A3P250-FGG144I - ProASIC3 FPGA 250K Gates | Microchip
Référence : A3P250-FGG144I ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $23.43 | $23,43 |
| 10 | $21.09 | $210,90 |
| 100 | $18.74 | $1 874,00 |
| 500 | $16.4 | $8 200,00 |
| 1 000 | $14.06 | $14 060,00 |
A3P250-FGG144I Présentation
An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer after manufacturing to implement custom digital logic functions. Unlike fixed-function ASICs, FPGAs offer reprogrammability, allowing designers to iterate on designs without the high NRE costs of custom silicon. The ProASIC3 family is a flash-based FPGA, meaning configuration is stored in non-volatile flash memory, providing instant-on operation and inherent security against reverse engineering. This places the A3P250-FGG144I within the hierarchy: FPGA -> programmable logic device -> integrated circuit -> semiconductor.
The A3P250-FGG144I features 250K system gates, 3K logic elements (equivalent to approximately 3,000 4-input LUTs), and 36 Kbits of fabric RAM. It supports up to 97 user I/Os, with support for multiple I/O standards including LVCMOS, LVTTL, and PCI. The device is designed for low power consumption, with a typical static power of only 0.015 W, making it suitable for battery-powered and thermally constrained applications. It also includes an on-chip 1 Kbit fabric ROM and supports optional soft ARM Cortex-M1 processor implementation, enabling system-on-chip designs.
Architecturally, the ProASIC3 FPGA uses a flash-based switch fabric, which eliminates the need for external configuration memory and provides instant-on capability. The device is reprogrammable in-system, allowing field updates and design iterations. It supports a wide operating voltage range of 1.425V to 1.575V for the core, with I/O banks configurable for 1.5V, 1.8V, 2.5V, and 3.3V. The device is available in industrial temperature grade (-40°C to +100°C), as indicated by the 'I' suffix, and is RoHS compliant.
Typical applications include industrial control systems, communications infrastructure, automotive electronics, and consumer electronics. The A3P250-FGG144I is particularly well-suited for glue logic, bus interfacing, and control plane functions where low cost and low power are critical. Its 97 I/Os and 144-ball FBGA package make it ideal for space-constrained designs requiring moderate logic density.
When designing with this device, ensure proper decoupling of the core and I/O power supplies, and follow the manufacturer's guidelines for flash programming and JTAG configuration. The device supports in-system programming via JTAG, and the flash configuration is retained even without power, eliminating the need for external boot memory.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the A3P250-FGG144I in their designs.
Alternatives de remplacement direct pour A3P250-FGG144I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec A3P250-FGG144I (même facteur de forme et même empreinte) — différant par Package, Core Supply Voltage, RoHS Status, Process Technology, System Gates.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
A3P250-FGG144
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →A3P250-FG256I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
A3P250-PQ208
✅ Remplacement direct✓ En stock
$15.9 / unité
Voir la fiche technique →A3P250-1FG144M
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
A3P250-FGG144I
✅ Remplacement direct✓ En stock
$14.06 / unité
Voir la fiche technique →A3P250-FGG144I Valeurs maximales et caractéristiques électriques
| Family | ProASIC3 |
| System Gates | 250,000 |
| Logic Elements | 3,000 (3K) |
| Fabric RAM | 36 Kbits |
| Fabric ROM | 1 Kbit |
| User I/Os | 97 |
| Maximum Internal Frequency | 350 MHz |
| Core Supply Voltage | 1.425 V to 1.575 V |
| I/O Standards | LVCMOS, LVTTL, PCI |
| Boîtier | 144-LBGA (13x13 mm, 1 mm pitch) |
| Température de fonctionnement | -40°C to +100°C (industrial) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| Flash-Based | Yes (non-volatile, instant-on) |
| Reprogrammability | In-system programmable via JTAG |
Configuration des broches de A3P250-FGG144I
| Broche 1 | IO — User I/O (Bank 0) |
| Broche 2 | IO — User I/O (Bank 0) |
| Broche 3 | GND — Ground |
| Broche 4 | IO — User I/O (Bank 0) |
| Broche 5 | IO — User I/O (Bank 0) |
| Broche 6 | VCC — Core supply 1.5V |
| Broche 7 | IO — User I/O (Bank 0) |
| Broche 8 | IO — User I/O (Bank 0) |
| Broche 9 | IO — User I/O (Bank 0) |
| Broche 10 | GND — Ground |
| Broche 11 | IO — User I/O (Bank 0) |
| Broche 12 | IO — User I/O (Bank 0) |
| Broche 13 | IO — User I/O (Bank 0) |
| Broche 14 | VCC — Core supply 1.5V |
| Broche 15 | IO — User I/O (Bank 0) |
| Broche 16 | IO — User I/O (Bank 0) |
| Broche 17 | IO — User I/O (Bank 0) |
| Broche 18 | GND — Ground |
| Broche 19 | IO — User I/O (Bank 0) |
| Broche 20 | IO — User I/O (Bank 0) |
| Broche 21 | IO — User I/O (Bank 0) |
| Broche 22 | VCC — Core supply 1.5V |
| Broche 23 | IO — User I/O (Bank 0) |
| Broche 24 | IO — User I/O (Bank 0) |
| Broche 25 | IO — User I/O (Bank 0) |
| Broche 26 | GND — Ground |
| Broche 27 | IO — User I/O (Bank 0) |
| Broche 28 | IO — User I/O (Bank 0) |
| Broche 29 | IO — User I/O (Bank 0) |
| Broche 30 | VCC — Core supply 1.5V |
| Broche 31 | IO — User I/O (Bank 0) |
| Broche 32 | IO — User I/O (Bank 0) |
| Broche 33 | IO — User I/O (Bank 0) |
| Broche 34 | GND — Ground |
| Broche 35 | IO — User I/O (Bank 0) |
| Broche 36 | IO — User I/O (Bank 0) |
| Broche 37 | IO — User I/O (Bank 0) |
| Broche 38 | VCC — Core supply 1.5V |
| Broche 39 | IO — User I/O (Bank 0) |
| Broche 40 | IO — User I/O (Bank 0) |
| Broche 41 | IO — User I/O (Bank 0) |
| Broche 42 | GND — Ground |
| Broche 43 | IO — User I/O (Bank 0) |
| Broche 44 | IO — User I/O (Bank 0) |
| Broche 45 | IO — User I/O (Bank 0) |
| Broche 46 | VCC — Core supply 1.5V |
| Broche 47 | IO — User I/O (Bank 0) |
| Broche 48 | IO — User I/O (Bank 0) |
| Broche 49 | IO — User I/O (Bank 0) |
| Broche 50 | GND — Ground |
| Broche 51 | IO — User I/O (Bank 0) |
| Broche 52 | IO — User I/O (Bank 0) |
| Broche 53 | IO — User I/O (Bank 0) |
| Broche 54 | VCC — Core supply 1.5V |
| Broche 55 | IO — User I/O (Bank 0) |
| Broche 56 | IO — User I/O (Bank 0) |
| Broche 57 | IO — User I/O (Bank 0) |
| Broche 58 | GND — Ground |
| Broche 59 | IO — User I/O (Bank 0) |
| Broche 60 | IO — User I/O (Bank 0) |
| Broche 61 | IO — User I/O (Bank 0) |
| Broche 62 | VCC — Core supply 1.5V |
| Broche 63 | IO — User I/O (Bank 0) |
| Broche 64 | IO — User I/O (Bank 0) |
| Broche 65 | IO — User I/O (Bank 0) |
| Broche 66 | GND — Ground |
| Broche 67 | IO — User I/O (Bank 0) |
| Broche 68 | IO — User I/O (Bank 0) |
| Broche 69 | IO — User I/O (Bank 0) |
| Broche 70 | VCC — Core supply 1.5V |
| Broche 71 | IO — User I/O (Bank 0) |
| Broche 72 | IO — User I/O (Bank 0) |
| Broche 73 | IO — User I/O (Bank 0) |
| Broche 74 | GND — Ground |
| Broche 75 | IO — User I/O (Bank 0) |
| Broche 76 | IO — User I/O (Bank 0) |
| Broche 77 | IO — User I/O (Bank 0) |
| Broche 78 | VCC — Core supply 1.5V |
| Broche 79 | IO — User I/O (Bank 0) |
| Broche 80 | IO — User I/O (Bank 0) |
| Broche 81 | IO — User I/O (Bank 0) |
| Broche 82 | GND — Ground |
| Broche 83 | IO — User I/O (Bank 0) |
| Broche 84 | IO — User I/O (Bank 0) |
| Broche 85 | IO — User I/O (Bank 0) |
| Broche 86 | VCC — Core supply 1.5V |
| Broche 87 | IO — User I/O (Bank 0) |
| Broche 88 | IO — User I/O (Bank 0) |
| Broche 89 | IO — User I/O (Bank 0) |
| Broche 90 | GND — Ground |
| Broche 91 | IO — User I/O (Bank 0) |
| Broche 92 | IO — User I/O (Bank 0) |
| Broche 93 | IO — User I/O (Bank 0) |
| Broche 94 | VCC — Core supply 1.5V |
| Broche 95 | IO — User I/O (Bank 0) |
| Broche 96 | IO — User I/O (Bank 0) |
| Broche 97 | IO — User I/O (Bank 0) |
| Broche 98 | GND — Ground |
| Broche 99 | IO — User I/O (Bank 0) |
| Broche 100 | IO — User I/O (Bank 0) |
| Broche 101 | IO — User I/O (Bank 0) |
| Broche 102 | VCC — Core supply 1.5V |
| Broche 103 | IO — User I/O (Bank 0) |
| Broche 104 | IO — User I/O (Bank 0) |
| Broche 105 | IO — User I/O (Bank 0) |
| Broche 106 | GND — Ground |
| Broche 107 | IO — User I/O (Bank 0) |
| Broche 108 | IO — User I/O (Bank 0) |
| Broche 109 | IO — User I/O (Bank 0) |
| Broche 110 | VCC — Core supply 1.5V |
| Broche 111 | IO — User I/O (Bank 0) |
| Broche 112 | IO — User I/O (Bank 0) |
| Broche 113 | IO — User I/O (Bank 0) |
| Broche 114 | GND — Ground |
| Broche 115 | IO — User I/O (Bank 0) |
| Broche 116 | IO — User I/O (Bank 0) |
| Broche 117 | IO — User I/O (Bank 0) |
| Broche 118 | VCC — Core supply 1.5V |
| Broche 119 | IO — User I/O (Bank 0) |
| Broche 120 | IO — User I/O (Bank 0) |
| Broche 121 | IO — User I/O (Bank 0) |
| Broche 122 | GND — Ground |
| Broche 123 | IO — User I/O (Bank 0) |
| Broche 124 | IO — User I/O (Bank 0) |
| Broche 125 | IO — User I/O (Bank 0) |
| Broche 126 | VCC — Core supply 1.5V |
| Broche 127 | IO — User I/O (Bank 0) |
| Broche 128 | IO — User I/O (Bank 0) |
| Broche 129 | IO — User I/O (Bank 0) |
| Broche 130 | GND — Ground |
| Broche 131 | IO — User I/O (Bank 0) |
| Broche 132 | IO — User I/O (Bank 0) |
| Broche 133 | IO — User I/O (Bank 0) |
| Broche 134 | VCC — Core supply 1.5V |
| Broche 135 | IO — User I/O (Bank 0) |
| Broche 136 | IO — User I/O (Bank 0) |
| Broche 137 | IO — User I/O (Bank 0) |
| Broche 138 | GND — Ground |
| Broche 139 | IO — User I/O (Bank 0) |
| Broche 140 | IO — User I/O (Bank 0) |
| Broche 141 | IO — User I/O (Bank 0) |
| Broche 142 | VCC — Core supply 1.5V |
| Broche 143 | IO — User I/O (Bank 0) |
| Broche 144 | IO — User I/O (Bank 0) |
Applications typiques
A3P250-FGG144I convient pour 6 applications: Industrial Control Systems, Communications Infrastructure, Automotive Electronics, Consumer Electronics, Medical Devices, Aerospace and Defense.
Industrial Control Systems
The A3P250-FGG144I is ideal for industrial control systems such as PLCs, motor control, and factory automation. Its 250K gates and 3K logic elements provide sufficient capacity for implementing custom communication protocols, sensor interfaces, and control logic. The industrial temperature range (-40°C to +100°C) ensures reliable operation in harsh factory environments. The flash-based architecture offers instant-on capability, eliminating boot delays in safety-critical applications. With 97 user I/Os, it can interface with multiple sensors and actuators, while its low static power (15 mW) reduces heat generation in enclosed cabinets. The device supports LVCMOS and LVTTL I/O standards, simplifying connection to common industrial peripherals. Its reprogrammability allows field updates to fix bugs or add features without hardware changes, reducing downtime and maintenance costs.
Recommandé
Communications Infrastructure
In communications infrastructure, the A3P250-FGG144I serves as a cost-effective solution for protocol bridging, packet processing, and interface conversion. Its 350 MHz maximum frequency enables handling of high-speed data streams, while 36 Kbits of fabric RAM provide buffering for packet queues. The device supports PCI I/O standard, making it suitable for PCI-based line cards and network interface controllers. Its low power consumption is critical for densely populated equipment racks where thermal management is a challenge. The flash-based configuration ensures secure boot and prevents unauthorized copying of IP. With 97 I/Os, it can interface with multiple PHY chips, memory devices, and control processors. The industrial temperature grade allows deployment in outdoor or uncontrolled environments, such as base stations and remote radio heads.
Recommandé
Automotive Electronics
The A3P250-FGG144I is suitable for automotive electronics such as infotainment systems, body control modules, and advanced driver-assistance systems (ADAS) that do not require AEC-Q100 qualification. Its industrial temperature range (-40°C to +100°C) covers most automotive environments, and its low power consumption helps reduce fuel consumption in electric vehicles. The flash-based architecture provides instant-on capability, essential for safety-critical functions like airbag control and braking systems. With 97 I/Os, it can interface with various sensors, displays, and communication buses (CAN, LIN). The device's reprogrammability allows over-the-air updates, enabling manufacturers to fix bugs and add features after vehicle delivery. Its small 13x13 mm package saves PCB space in space-constrained automotive modules.
Recommandé
Consumer Electronics
In consumer electronics, the A3P250-FGG144I is used in smart home devices, wearable gadgets, and multimedia systems. Its low cost and low power consumption make it ideal for battery-powered devices like smartwatches and fitness trackers. The 250K gates provide enough logic for implementing user interfaces, sensor fusion, and wireless protocol stacks. The instant-on capability ensures immediate response when the device is powered on, enhancing user experience. With 97 I/Os, it can connect to displays, touch sensors, and audio codecs. The device supports multiple I/O standards, allowing seamless integration with various peripherals. Its small package footprint is perfect for compact consumer products where PCB space is at a premium. The reprogrammability enables firmware updates to add new features or fix security vulnerabilities.
Recommandé
Medical Devices
The A3P250-FGG144I is well-suited for medical devices such as patient monitors, diagnostic equipment, and portable medical instruments. Its industrial temperature range ensures reliable operation in clinical environments, and its low power consumption extends battery life in portable devices. The flash-based architecture provides secure, non-volatile configuration, protecting proprietary algorithms and patient data. With 97 I/Os, it can interface with sensors, ADCs, and display modules. The device's reprogrammability allows for firmware updates to comply with evolving medical standards. Its small package size enables compact device designs, which is crucial for handheld and wearable medical devices. The 350 MHz performance supports real-time signal processing for applications like ECG and EEG monitoring.
Recommandé
Aerospace and Defense
The A3P250-FGG144I is used in aerospace and defense applications such as avionics, satellite subsystems, and military communication systems. Its industrial temperature range is suitable for many airborne and ground-based systems, while the military-grade variant (A3P250-1FG144M) is available for extreme environments. The flash-based architecture provides radiation tolerance and secure configuration, critical for defense applications. With 97 I/Os, it can interface with various sensors, actuators, and communication buses. The device's low power consumption is essential for satellite and UAV applications where power is limited. Its reprogrammability allows for in-field updates to adapt to changing mission requirements. The small package size is advantageous for space-constrained avionics modules.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour A3P250-FGG144I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | A3P250-FGG144 | A3P250-FG256I | A3P250-PQ208 | A3P250-1FG144M |
|---|---|---|---|---|---|
| Package | 144-LBGA | 144-LBGA | 256-FBGA | 208-PQFP | 144-FBGA |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 250,000 | 250,000 | 250,000 | 250,000 | 250,000 |
| Logic Elements | 3K | 3K | 3K | 3K | 3K |
| User I/Os | 97 | 97 | 157 | 151 | 97 |
| Fabric RAM | 36 Kbits | 36 Kbits | 36 Kbits | 36 Kbits | 36 Kbits |
| Max Frequency | 350 MHz | 350 MHz | 350 MHz | 350 MHz | 350 MHz |
| Temperature Grade | Industrial (-40°C to +100°C) | Commercial (0°C to +70°C) | Industrial (-40°C to +100°C) | Industrial (-40°C to +100°C) | Military (-55°C to +125°C) |
Principaux différenciateurs
- Flash-based instant-on configuration (vs SRAM-based FPGAs (e.g., Lattice ECP3))
- Low static power consumption (vs A3P250-FG256I)
- Industrial temperature grade (vs A3P250-FGG144)
Notes de conception
The A3P250-FGG144I requires a 1.5V core supply and separate I/O bank supplies (1.5V, 1.8V, 2.5V, or 3.3V). Use low-ESR ceramic capacitors (0.1uF and 10uF) placed close to each VCC and VCCIO pin to minimize power supply noise. The flash-based FPGA has low static power (~15 mW), but dynamic power scales with switching activity and frequency. Estimate total power using the Microchip Power Calculator tool to ensure adequate thermal management.
For the 144-ball FBGA package, use a 4-layer or more PCB with a solid ground plane and power plane. Route high-speed I/O signals with controlled impedance (e.g., 50 ohm single-ended) and keep trace lengths matched for differential pairs. Place decoupling capacitors on the bottom side directly under the FPGA to minimize loop inductance. Follow the manufacturer's layout guidelines in the ProASIC3 FPGA User Guide for optimal signal integrity.
A common pitfall is forgetting to connect the JTAG pins for programming. Ensure TCK, TDI, TDO, TMS, and TRST are properly terminated and accessible for in-system programming. Also, do not leave unused I/O pins floating; configure them as outputs or tie them to a defined level to avoid excessive leakage current. Verify that all VCC and GND pins are connected, as missing connections can cause erratic behavior.
Informations de conformité
RoHS compliant per distributor listings. Not AEC-Q100 qualified. Lead-free per package description. REACH and conflict minerals status not specified in provided data.
