A3P250L-1PQG208I - ProASIC3L FPGA 250K Gates | Microsemi
Référence : A3P250L-1PQG208I ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $68.5 | $68,50 |
| 10 | $62.1 | $621,00 |
| 100 | $55.8 | $5 580,00 |
| 500 | $49.9 | $24 950,00 |
| 1 000 | $44.6 | $44 600,00 |
A3P250L-1PQG208I Présentation
A Field Programmable Gate Array (FPGA) is a semiconductor device containing a fabric of programmable logic blocks and interconnects that designers configure in the field, sitting in the programmable-logic hierarchy between CPLDs and high-density SoC FPGAs. The ProASIC3L subfamily distinguishes itself by using nonvolatile flash-based configuration storage, eliminating the external configuration PROM required by SRAM FPGAs and dramatically reducing boot time and system bill-of-materials cost.
Key features of the A3P250L include 1.2V core operation for low static power, single-chip flash-based configuration with inherent SECDED-protected design security, 130nm process technology, support for up to 892.86 MHz internal performance figures reported by distributor parametric data, and industrial temperature grading denoted by the -I suffix. The flash fabric retains configuration through power cycles and is resistant to single-event upsets compared to SRAM-based alternatives, which is valuable in harsh environments.
Architecturally, the device combines Versatile logic tiles, embedded SRAM blocks totaling 36 Kbits, and flexible I/O banks supporting multiple single-ended and differential standards. Microsemi Libero SoC design software supports synthesis, place-and-route, and simulation for the ProASIC3L family.
Typical applications include industrial control and automation, aerospace and defense subsystems, medical instrumentation, communications bridging, and secure embedded controllers where instant-on operation and low power are required.
Design consideration: because the core runs at 1.2V and I/O banks are separately powered, careful power-plane planning and decoupling are essential; also verify I/O bank voltage assignments early in Libero to avoid pin conflicts.
This page synthesizes distributor inventory data, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour A3P250L-1PQG208I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec A3P250L-1PQG208I (même facteur de forme et même empreinte) — différant par Package, System Gates, Operating Temperature, Speed Grade, Configuration Memory.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
A3P600L-1PQG208I
✅ Remplacement direct✓ En stock
$29 / unité
Voir la fiche technique →A3P1000L-1PQG208I
✅ Remplacement direct✓ En stock
$28.9 / unité
Voir la fiche technique →A3P600-2PQG208I
✅ Remplacement direct✓ En stock
$71.3 / unité
Voir la fiche technique →A3P600-1PQG208
✅ Remplacement direct✓ En stock
$49.94 / unité
Voir la fiche technique →A3P1000-2PQG208
✅ Remplacement direct✓ En stock
$65.67 / unité
Voir la fiche technique →A3P250-PQG208I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
A3P250L-1PQG208I Valeurs maximales et caractéristiques électriques
| Family | ProASIC3L |
| System Gates | 250,000 |
| Embedded RAM | 36,864 bits |
| User I/O | 151 |
| Core Voltage | 1.2 V |
| Process Technology | 130 nm |
| Boîtier | 208-PQFP (28x28 mm) |
| Température de fonctionnement | -40C to +100C (TJ) |
| Configuration Type | Flash-based, nonvolatile |
| Speed Grade | 1 |
| Type de montage | Surface Mount |
| Packaging | Tray |
| Statut RoHS | Compliant (G suffix, lead-free) |
| Temperature Grade | Industrial (-I suffix) |
| Design Software | Microsemi Libero SoC |
Guide de configuration des broches du A3P250L-1PQG208I 208-pqfp (28x28 mm)
Configuration des broches du A3P250L-1PQG208I (boîtier 208-pqfp (28x28 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour A3P250L-1PQG208I.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
A3P250L-1PQG208I convient pour 6 applications: Industrial Control and Automation, Aerospace and Defense Subsystems, Medical Instrumentation, Communications Bridging and Line-Card Logic, Secure Embedded Controllers, Battery-Powered Portable Instruments.
Industrial Control and Automation
The A3P250L-1PQG208I fits industrial control and automation subsystems because its flash fabric powers up instantly with pre-loaded logic, its industrial -40C to +100C temperature grade survives factory-floor conditions, and the 1.2V core minimizes wasted power in always-on panels. With 151 configurable I/Os in the 208-PQFP, it glues together PLC backplanes, parallel sensor buses, encoder interfaces, and actuator drivers. Unlike SRAM FPGAs, it needs no external configuration device, improving mean time between failures in vibration-prone cabinets. Place 100nF ceramic decoupling at each power pin pair; the design is captured in Microsemi Libero SoC using the ProASIC3L macro library for counters, state machines, and bus bridges.
Recommandé
Aerospace and Defense Subsystems
The A3P250L-1PQG208I is well suited to aerospace and defense boards because Microsemi's flash-based ProASIC3L fabric is inherently more resistant to configuration single-event upsets than SRAM-based FPGAs, a decisive factor in radiation-exposed environments. The nonvolatile cells remove boot PROMs that are themselves SEU-sensitive, and the 250K-gate density handles telemetry formatting, redundant-sensor voting, and interface bridging without a processor. The industrial temperature rating covers extended mission profiles, and design security features protect firmware from readout. Designers implement triple-module redundancy on critical registers in Libero SoC; the 151 user I/Os support RS-422/423-style differential signaling through external line transceivers for avionics buses.
Recommandé
Medical Instrumentation
Medical diagnostic equipment benefits from the A3P250L-1PQG208I's deterministic instant-on behavior: flash configuration means acquisition front-ends are ready before a patient interaction completes, with no boot sequence. The 1.2V core reduces heat inside enclosed benchtop housings, and 151 I/Os connect ADCs, amplifiers, display drivers, and control panels in a single programmable device. Quiet, low-static-power operation simplifies thermal design in patient-contact equipment where fan noise is unacceptable. Typical implementations use the FPGA for timing generation, digital filtering, and protocol conversion between USB/Ethernet modules and analog front ends; design security features help protect proprietary measurement algorithms embodied in the configuration bitstream.
Recommandé
Communications Bridging and Line-Card Logic
In communications equipment, the A3P250L-1PQG208I serves as protocol-bridging logic between backplane interfaces, line cards, and system controllers. The distributor-listed 892.86 MHz family performance figure reflects internal toggle capability of the 130nm fabric, sufficient for counters and serial shifts in the hundreds of megahertz range, while the 36,864-bit embedded RAM buffers packet fragments. Flash configuration lets line cards return to service instantly after hot-swap power events without a host reprogramming cycle. The 208-PQFP provides enough I/O for parallel PHY interfaces; keep bank voltages consistent with the connected PHY standards and use Libero to verify I/O timing against the AC tables in the ProASIC3L datasheet.
Recommandé
Secure Embedded Controllers
Designs that must protect intellectual property choose the A3P250L-1PQG208I because Microsemi's flash FPGA cells store configuration nonvoluntarily and are substantially harder to probe than SRAM bitstreams read from external PROMs. There is no external configuration flash to dump, closing the most common attack vector. A 250K-gate fabric implements custom encryption wrappers, authentication state machines, and anti-tamper sequencing alongside control logic. The instant-on property also eliminates the reconfiguration window during which SRAM systems are vulnerable. Combine with a secure MCU over SPI/JTAG-disabled operation; lock JTAG ports in production using Libero security settings documented in the ProASIC3L handbook.
Recommandé
Battery-Powered Portable Instruments
Portable and battery-powered instruments exploit the L (low-power) grade of the A3P250L-1PQG208I: its 1.2V core draws low static current, extending sleep-state battery life in handheld testers and field measurement gear. Flash configuration removes the boot energy and latency of SRAM FPGAs, so the instrument is measurement-ready the moment it is switched on. The 151 I/Os interface displays, keypads, sensor bridges, and radios without a companion CPLD. Designers gate unused banks and use Libero power-analysis to confirm the static budget; estimate total power with the Microsemi power calculator using your actual toggle rates before finalizing the battery specification.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour A3P250L-1PQG208I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | A3P600L-1PQG208I | A3P1000L-1PQG208I | A3P600-2PQG208I | A3P250-PQG208I |
|---|---|---|---|---|---|
| Package | 208-PQFP (28x28 mm) | 208-PQFP (28x28 mm) - same | 208-PQFP (28x28 mm) - same | 208-PQFP (28x28 mm) - same | 208-PQFP (28x28 mm) - same |
| Brand | Microsemi (Microchip Technology) | Microsemi (Microchip Technology) | Microsemi (Microchip Technology) | Microsemi (Microchip Technology) | Microsemi (Microchip Technology) |
| System Gates | 250,000 | 600,000 | 1,000,000 | 600,000 | 250,000 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.5 V (standard core) | 1.5 V (standard core) |
| Low-Power L Grade | Yes | Yes | Yes | No | No |
| Configuration Type | Flash-based, nonvolatile | Flash-based, nonvolatile | Flash-based, nonvolatile | Flash-based, nonvolatile | Flash-based, nonvolatile |
Principaux différenciateurs
- Lowest static power in the PQFP-208 ProASIC3 lineup (vs A3P250-PQG208I)
- Instant-on single-chip configuration (vs SRAM FPGAs (Xilinx/Altera equivalents))
- Same-footprint capacity upgrades available (vs A3P600L-1PQG208I)
Notes de conception
The ProASIC3L core runs at 1.2V while I/O banks are powered separately (typically 3.3V or 2.5V). Sequence VMODE/bank supplies per the datasheet power-up requirements and place 100nF ceramic decoupling capacitors within 2 mm of each supply pin pair, plus bulk 10uF per rail. Estimated: static power scales with the L-grade advantage - if your design tolerates the higher static current, standard A3P250-PQG208I parts are more available, but never exceed absolute maximum core ratings when substituting.
The 208-PQFP (28x28 mm) has 0.5 mm-pitch leads requiring careful footprint design: use the IPC-recommended land pattern from the Microchip/Microsemi package drawing and inspect solder joints with X-ray or angled microscopy for bridging on the fine pitch. Provide thermal relief through ground planes - PQFP packages dissipate through leads, so tie all GND pins to a solid plane. Keep the 208-pin fanout symmetric to ease routing of the 151 user I/Os.
In Libero SoC, assign I/O bank voltages before finalizing schematic pinouts - mixing 3.3V and 2.5V standards on one bank causes drive-strength violations. Also lock the JTAG pins for programming access even in production; teams that repurpose TDI/TDO for user logic lose field-update capability. When substituting the larger A3P600L/A3P1000L drop-in upgrades, re-run timing closure: routing delays differ across densities even in the same speed grade.
Informations de conformité
G suffix in A3P250L-1PQG208I denotes lead-free/RoHS-compliant packaging. REACH, halogen-free, and conflict-minerals declarations not present in provided data - request from supplier.