A3P250-1PQG208I - ProASIC3 FPGA, 250K Gates | Microchip
Référence : A3P250-1PQG208I ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $25.43 | $25,43 |
| 10 | $23.12 | $231,20 |
| 100 | $20.81 | $2 081,00 |
| 500 | $18.5 | $9 250,00 |
| 1 000 | $16.19 | $16 190,00 |
A3P250-1PQG208I Présentation
A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks and interconnects that can be programmed to implement any digital logic function. The ProASIC3 family uses flash-based configuration cells, which are non-volatile, meaning the device retains its configuration when power is removed. This makes it a secure, instant-on solution that is ideal for applications requiring high reliability and low power consumption.
Key features of the A3P250-1PQG208I include 250,000 system gates, 36,864 bits of RAM, and 151 user I/Os. The device supports up to 350 MHz system performance and is reprogrammable, allowing for design updates in the field. The flash-based architecture provides inherent security against reverse engineering and configuration bitstream interception. The device also features low power consumption, making it suitable for battery-powered and thermally constrained applications.
The ProASIC3 architecture is based on a flash-based switch matrix that connects logic tiles and routing resources. This architecture eliminates the need for external configuration memory, reducing system cost and board space. The device supports various I/O standards, including LVCMOS, LVTTL, and PCI, and includes phase-locked loops (PLLs) for clock management. The flash-based configuration is instant-on, providing immediate functionality upon power-up.
Typical applications for the A3P250-1PQG208I include industrial control systems, communications infrastructure, avionics, and consumer electronics. Its low power and high reliability make it suitable for automotive and medical applications. The device is also used in ASIC prototyping and as a cost-effective alternative to ASICs in low-to-medium volume production.
When designing with this device, consider the power supply requirements and decoupling. The FPGA requires multiple supply voltages, and proper decoupling capacitors should be placed near the power pins to ensure stable operation. The flash-based configuration is non-volatile, so no external configuration device is needed, simplifying the design.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing a comprehensive resource for engineers evaluating the A3P250-1PQG208I.
Alternatives de remplacement direct pour A3P250-1PQG208I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec A3P250-1PQG208I (même facteur de forme et même empreinte) — différant par Package, System Gates, Speed Grade, RoHS Status, Configuration Memory.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
A3P250-1PQG208
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
A3P250-2PQG208I
✅ Remplacement direct✓ En stock
$29.9 / unité
Voir la fiche technique →A3P250L-1PQG208I
✅ Remplacement direct✓ En stock
$44.6 / unité
Voir la fiche technique →A3P600-1PQG208I
✅ Remplacement direct✓ En stock
$68 / unité
Voir la fiche technique →A3P250-1PQG208I Valeurs maximales et caractéristiques électriques
| Family | ProASIC3 |
| System Gates | 250000 |
| Number of Logic Elements (LEs) | 3000 |
| Number of I/O | 151 |
| RAM Bits | 36864 |
| Boîtier | 208-BFQFP (PQFP) |
| Température de fonctionnement | -40°C to +100°C |
| Type de montage | Surface Mount |
| Terminal Form | Gull Wing |
| Number of Terminals | 208 |
| Package Code | FQFP |
| Package Shape | Square |
| Lead-Free | Yes |
| Statut RoHS | Compliant |
| Speed Grade | -1 |
Configuration des broches de A3P250-1PQG208I
| Broche 1 | IO — User I/O |
| Broche 2 | IO — User I/O |
| Broche 3 | IO — User I/O |
| Broche 4 | IO — User I/O |
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| Broche 150 | IO — User I/O |
| Broche 151 | IO — User I/O |
| Broche 152 | VCC — Core power supply (1.5V) |
| Broche 153 | GND — Ground |
| Broche 154 | VCC — Core power supply (1.5V) |
| Broche 155 | GND — Ground |
| Broche 156 | VCC — Core power supply (1.5V) |
| Broche 157 | GND — Ground |
| Broche 158 | VCC — Core power supply (1.5V) |
| Broche 159 | GND — Ground |
| Broche 160 | VCC — Core power supply (1.5V) |
| Broche 161 | GND — Ground |
| Broche 162 | VCC — Core power supply (1.5V) |
| Broche 163 | GND — Ground |
| Broche 164 | VCC — Core power supply (1.5V) |
| Broche 165 | GND — Ground |
| Broche 166 | VCC — Core power supply (1.5V) |
| Broche 167 | GND — Ground |
| Broche 168 | VCC — Core power supply (1.5V) |
| Broche 169 | GND — Ground |
| Broche 170 | VCC — Core power supply (1.5V) |
| Broche 171 | GND — Ground |
| Broche 172 | VCC — Core power supply (1.5V) |
| Broche 173 | GND — Ground |
| Broche 174 | VCC — Core power supply (1.5V) |
| Broche 175 | GND — Ground |
| Broche 176 | VCC — Core power supply (1.5V) |
| Broche 177 | GND — Ground |
| Broche 178 | VCC — Core power supply (1.5V) |
| Broche 179 | GND — Ground |
| Broche 180 | VCC — Core power supply (1.5V) |
| Broche 181 | GND — Ground |
| Broche 182 | VCC — Core power supply (1.5V) |
| Broche 183 | GND — Ground |
| Broche 184 | VCC — Core power supply (1.5V) |
| Broche 185 | GND — Ground |
| Broche 186 | VCC — Core power supply (1.5V) |
| Broche 187 | GND — Ground |
| Broche 188 | VCC — Core power supply (1.5V) |
| Broche 189 | GND — Ground |
| Broche 190 | VCC — Core power supply (1.5V) |
| Broche 191 | GND — Ground |
| Broche 192 | VCC — Core power supply (1.5V) |
| Broche 193 | GND — Ground |
| Broche 194 | VCC — Core power supply (1.5V) |
| Broche 195 | GND — Ground |
| Broche 196 | VCC — Core power supply (1.5V) |
| Broche 197 | GND — Ground |
| Broche 198 | VCC — Core power supply (1.5V) |
| Broche 199 | GND — Ground |
| Broche 200 | VCC — Core power supply (1.5V) |
| Broche 201 | GND — Ground |
| Broche 202 | VCC — Core power supply (1.5V) |
| Broche 203 | GND — Ground |
| Broche 204 | VCC — Core power supply (1.5V) |
| Broche 205 | GND — Ground |
| Broche 206 | VCC — Core power supply (1.5V) |
| Broche 207 | GND — Ground |
| Broche 208 | VCC — Core power supply (1.5V) |
Applications typiques
A3P250-1PQG208I convient pour 6 applications: Industrial Control Systems, Communications Infrastructure, Avionics and Defense, Consumer Electronics, Medical Electronics, ASIC Prototyping.
Industrial Control Systems
The A3P250-1PQG208I is ideal for industrial control systems due to its industrial temperature range (-40°C to +100°C) and high reliability. With 250K gates and 151 I/Os, it can implement motor control logic, PLC interfaces, and sensor processing. The flash-based architecture provides instant-on operation, ensuring immediate functionality on power-up, which is critical for safety-critical industrial applications. Its low power consumption reduces thermal stress in enclosed control cabinets. The device's reprogrammability allows for field updates and design iterations without hardware changes, reducing downtime and maintenance costs. The 208-pin BFQFP package is suitable for through-hole or surface-mount assembly, providing flexibility in manufacturing.
Recommandé
Communications Infrastructure
In communications infrastructure, the A3P250-1PQG208I provides a reliable, low-power solution for protocol bridging, packet processing, and interface conversion. With 151 I/Os, it can interface with multiple communication standards, including UART, SPI, and I2C. The device's 36,864 bits of RAM are sufficient for small packet buffers and FIFOs. The flash-based configuration ensures secure, non-volatile operation, protecting intellectual property. The industrial temperature range makes it suitable for outdoor and remote installations. The 208-pin BFQFP package is compatible with standard PCB assembly processes, and the device's low power consumption is ideal for power-over-Ethernet (PoE) applications. Its reprogrammability allows for protocol updates and feature enhancements in the field.
Recommandé
Avionics and Defense
The A3P250-1PQG208I is well-suited for avionics and defense applications due to its high reliability, security, and wide temperature range. The flash-based FPGA provides inherent resistance to reverse engineering and configuration tampering, which is critical for defense systems. With 250K gates, it can implement custom digital signal processing, sensor interfaces, and control logic. The device's instant-on capability ensures immediate operation in mission-critical scenarios. The industrial temperature range (-40°C to +100°C) meets the requirements for many aerospace environments. The 208-pin BFQFP package is robust and suitable for harsh environments. Microchip's long-term supply commitment ensures availability for defense programs with extended lifecycles.
Recommandé
Consumer Electronics
In consumer electronics, the A3P250-1PQG208I offers a cost-effective, low-power solution for display controllers, audio processing, and smart home interfaces. With 250K gates and 151 I/Os, it can handle video timing generation, audio codec interfaces, and sensor fusion. The flash-based architecture eliminates the need for external configuration memory, reducing BOM cost and board space. The device's low power consumption extends battery life in portable devices. The industrial temperature range ensures reliable operation in various consumer environments. The 208-pin BFQFP package is suitable for high-volume manufacturing. Its reprogrammability allows for firmware updates and feature additions post-launch, enhancing product longevity.
Recommandé
Medical Electronics
The A3P250-1PQG208I is suitable for medical electronics such as patient monitors, diagnostic equipment, and portable medical devices. Its high reliability and industrial temperature range ensure dependable operation in clinical environments. With 250K gates, it can implement signal processing, data acquisition, and control logic. The flash-based configuration provides secure, non-volatile storage of critical algorithms. The device's low power consumption is essential for battery-powered portable medical devices. The 208-pin BFQFP package is compatible with standard medical device manufacturing processes. Microchip's long-term product support is crucial for medical devices with regulatory approvals and long lifecycles.
Recommandé
ASIC Prototyping
The A3P250-1PQG208I is an excellent choice for ASIC prototyping due to its reprogrammability and 250K gates. Engineers can implement their ASIC design in the FPGA to validate functionality and performance before committing to silicon. The device's 151 I/Os allow for connection to test equipment and system interfaces. The flash-based configuration enables quick design iterations without external configuration devices. The industrial temperature range ensures reliable operation in lab environments. The 208-pin BFQFP package is easy to handle and solder, facilitating rapid prototyping. The device's low power consumption reduces thermal management requirements during testing. Microchip's design tools support seamless transition from FPGA to ASIC.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour A3P250-1PQG208I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | A3P250-1PQG208 | A3P250-2PQG208I | A3P250L-1PQG208I | A3P600-1PQG208I |
|---|---|---|---|---|---|
| Package | 208-BFQFP | 208-BFQFP | 208-BFQFP | 208-BFQFP | 208-BFQFP |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 250000 | 250000 | 250000 | 250000 | 600000 |
| Number of I/O | 151 | 151 | 151 | 151 | 151 |
| RAM Bits | 36864 | 36864 | 36864 | 36864 | 110592 |
| Speed Grade | -1 | -1 | -2 | -1 | -1 |
| Temperature Grade | Industrial (-40°C to +100°C) | Commercial (0°C to +70°C) | Industrial (-40°C to +100°C) | Industrial (-40°C to +100°C) | Industrial (-40°C to +100°C) |
| Low Power | No | No | No | Yes | No |
Principaux différenciateurs
- Industrial temperature grade (vs A3P250-1PQG208)
- Standard speed grade with industrial temp (vs A3P250-2PQG208I)
- Standard power vs low-power variant (vs A3P250L-1PQG208I)
Notes de conception
The A3P250-1PQG208I requires a 1.5V core supply and separate I/O supplies (3.3V, 2.5V, or 1.8V). Use low-ESR ceramic capacitors (0.1uF and 10uF) placed close to each VCC and GND pin pair. The flash-based FPGA has low static power, but dynamic power scales with switching activity. Estimate power using Microchip's power calculator tool. Ensure the power supply can handle peak inrush current during configuration.
For the 208-pin BFQFP package, use a standard PCB footprint with 0.5mm pitch. Ensure adequate copper pour for the exposed pad (if present) to aid thermal dissipation. Route high-speed I/O signals with controlled impedance (e.g., 50 ohms) and minimize trace lengths. Place decoupling capacitors as close to the power pins as possible. Follow the layout guidelines in the ProASIC3 datasheet for optimal signal integrity.
A common pitfall is neglecting the I/O bank voltage requirements. Each I/O bank must be connected to the appropriate VCCIO voltage for the I/O standard used. Also, ensure the JTAG pins are properly terminated for programming. Do not leave unused I/O pins floating; configure them as inputs with pull-ups or drive them to a defined state. Verify the configuration clock (CCLK) frequency and programming voltage to avoid configuration failures.
Informations de conformité
Lead-free and RoHS compliant per distributor data. AEC-Q100 not applicable for this FPGA. REACH and conflict minerals status not specified in the provided data.