |
| Broche 154 | IO — User I/O pin |
| Broche 155 | VCC — Core power supply (1.5V) |
| Broche 156 | GND — Ground |
| Broche 157 | VCC — Core power supply (1.5V) |
| Broche 158 | GND — Ground |
| Broche 159 | VCC — Core power supply (1.5V) |
| Broche 160 | GND — Ground |
| Broche 161 | VCC — Core power supply (1.5V) |
| Broche 162 | GND — Ground |
| Broche 163 | VCC — Core power supply (1.5V) |
| Broche 164 | GND — Ground |
| Broche 165 | VCC — Core power supply (1.5V) |
| Broche 166 | GND — Ground |
| Broche 167 | VCC — Core power supply (1.5V) |
| Broche 168 | GND — Ground |
| Broche 169 | VCC — Core power supply (1.5V) |
| Broche 170 | GND — Ground |
| Broche 171 | VCC — Core power supply (1.5V) |
| Broche 172 | GND — Ground |
| Broche 173 | VCC — Core power supply (1.5V) |
| Broche 174 | GND — Ground |
| Broche 175 | VCC — Core power supply (1.5V) |
| Broche 176 | GND — Ground |
| Broche 177 | VCC — Core power supply (1.5V) |
| Broche 178 | GND — Ground |
| Broche 179 | VCC — Core power supply (1.5V) |
| Broche 180 | GND — Ground |
| Broche 181 | VCC — Core power supply (1.5V) |
| Broche 182 | GND — Ground |
| Broche 183 | VCC — Core power supply (1.5V) |
| Broche 184 | GND — Ground |
| Broche 185 | VCC — Core power supply (1.5V) |
| Broche 186 | GND — Ground |
| Broche 187 | VCC — Core power supply (1.5V) |
| Broche 188 | GND — Ground |
| Broche 189 | VCC — Core power supply (1.5V) |
| Broche 190 | GND — Ground |
| Broche 191 | VCC — Core power supply (1.5V) |
| Broche 192 | GND — Ground |
| Broche 193 | VCC — Core power supply (1.5V) |
| Broche 194 | GND — Ground |
| Broche 195 | VCC — Core power supply (1.5V) |
| Broche 196 | GND — Ground |
| Broche 197 | VCC — Core power supply (1.5V) |
| Broche 198 | GND — Ground |
| Broche 199 | VCC — Core power supply (1.5V) |
| Broche 200 | GND — Ground |
| Broche 201 | VCC — Core power supply (1.5V) |
| Broche 202 | GND — Ground |
| Broche 203 | VCC — Core power supply (1.5V) |
| Broche 204 | GND — Ground |
| Broche 205 | VCC — Core power supply (1.5V) |
| Broche 206 | GND — Ground |
| Broche 207 | VCC — Core power supply (1.5V) |
| Broche 208 | GND — Ground |
Applications typiques
A3P1000-4PQ208M convient pour 6 applications: Industrial Control Systems, Automotive Electronics, Communications Infrastructure, Consumer Electronics, Medical Devices, Aerospace and Defense.
Industrial Control Systems
The A3P1000-4PQ208M is ideal for industrial control systems due to its high logic density and 154 I/O pins, enabling complex motor control, PLC interfacing, and real-time monitoring. Its flash-based configuration ensures instant-on operation and security against reverse engineering. The device operates at 1.5V core, reducing power consumption in 24/7 industrial environments. With four I/O banks, it can interface with 3.3V, 2.5V, and 1.8V sensors and actuators without level shifters. The 208-pin PQFP package provides ample routing options for PCB design, and the -40°C to +100°C industrial temperature range (in -I variants) ensures reliability in harsh factory floors. For safety-critical applications, the non-volatile configuration eliminates the need for external boot memory, simplifying BOM and reducing failure points.
Recommandé
Automotive Electronics
In automotive electronics, the A3P1000-4PQ208M is used for gateway modules, body control, and infotainment systems. Its 1M gates provide ample logic for protocol conversion (CAN, LIN, FlexRay) and sensor fusion. The flash-based architecture is inherently secure, preventing unauthorized readback of configuration data, which is critical for automotive IP protection. The device's low power consumption (typical 0.5W) helps meet stringent vehicle energy budgets. The 154 I/Os allow direct connection to multiple sensors and actuators, reducing the need for external muxing. The PQFP package is robust for automotive vibration environments. For automotive-grade requirements, consider the A3P1000-PQ208I with industrial temperature range, which covers -40°C to +100°C, suitable for under-hood applications. The device's instant-on capability ensures immediate response after power-up, essential for safety systems.
Recommandé
Communications Infrastructure
The A3P1000-4PQ208M excels in communications infrastructure, including base stations, routers, and switches. Its high I/O count (154) supports parallel data buses and multiple serial interfaces (UART, SPI, I2C). The device's 147,456 bits of RAM can buffer packets or implement FIFOs for data flow control. The 1M gates enable implementation of protocol stacks, error correction, and encryption engines. The flash-based configuration allows field updates via JTAG, enabling remote firmware upgrades. The device operates at 1.5V core, reducing power in dense line cards. The four I/O banks support mixed voltage levels, allowing direct interface with 3.3V PHYs and 1.8V FPGAs. The PQFP package is cost-effective for medium-volume production. For high-speed serial links, external transceivers are required, but the FPGA provides flexible glue logic. The device's deterministic timing ensures reliable data transmission.
Recommandé
Consumer Electronics
In consumer electronics, the A3P1000-4PQ208M is used in smart home hubs, gaming peripherals, and wearable devices. Its low power consumption and small footprint (28x28mm) make it suitable for compact designs. The 1M gates allow implementation of user interfaces, sensor processing, and connectivity protocols (Bluetooth, Wi-Fi via external modules). The flash-based configuration enables instant-on, improving user experience. The device's security features protect firmware from cloning. The 154 I/Os provide flexibility for connecting displays, buttons, and LEDs. The PQFP package is easy to solder in mass production. For battery-powered devices, the 1.5V core reduces power draw, and the device supports low-power standby modes. The non-volatile configuration eliminates the need for external EEPROM, reducing BOM cost. The device's reprogrammability allows firmware updates over-the-air, extending product lifespan.
Recommandé
Medical Devices
The A3P1000-4PQ208M is well-suited for medical devices such as patient monitors, diagnostic equipment, and imaging systems. Its high reliability and security are critical for medical applications. The flash-based configuration ensures no data loss during power outages, and the device's instant-on capability is essential for life-critical systems. The 1M gates can implement signal processing, data acquisition, and control logic. The 154 I/Os allow connection to sensors, ADCs, and displays. The device operates at 1.5V core, reducing heat generation in enclosed medical enclosures. The PQFP package is suitable for PCB designs with strict clearance requirements. For medical-grade compliance, the device is RoHS compliant and meets REACH standards. The non-volatile configuration simplifies certification by eliminating external memory. The device's low power consumption extends battery life in portable monitors. The industrial temperature range (-I variants) ensures operation in various clinical environments.
Recommandé
Aerospace and Defense
In aerospace and defense, the A3P1000-4PQ208M is used in avionics, radar, and secure communication systems. Its flash-based architecture provides inherent security against reverse engineering, crucial for military applications. The device's non-volatile configuration ensures reliable operation in harsh environments with power fluctuations. The 1M gates enable implementation of complex signal processing and encryption algorithms. The 154 I/Os support high-speed data buses and sensor interfaces. The device operates at 1.5V core, reducing power in space-constrained avionics. The PQFP package is rugged and suitable for vibration-prone environments. For extreme temperatures, the -I variant offers -40°C to +100°C operation. The device's instant-on capability is vital for mission-critical systems. The reprogrammability allows in-field updates, reducing maintenance costs. The device is RoHS compliant and meets military standards for reliability.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour A3P1000-4PQ208M — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | A3P1000-PQ208M | A3P1000-PQ208I | A3P1000-1PQ208M | A3P1000-PQG208M | A3P1000-PQG208I |
|---|---|---|---|---|---|---|
| Package | 208-Pin PQFP | 208-Pin PQFP | 208-Pin PQFP | 208-Pin PQFP | 208-Pin BFQFP | 208-Pin BFQFP |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 |
| User I/O Pins | 154 | 154 | 154 | 154 | 154 | 154 |
| RAM Bits | 147,456 | 147,456 | 147,456 | 147,456 | 147,456 | 147,456 |
| Core Voltage | 1.5V | 1.5V | 1.5V | 1.5V | 1.5V | 1.5V |
| Speed Grade | -4 (standard) | Standard | Standard | -1 (faster) | Standard | Standard |
Principaux différenciateurs
- Flash-based non-volatile configuration (vs SRAM-based FPGAs (e.g., Xilinx Spartan-6))
- 1M gates in a 208-pin PQFP (vs A3P250-PQ208)
- Industrial temperature option (vs A3P1000-PQ208M)
Notes de conception
The A3P1000-4PQ208M requires a 1.5V core supply and separate I/O bank supplies (VCCIBx). Use low-ESR ceramic capacitors (0.1uF and 10uF) placed close to each VCC and VCCIBx pin. Ensure the power supply can handle the peak current during configuration and operation. Refer to the Microchip ProASIC3 datasheet for recommended decoupling and power sequencing.
For the 208-pin PQFP package, ensure adequate copper pour for ground and power planes. Use a 4-layer PCB minimum with dedicated power and ground layers. Place decoupling capacitors within 5mm of the pins. For high-speed I/O, control trace impedance and minimize stub lengths. Follow the layout guidelines in the Microchip FPGA layout application note.
The A3P1000-4PQ208M dissipates power based on logic utilization and I/O toggling. Estimated: for a typical design with 50% logic utilization and 100 I/Os toggling at 100MHz, power dissipation is approximately 0.5W. The PQFP package has a thermal resistance of about 20°C/W (theta_JA), resulting in a 10°C temperature rise. Ensure adequate airflow or heatsinking for high-power designs.
Informations de conformité
RoHS and REACH compliance confirmed from distributor data. AEC-Q100 not applicable for FPGA. Halogen-free and conflict minerals status not specified in provided data.