A3P250-1PQG208I - ProASIC3 FPGA, 250K Gates | Microchip
부품 번호: A3P250-1PQG208I ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $25.43 | $25.43 |
| 10 | $23.12 | $231.20 |
| 100 | $20.81 | $2,081.00 |
| 500 | $18.5 | $9,250.00 |
| 1,000 | $16.19 | $16,190.00 |
A3P250-1PQG208I 개요
A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks and interconnects that can be programmed to implement any digital logic function. The ProASIC3 family uses flash-based configuration cells, which are non-volatile, meaning the device retains its configuration when power is removed. This makes it a secure, instant-on solution that is ideal for applications requiring high reliability and low power consumption.
Key features of the A3P250-1PQG208I include 250,000 system gates, 36,864 bits of RAM, and 151 user I/Os. The device supports up to 350 MHz system performance and is reprogrammable, allowing for design updates in the field. The flash-based architecture provides inherent security against reverse engineering and configuration bitstream interception. The device also features low power consumption, making it suitable for battery-powered and thermally constrained applications.
The ProASIC3 architecture is based on a flash-based switch matrix that connects logic tiles and routing resources. This architecture eliminates the need for external configuration memory, reducing system cost and board space. The device supports various I/O standards, including LVCMOS, LVTTL, and PCI, and includes phase-locked loops (PLLs) for clock management. The flash-based configuration is instant-on, providing immediate functionality upon power-up.
Typical applications for the A3P250-1PQG208I include industrial control systems, communications infrastructure, avionics, and consumer electronics. Its low power and high reliability make it suitable for automotive and medical applications. The device is also used in ASIC prototyping and as a cost-effective alternative to ASICs in low-to-medium volume production.
When designing with this device, consider the power supply requirements and decoupling. The FPGA requires multiple supply voltages, and proper decoupling capacitors should be placed near the power pins to ensure stable operation. The flash-based configuration is non-volatile, so no external configuration device is needed, simplifying the design.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing a comprehensive resource for engineers evaluating the A3P250-1PQG208I.
드롭인 대체품: A3P250-1PQG208I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3P250-1PQG208I (동일 폼 팩터 및 풋프린트) — 차이점: Package, System Gates, Speed Grade, RoHS Status, Configuration Memory.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3P250-1PQG208
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
A3P250-2PQG208I
✅ 드롭인✓ 재고 있음
$29.9 / 개
데이터시트 보기 →A3P250L-1PQG208I
✅ 드롭인✓ 재고 있음
$44.6 / 개
데이터시트 보기 →A3P600-1PQG208I
✅ 드롭인✓ 재고 있음
$68 / 개
데이터시트 보기 →A3P250-1PQG208I 최대 정격 & 전기적 특성
| Family | ProASIC3 |
| System Gates | 250000 |
| Number of Logic Elements (LEs) | 3000 |
| Number of I/O | 151 |
| RAM Bits | 36864 |
| 패키지 | 208-BFQFP (PQFP) |
| 동작 온도 | -40°C to +100°C |
| 실장 유형 | Surface Mount |
| Terminal Form | Gull Wing |
| Number of Terminals | 208 |
| Package Code | FQFP |
| Package Shape | Square |
| Lead-Free | Yes |
| RoHS 상태 | Compliant |
| Speed Grade | -1 |
A3P250-1PQG208I 핀 구성
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| 핀 152 | VCC — Core power supply (1.5V) |
| 핀 153 | GND — Ground |
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| 핀 170 | VCC — Core power supply (1.5V) |
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| 핀 172 | VCC — Core power supply (1.5V) |
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| 핀 206 | VCC — Core power supply (1.5V) |
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| 핀 208 | VCC — Core power supply (1.5V) |
일반적인 애플리케이션
A3P250-1PQG208I 적합 용도: 6 애플리케이션s: Industrial Control Systems, Communications Infrastructure, Avionics and Defense, Consumer Electronics, Medical Electronics, ASIC Prototyping.
Industrial Control Systems
The A3P250-1PQG208I is ideal for industrial control systems due to its industrial temperature range (-40°C to +100°C) and high reliability. With 250K gates and 151 I/Os, it can implement motor control logic, PLC interfaces, and sensor processing. The flash-based architecture provides instant-on operation, ensuring immediate functionality on power-up, which is critical for safety-critical industrial applications. Its low power consumption reduces thermal stress in enclosed control cabinets. The device's reprogrammability allows for field updates and design iterations without hardware changes, reducing downtime and maintenance costs. The 208-pin BFQFP package is suitable for through-hole or surface-mount assembly, providing flexibility in manufacturing.
추천
Communications Infrastructure
In communications infrastructure, the A3P250-1PQG208I provides a reliable, low-power solution for protocol bridging, packet processing, and interface conversion. With 151 I/Os, it can interface with multiple communication standards, including UART, SPI, and I2C. The device's 36,864 bits of RAM are sufficient for small packet buffers and FIFOs. The flash-based configuration ensures secure, non-volatile operation, protecting intellectual property. The industrial temperature range makes it suitable for outdoor and remote installations. The 208-pin BFQFP package is compatible with standard PCB assembly processes, and the device's low power consumption is ideal for power-over-Ethernet (PoE) applications. Its reprogrammability allows for protocol updates and feature enhancements in the field.
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Avionics and Defense
The A3P250-1PQG208I is well-suited for avionics and defense applications due to its high reliability, security, and wide temperature range. The flash-based FPGA provides inherent resistance to reverse engineering and configuration tampering, which is critical for defense systems. With 250K gates, it can implement custom digital signal processing, sensor interfaces, and control logic. The device's instant-on capability ensures immediate operation in mission-critical scenarios. The industrial temperature range (-40°C to +100°C) meets the requirements for many aerospace environments. The 208-pin BFQFP package is robust and suitable for harsh environments. Microchip's long-term supply commitment ensures availability for defense programs with extended lifecycles.
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Consumer Electronics
In consumer electronics, the A3P250-1PQG208I offers a cost-effective, low-power solution for display controllers, audio processing, and smart home interfaces. With 250K gates and 151 I/Os, it can handle video timing generation, audio codec interfaces, and sensor fusion. The flash-based architecture eliminates the need for external configuration memory, reducing BOM cost and board space. The device's low power consumption extends battery life in portable devices. The industrial temperature range ensures reliable operation in various consumer environments. The 208-pin BFQFP package is suitable for high-volume manufacturing. Its reprogrammability allows for firmware updates and feature additions post-launch, enhancing product longevity.
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Medical Electronics
The A3P250-1PQG208I is suitable for medical electronics such as patient monitors, diagnostic equipment, and portable medical devices. Its high reliability and industrial temperature range ensure dependable operation in clinical environments. With 250K gates, it can implement signal processing, data acquisition, and control logic. The flash-based configuration provides secure, non-volatile storage of critical algorithms. The device's low power consumption is essential for battery-powered portable medical devices. The 208-pin BFQFP package is compatible with standard medical device manufacturing processes. Microchip's long-term product support is crucial for medical devices with regulatory approvals and long lifecycles.
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ASIC Prototyping
The A3P250-1PQG208I is an excellent choice for ASIC prototyping due to its reprogrammability and 250K gates. Engineers can implement their ASIC design in the FPGA to validate functionality and performance before committing to silicon. The device's 151 I/Os allow for connection to test equipment and system interfaces. The flash-based configuration enables quick design iterations without external configuration devices. The industrial temperature range ensures reliable operation in lab environments. The 208-pin BFQFP package is easy to handle and solder, facilitating rapid prototyping. The device's low power consumption reduces thermal management requirements during testing. Microchip's design tools support seamless transition from FPGA to ASIC.
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추천 제품 요약
엔지니어링 참조 데이터: A3P250-1PQG208I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3P250-1PQG208 | A3P250-2PQG208I | A3P250L-1PQG208I | A3P600-1PQG208I |
|---|---|---|---|---|---|
| Package | 208-BFQFP | 208-BFQFP | 208-BFQFP | 208-BFQFP | 208-BFQFP |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 250000 | 250000 | 250000 | 250000 | 600000 |
| Number of I/O | 151 | 151 | 151 | 151 | 151 |
| RAM Bits | 36864 | 36864 | 36864 | 36864 | 110592 |
| Speed Grade | -1 | -1 | -2 | -1 | -1 |
| Temperature Grade | Industrial (-40°C to +100°C) | Commercial (0°C to +70°C) | Industrial (-40°C to +100°C) | Industrial (-40°C to +100°C) | Industrial (-40°C to +100°C) |
| Low Power | No | No | No | Yes | No |
주요 차별점
- Industrial temperature grade (vs A3P250-1PQG208)
- Standard speed grade with industrial temp (vs A3P250-2PQG208I)
- Standard power vs low-power variant (vs A3P250L-1PQG208I)
설계 노트
The A3P250-1PQG208I requires a 1.5V core supply and separate I/O supplies (3.3V, 2.5V, or 1.8V). Use low-ESR ceramic capacitors (0.1uF and 10uF) placed close to each VCC and GND pin pair. The flash-based FPGA has low static power, but dynamic power scales with switching activity. Estimate power using Microchip's power calculator tool. Ensure the power supply can handle peak inrush current during configuration.
For the 208-pin BFQFP package, use a standard PCB footprint with 0.5mm pitch. Ensure adequate copper pour for the exposed pad (if present) to aid thermal dissipation. Route high-speed I/O signals with controlled impedance (e.g., 50 ohms) and minimize trace lengths. Place decoupling capacitors as close to the power pins as possible. Follow the layout guidelines in the ProASIC3 datasheet for optimal signal integrity.
A common pitfall is neglecting the I/O bank voltage requirements. Each I/O bank must be connected to the appropriate VCCIO voltage for the I/O standard used. Also, ensure the JTAG pins are properly terminated for programming. Do not leave unused I/O pins floating; configure them as inputs with pull-ups or drive them to a defined state. Verify the configuration clock (CCLK) frequency and programming voltage to avoid configuration failures.
규정 준수 정보
Lead-free and RoHS compliant per distributor data. AEC-Q100 not applicable for this FPGA. REACH and conflict minerals status not specified in the provided data.