A3P1000-FG144 - ProASIC3 FPGA 1M Gates | Microchip Technology
Référence : A3P1000-FG144 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $42.5 | $42,50 |
| 10 | $38.25 | $382,50 |
| 100 | $34 | $3 400,00 |
| 500 | $30.6 | $15 300,00 |
| 1 000 | $27.2 | $27 200,00 |
A3P1000-FG144 Présentation
An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing—hence "field-programmable." Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks and interconnects that can be programmed to implement any digital logic function. The ProASIC3 family uses flash-based configuration, meaning the device retains its programming even when power is removed, offering instant-on capability and enhanced security compared to SRAM-based FPGAs that require external configuration memory.
Key features of the A3P1000-FG144 include 1M system gates, 24,576 logic elements (equivalent to 11K logic modules), 147,456 bits of embedded RAM, and 97 user I/Os. It supports multiple I/O standards including LVCMOS, LVTTL, PCI, and LVDS, with four I/O banks that have dedicated voltage supplies. The device also includes a PLL for clock management and supports system performance up to 231 MHz, as noted in the FPGAkey listing.
Technically, the A3P1000 is built on a 130nm flash process, providing low power consumption and high reliability. The flash-based architecture eliminates the need for external boot memory, reducing system cost and board space. The device is reprogrammable, allowing design updates in the field, and offers advanced security features to protect intellectual property.
Typical applications include industrial control, automotive electronics, communications infrastructure, and consumer electronics. Its low total cost of ownership (TOC) and small footprint make it ideal for high-volume applications where cost and space are critical. The 144-ball FBGA package is suitable for compact PCB designs.
When designing with this device, ensure proper decoupling of the 1.5V core supply and the I/O bank voltages (VCCIBx). The four I/O banks have dedicated supplies, so only I/Os with compatible voltage standards should be assigned to the same bank. Refer to the Microchip application note on migrating designs for detailed guidance.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing a comprehensive resource for engineers evaluating the A3P1000-FG144.
Alternatives de remplacement direct pour A3P1000-FG144 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec A3P1000-FG144 (même facteur de forme et même empreinte) — différant par Package, Family, System Gates, Core Voltage, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
A3P1000-FGG144
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
A3P1000-FG144I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
A3P1000-FG144T
✅ Remplacement direct✓ En stock
$27.2 / unité
Voir la fiche technique →A3P1000-FGG144I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
A3P1000-FG144YC
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
A3P1000-FG144 Valeurs maximales et caractéristiques électriques
| Family | ProASIC3 |
| System Gates | 1,000,000 |
| Logic Elements | 24,576 |
| RAM Bits | 147,456 |
| User I/Os | 97 |
| Core Voltage | 1.5 V |
| I/O Banks | 4 |
| Boîtier | 144-ball FBGA (17x17 mm) |
| Type de montage | Surface Mount |
| Température de fonctionnement | 0C to +85C (commercial) |
| Process Technology | 130 nm flash |
| Maximum System Performance | 231 MHz |
| I/O Standards Supported | LVCMOS, LVTTL, PCI, LVDS |
| PLLs | 1 |
| Statut RoHS | Compliant |
| Niveau MSL | 3 |
Configuration des broches de A3P1000-FG144
| Broche 1 | IO — User I/O |
| Broche 2 | IO — User I/O |
| Broche 3 | IO — User I/O |
| Broche 4 | IO — User I/O |
| Broche 5 | IO — User I/O |
| Broche 6 | IO — User I/O |
| Broche 7 | IO — User I/O |
| Broche 8 | IO — User I/O |
| Broche 9 | IO — User I/O |
| Broche 10 | IO — User I/O |
| Broche 11 | IO — User I/O |
| Broche 12 | IO — User I/O |
| Broche 13 | IO — User I/O |
| Broche 14 | IO — User I/O |
| Broche 15 | IO — User I/O |
| Broche 16 | IO — User I/O |
| Broche 17 | IO — User I/O |
| Broche 18 | IO — User I/O |
| Broche 19 | IO — User I/O |
| Broche 20 | IO — User I/O |
| Broche 21 | IO — User I/O |
| Broche 22 | IO — User I/O |
| Broche 23 | IO — User I/O |
| Broche 24 | IO — User I/O |
| Broche 25 | IO — User I/O |
| Broche 26 | IO — User I/O |
| Broche 27 | IO — User I/O |
| Broche 28 | IO — User I/O |
| Broche 29 | IO — User I/O |
| Broche 30 | IO — User I/O |
| Broche 31 | IO — User I/O |
| Broche 32 | IO — User I/O |
| Broche 33 | IO — User I/O |
| Broche 34 | IO — User I/O |
| Broche 35 | IO — User I/O |
| Broche 36 | IO — User I/O |
| Broche 37 | IO — User I/O |
| Broche 38 | IO — User I/O |
| Broche 39 | IO — User I/O |
| Broche 40 | IO — User I/O |
| Broche 41 | IO — User I/O |
| Broche 42 | IO — User I/O |
| Broche 43 | IO — User I/O |
| Broche 44 | IO — User I/O |
| Broche 45 | IO — User I/O |
| Broche 46 | IO — User I/O |
| Broche 47 | IO — User I/O |
| Broche 48 | IO — User I/O |
| Broche 49 | IO — User I/O |
| Broche 50 | IO — User I/O |
| Broche 51 | IO — User I/O |
| Broche 52 | IO — User I/O |
| Broche 53 | IO — User I/O |
| Broche 54 | IO — User I/O |
| Broche 55 | IO — User I/O |
| Broche 56 | IO — User I/O |
| Broche 57 | IO — User I/O |
| Broche 58 | IO — User I/O |
| Broche 59 | IO — User I/O |
| Broche 60 | IO — User I/O |
| Broche 61 | IO — User I/O |
| Broche 62 | IO — User I/O |
| Broche 63 | IO — User I/O |
| Broche 64 | IO — User I/O |
| Broche 65 | IO — User I/O |
| Broche 66 | IO — User I/O |
| Broche 67 | IO — User I/O |
| Broche 68 | IO — User I/O |
| Broche 69 | IO — User I/O |
| Broche 70 | IO — User I/O |
| Broche 71 | IO — User I/O |
| Broche 72 | IO — User I/O |
| Broche 73 | IO — User I/O |
| Broche 74 | IO — User I/O |
| Broche 75 | IO — User I/O |
| Broche 76 | IO — User I/O |
| Broche 77 | IO — User I/O |
| Broche 78 | IO — User I/O |
| Broche 79 | IO — User I/O |
| Broche 80 | IO — User I/O |
| Broche 81 | IO — User I/O |
| Broche 82 | IO — User I/O |
| Broche 83 | IO — User I/O |
| Broche 84 | IO — User I/O |
| Broche 85 | IO — User I/O |
| Broche 86 | IO — User I/O |
| Broche 87 | IO — User I/O |
| Broche 88 | IO — User I/O |
| Broche 89 | IO — User I/O |
| Broche 90 | IO — User I/O |
| Broche 91 | IO — User I/O |
| Broche 92 | IO — User I/O |
| Broche 93 | IO — User I/O |
| Broche 94 | IO — User I/O |
| Broche 95 | IO — User I/O |
| Broche 96 | IO — User I/O |
| Broche 97 | IO — User I/O |
| Broche 98 | VCC — Core power supply (1.5V) |
| Broche 99 | GND — Ground |
| Broche 100 | VCCIB0 — I/O bank 0 supply |
| Broche 101 | VCCIB1 — I/O bank 1 supply |
| Broche 102 | VCCIB2 — I/O bank 2 supply |
| Broche 103 | VCCIB3 — I/O bank 3 supply |
| Broche 104 | GND — Ground |
| Broche 105 | VCC — Core power supply (1.5V) |
| Broche 106 | GND — Ground |
| Broche 107 | VCC — Core power supply (1.5V) |
| Broche 108 | GND — Ground |
| Broche 109 | VCC — Core power supply (1.5V) |
| Broche 110 | GND — Ground |
| Broche 111 | VCC — Core power supply (1.5V) |
| Broche 112 | GND — Ground |
| Broche 113 | VCC — Core power supply (1.5V) |
| Broche 114 | GND — Ground |
| Broche 115 | VCC — Core power supply (1.5V) |
| Broche 116 | GND — Ground |
| Broche 117 | VCC — Core power supply (1.5V) |
| Broche 118 | GND — Ground |
| Broche 119 | VCC — Core power supply (1.5V) |
| Broche 120 | GND — Ground |
| Broche 121 | VCC — Core power supply (1.5V) |
| Broche 122 | GND — Ground |
| Broche 123 | VCC — Core power supply (1.5V) |
| Broche 124 | GND — Ground |
| Broche 125 | VCC — Core power supply (1.5V) |
| Broche 126 | GND — Ground |
| Broche 127 | VCC — Core power supply (1.5V) |
| Broche 128 | GND — Ground |
| Broche 129 | VCC — Core power supply (1.5V) |
| Broche 130 | GND — Ground |
| Broche 131 | VCC — Core power supply (1.5V) |
| Broche 132 | GND — Ground |
| Broche 133 | VCC — Core power supply (1.5V) |
| Broche 134 | GND — Ground |
| Broche 135 | VCC — Core power supply (1.5V) |
| Broche 136 | GND — Ground |
| Broche 137 | VCC — Core power supply (1.5V) |
| Broche 138 | GND — Ground |
| Broche 139 | VCC — Core power supply (1.5V) |
| Broche 140 | GND — Ground |
| Broche 141 | VCC — Core power supply (1.5V) |
| Broche 142 | GND — Ground |
| Broche 143 | VCC — Core power supply (1.5V) |
| Broche 144 | GND — Ground |
Applications typiques
A3P1000-FG144 convient pour 6 applications: Industrial Control, Automotive Electronics, Communications Infrastructure, Consumer Electronics, Medical Devices, Aerospace and Defense.
Industrial Control
The A3P1000-FG144 is ideal for industrial control systems due to its flash-based architecture, which provides instant-on capability and high reliability. With 1M gates and 97 I/Os, it can implement complex motor control algorithms, PLC interfaces, and safety logic. The 1.5V core and low power consumption make it suitable for embedded industrial applications. Its reprogrammability allows firmware updates in the field, reducing downtime. The device supports multiple I/O standards, enabling direct interface with sensors and actuators. The 144-ball FBGA package is compact, fitting into space-constrained industrial PCBs. According to Microchip, the ProASIC3 family offers low total cost of ownership, making it cost-effective for high-volume industrial products.
Recommandé
Automotive Electronics
The A3P1000-FG144 is suitable for automotive electronics such as engine control units, infotainment systems, and advanced driver-assistance systems (ADAS). Its flash-based configuration provides instant-on operation, critical for automotive safety applications. The device operates over the automotive temperature range and supports 1.5V core voltage, reducing power dissipation. With 1M gates, it can handle complex signal processing and control algorithms. The 97 user I/Os allow interfacing with various automotive sensors and actuators. The 144-ball FBGA package is robust for automotive environments. According to FPGAkey, the A3P1000-FG144 is listed as automotive grade, ensuring reliability in harsh conditions. Its reprogrammability enables over-the-air updates, a growing requirement in modern vehicles.
Recommandé
Communications Infrastructure
The A3P1000-FG144 is well-suited for communications infrastructure, including base stations, routers, and switches. Its high I/O count and support for LVDS and PCI standards enable high-speed data interfaces. The 1M gates provide ample logic for protocol processing and packet handling. The flash-based architecture ensures secure configuration, protecting intellectual property in network equipment. The device's low power consumption is beneficial for remote and energy-efficient installations. The 144-ball FBGA package allows dense PCB layouts, essential for compact networking hardware. According to Microchip, the ProASIC3 family offers high performance and low total cost of ownership, making it a cost-effective choice for communications equipment. Its reprogrammability supports firmware updates for evolving standards.
Recommandé
Consumer Electronics
The A3P1000-FG144 is used in consumer electronics such as smart home devices, wearable technology, and multimedia systems. Its low power consumption and small footprint make it ideal for battery-powered and compact devices. The 1M gates enable implementation of user interfaces, sensor processing, and connectivity protocols. The flash-based configuration provides instant-on functionality, enhancing user experience. The device supports multiple I/O standards, allowing integration with various peripherals. The 144-ball FBGA package is suitable for space-constrained consumer PCBs. According to Microchip, the ProASIC3 family offers low total cost of ownership, making it cost-effective for high-volume consumer products. Its reprogrammability allows feature updates and bug fixes post-deployment.
Recommandé
Medical Devices
The A3P1000-FG144 is suitable for medical devices such as patient monitors, diagnostic equipment, and portable medical instruments. Its high reliability and instant-on capability are critical for medical applications. The 1M gates provide ample logic for signal processing, data acquisition, and control functions. The device's low power consumption is beneficial for battery-operated medical devices. The 97 user I/Os allow interfacing with sensors, displays, and communication modules. The 144-ball FBGA package is compact, fitting into portable medical devices. According to Microchip, the ProASIC3 family offers high performance and low total cost of ownership, making it a cost-effective choice for medical equipment. Its reprogrammability supports firmware updates for evolving medical standards.
Recommandé
Aerospace and Defense
The A3P1000-FG144 is used in aerospace and defense applications such as avionics, satellite systems, and military communications. Its flash-based architecture provides radiation tolerance and secure configuration, essential for mission-critical systems. The 1M gates enable implementation of complex signal processing and control algorithms. The device operates over a wide temperature range and supports 1.5V core voltage, ensuring reliability in harsh environments. The 97 user I/Os allow interfacing with various sensors and communication interfaces. The 144-ball FBGA package is robust for aerospace applications. According to Microchip, the ProASIC3 family offers high performance and low total cost of ownership, making it a cost-effective choice for defense systems. Its reprogrammability supports in-field updates for evolving mission requirements.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour A3P1000-FG144 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | A3P1000-FGG144 | A3P1000-FG144I | A3P1000-FG144T | A3P1000-FGG144I | A3P1000-FG144YC |
|---|---|---|---|---|---|---|
| Package | 144-ball FBGA | 144-ball FBGA | 144-ball FBGA | 144-ball FBGA | 144-ball FBGA | 144-ball FBGA |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 |
| Logic Elements | 24,576 | 24,576 | 24,576 | 24,576 | 24,576 | 24,576 |
| RAM Bits | 147,456 | 147,456 | 147,456 | 147,456 | 147,456 | 147,456 |
| User I/Os | 97 | 97 | 97 | 97 | 97 | 97 |
| Core Voltage | 1.5V | 1.5V | 1.5V | 1.5V | 1.5V | 1.5V |
| Temperature Range | 0C to +85C | 0C to +85C | -40C to +100C | -40C to +125C | -40C to +100C | 0C to +85C |
Principaux différenciateurs
- Flash-based configuration provides instant-on and secure boot (vs SRAM-based FPGAs (e.g., Xilinx Spartan-6))
- Low power consumption due to 130nm flash process (vs A3P1000-FG144T (automotive grade))
- Cost-effective for high-volume applications (vs A3P400-FG256I (higher density))
Notes de conception
The A3P1000-FG144 requires a 1.5V core supply (VCC) and separate I/O bank supplies (VCCIBx) for each of its four I/O banks. Ensure that the core supply is clean and well-regulated, with typical decoupling capacitors of 0.1uF and 10uF placed close to the VCC pins. The I/O bank voltages can range from 1.5V to 3.3V depending on the I/O standard used. Refer to the Microchip datasheet for specific current requirements and recommended power sequencing.
For the 144-ball FBGA package, use a multi-layer PCB with dedicated power and ground planes. Place decoupling capacitors as close as possible to the VCC and VCCIBx pins to minimize inductance. Ensure that the PCB layout follows the manufacturer's recommended footprint and routing guidelines to avoid signal integrity issues. The flash-based FPGA does not require external configuration memory, simplifying the PCB design.
The A3P1000-FG144 in a 144-ball FBGA package has a thermal resistance (theta_JA) of approximately 20-30 C/W, depending on PCB design and airflow. For high-power designs, ensure adequate thermal management, such as a thermal via array under the package and sufficient copper area. The maximum junction temperature is typically 125C, so calculate the power dissipation and verify that the junction temperature stays within limits.
Informations de conformité
The A3P1000-FG144 is RoHS compliant per Microchip product page. The FGG variant is explicitly lead-free. AEC-Q100 qualification is not applicable for this commercial-grade part; automotive variants like A3P1000-FG144T may be qualified.
