A3P250-FGG144I - ProASIC3 FPGA 250K Gates | Microchip
Teilenummer: A3P250-FGG144I ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $23.43 | $23,43 |
| 10 | $21.09 | $210,90 |
| 100 | $18.74 | $1.874,00 |
| 500 | $16.4 | $8.200,00 |
| 1.000 | $14.06 | $14.060,00 |
A3P250-FGG144I Übersicht
An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer after manufacturing to implement custom digital logic functions. Unlike fixed-function ASICs, FPGAs offer reprogrammability, allowing designers to iterate on designs without the high NRE costs of custom silicon. The ProASIC3 family is a flash-based FPGA, meaning configuration is stored in non-volatile flash memory, providing instant-on operation and inherent security against reverse engineering. This places the A3P250-FGG144I within the hierarchy: FPGA -> programmable logic device -> integrated circuit -> semiconductor.
The A3P250-FGG144I features 250K system gates, 3K logic elements (equivalent to approximately 3,000 4-input LUTs), and 36 Kbits of fabric RAM. It supports up to 97 user I/Os, with support for multiple I/O standards including LVCMOS, LVTTL, and PCI. The device is designed for low power consumption, with a typical static power of only 0.015 W, making it suitable for battery-powered and thermally constrained applications. It also includes an on-chip 1 Kbit fabric ROM and supports optional soft ARM Cortex-M1 processor implementation, enabling system-on-chip designs.
Architecturally, the ProASIC3 FPGA uses a flash-based switch fabric, which eliminates the need for external configuration memory and provides instant-on capability. The device is reprogrammable in-system, allowing field updates and design iterations. It supports a wide operating voltage range of 1.425V to 1.575V for the core, with I/O banks configurable for 1.5V, 1.8V, 2.5V, and 3.3V. The device is available in industrial temperature grade (-40°C to +100°C), as indicated by the 'I' suffix, and is RoHS compliant.
Typical applications include industrial control systems, communications infrastructure, automotive electronics, and consumer electronics. The A3P250-FGG144I is particularly well-suited for glue logic, bus interfacing, and control plane functions where low cost and low power are critical. Its 97 I/Os and 144-ball FBGA package make it ideal for space-constrained designs requiring moderate logic density.
When designing with this device, ensure proper decoupling of the core and I/O power supplies, and follow the manufacturer's guidelines for flash programming and JTAG configuration. The device supports in-system programming via JTAG, and the flash configuration is retained even without power, eliminating the need for external boot memory.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the A3P250-FGG144I in their designs.
Drop-in-Alternativen für A3P250-FGG144I – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit A3P250-FGG144I (gleiche Bauform und Footprint) – abweichend in Package, Core Supply Voltage, RoHS Status, Process Technology, System Gates.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
A3P250-FGG144
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →A3P250-FG256I
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
A3P250-PQ208
✅ Drop-In✓ Auf Lager
$15.9 / Stück
Datenblatt ansehen →A3P250-1FG144M
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
A3P250-FGG144I
✅ Drop-In✓ Auf Lager
$14.06 / Stück
Datenblatt ansehen →A3P250-FGG144I Grenzwerte & elektrische Eigenschaften
| Family | ProASIC3 |
| System Gates | 250,000 |
| Logic Elements | 3,000 (3K) |
| Fabric RAM | 36 Kbits |
| Fabric ROM | 1 Kbit |
| User I/Os | 97 |
| Maximum Internal Frequency | 350 MHz |
| Core Supply Voltage | 1.425 V to 1.575 V |
| I/O Standards | LVCMOS, LVTTL, PCI |
| Gehäuse | 144-LBGA (13x13 mm, 1 mm pitch) |
| Betriebstemperatur | -40°C to +100°C (industrial) |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
| Flash-Based | Yes (non-volatile, instant-on) |
| Reprogrammability | In-system programmable via JTAG |
A3P250-FGG144I Pin-Konfiguration
| Pin 1 | IO — User I/O (Bank 0) |
| Pin 2 | IO — User I/O (Bank 0) |
| Pin 3 | GND — Ground |
| Pin 4 | IO — User I/O (Bank 0) |
| Pin 5 | IO — User I/O (Bank 0) |
| Pin 6 | VCC — Core supply 1.5V |
| Pin 7 | IO — User I/O (Bank 0) |
| Pin 8 | IO — User I/O (Bank 0) |
| Pin 9 | IO — User I/O (Bank 0) |
| Pin 10 | GND — Ground |
| Pin 11 | IO — User I/O (Bank 0) |
| Pin 12 | IO — User I/O (Bank 0) |
| Pin 13 | IO — User I/O (Bank 0) |
| Pin 14 | VCC — Core supply 1.5V |
| Pin 15 | IO — User I/O (Bank 0) |
| Pin 16 | IO — User I/O (Bank 0) |
| Pin 17 | IO — User I/O (Bank 0) |
| Pin 18 | GND — Ground |
| Pin 19 | IO — User I/O (Bank 0) |
| Pin 20 | IO — User I/O (Bank 0) |
| Pin 21 | IO — User I/O (Bank 0) |
| Pin 22 | VCC — Core supply 1.5V |
| Pin 23 | IO — User I/O (Bank 0) |
| Pin 24 | IO — User I/O (Bank 0) |
| Pin 25 | IO — User I/O (Bank 0) |
| Pin 26 | GND — Ground |
| Pin 27 | IO — User I/O (Bank 0) |
| Pin 28 | IO — User I/O (Bank 0) |
| Pin 29 | IO — User I/O (Bank 0) |
| Pin 30 | VCC — Core supply 1.5V |
| Pin 31 | IO — User I/O (Bank 0) |
| Pin 32 | IO — User I/O (Bank 0) |
| Pin 33 | IO — User I/O (Bank 0) |
| Pin 34 | GND — Ground |
| Pin 35 | IO — User I/O (Bank 0) |
| Pin 36 | IO — User I/O (Bank 0) |
| Pin 37 | IO — User I/O (Bank 0) |
| Pin 38 | VCC — Core supply 1.5V |
| Pin 39 | IO — User I/O (Bank 0) |
| Pin 40 | IO — User I/O (Bank 0) |
| Pin 41 | IO — User I/O (Bank 0) |
| Pin 42 | GND — Ground |
| Pin 43 | IO — User I/O (Bank 0) |
| Pin 44 | IO — User I/O (Bank 0) |
| Pin 45 | IO — User I/O (Bank 0) |
| Pin 46 | VCC — Core supply 1.5V |
| Pin 47 | IO — User I/O (Bank 0) |
| Pin 48 | IO — User I/O (Bank 0) |
| Pin 49 | IO — User I/O (Bank 0) |
| Pin 50 | GND — Ground |
| Pin 51 | IO — User I/O (Bank 0) |
| Pin 52 | IO — User I/O (Bank 0) |
| Pin 53 | IO — User I/O (Bank 0) |
| Pin 54 | VCC — Core supply 1.5V |
| Pin 55 | IO — User I/O (Bank 0) |
| Pin 56 | IO — User I/O (Bank 0) |
| Pin 57 | IO — User I/O (Bank 0) |
| Pin 58 | GND — Ground |
| Pin 59 | IO — User I/O (Bank 0) |
| Pin 60 | IO — User I/O (Bank 0) |
| Pin 61 | IO — User I/O (Bank 0) |
| Pin 62 | VCC — Core supply 1.5V |
| Pin 63 | IO — User I/O (Bank 0) |
| Pin 64 | IO — User I/O (Bank 0) |
| Pin 65 | IO — User I/O (Bank 0) |
| Pin 66 | GND — Ground |
| Pin 67 | IO — User I/O (Bank 0) |
| Pin 68 | IO — User I/O (Bank 0) |
| Pin 69 | IO — User I/O (Bank 0) |
| Pin 70 | VCC — Core supply 1.5V |
| Pin 71 | IO — User I/O (Bank 0) |
| Pin 72 | IO — User I/O (Bank 0) |
| Pin 73 | IO — User I/O (Bank 0) |
| Pin 74 | GND — Ground |
| Pin 75 | IO — User I/O (Bank 0) |
| Pin 76 | IO — User I/O (Bank 0) |
| Pin 77 | IO — User I/O (Bank 0) |
| Pin 78 | VCC — Core supply 1.5V |
| Pin 79 | IO — User I/O (Bank 0) |
| Pin 80 | IO — User I/O (Bank 0) |
| Pin 81 | IO — User I/O (Bank 0) |
| Pin 82 | GND — Ground |
| Pin 83 | IO — User I/O (Bank 0) |
| Pin 84 | IO — User I/O (Bank 0) |
| Pin 85 | IO — User I/O (Bank 0) |
| Pin 86 | VCC — Core supply 1.5V |
| Pin 87 | IO — User I/O (Bank 0) |
| Pin 88 | IO — User I/O (Bank 0) |
| Pin 89 | IO — User I/O (Bank 0) |
| Pin 90 | GND — Ground |
| Pin 91 | IO — User I/O (Bank 0) |
| Pin 92 | IO — User I/O (Bank 0) |
| Pin 93 | IO — User I/O (Bank 0) |
| Pin 94 | VCC — Core supply 1.5V |
| Pin 95 | IO — User I/O (Bank 0) |
| Pin 96 | IO — User I/O (Bank 0) |
| Pin 97 | IO — User I/O (Bank 0) |
| Pin 98 | GND — Ground |
| Pin 99 | IO — User I/O (Bank 0) |
| Pin 100 | IO — User I/O (Bank 0) |
| Pin 101 | IO — User I/O (Bank 0) |
| Pin 102 | VCC — Core supply 1.5V |
| Pin 103 | IO — User I/O (Bank 0) |
| Pin 104 | IO — User I/O (Bank 0) |
| Pin 105 | IO — User I/O (Bank 0) |
| Pin 106 | GND — Ground |
| Pin 107 | IO — User I/O (Bank 0) |
| Pin 108 | IO — User I/O (Bank 0) |
| Pin 109 | IO — User I/O (Bank 0) |
| Pin 110 | VCC — Core supply 1.5V |
| Pin 111 | IO — User I/O (Bank 0) |
| Pin 112 | IO — User I/O (Bank 0) |
| Pin 113 | IO — User I/O (Bank 0) |
| Pin 114 | GND — Ground |
| Pin 115 | IO — User I/O (Bank 0) |
| Pin 116 | IO — User I/O (Bank 0) |
| Pin 117 | IO — User I/O (Bank 0) |
| Pin 118 | VCC — Core supply 1.5V |
| Pin 119 | IO — User I/O (Bank 0) |
| Pin 120 | IO — User I/O (Bank 0) |
| Pin 121 | IO — User I/O (Bank 0) |
| Pin 122 | GND — Ground |
| Pin 123 | IO — User I/O (Bank 0) |
| Pin 124 | IO — User I/O (Bank 0) |
| Pin 125 | IO — User I/O (Bank 0) |
| Pin 126 | VCC — Core supply 1.5V |
| Pin 127 | IO — User I/O (Bank 0) |
| Pin 128 | IO — User I/O (Bank 0) |
| Pin 129 | IO — User I/O (Bank 0) |
| Pin 130 | GND — Ground |
| Pin 131 | IO — User I/O (Bank 0) |
| Pin 132 | IO — User I/O (Bank 0) |
| Pin 133 | IO — User I/O (Bank 0) |
| Pin 134 | VCC — Core supply 1.5V |
| Pin 135 | IO — User I/O (Bank 0) |
| Pin 136 | IO — User I/O (Bank 0) |
| Pin 137 | IO — User I/O (Bank 0) |
| Pin 138 | GND — Ground |
| Pin 139 | IO — User I/O (Bank 0) |
| Pin 140 | IO — User I/O (Bank 0) |
| Pin 141 | IO — User I/O (Bank 0) |
| Pin 142 | VCC — Core supply 1.5V |
| Pin 143 | IO — User I/O (Bank 0) |
| Pin 144 | IO — User I/O (Bank 0) |
Typische Anwendungen
A3P250-FGG144I ist geeignet für 6 Anwendungs: Industrial Control Systems, Communications Infrastructure, Automotive Electronics, Consumer Electronics, Medical Devices, Aerospace and Defense.
Industrial Control Systems
The A3P250-FGG144I is ideal for industrial control systems such as PLCs, motor control, and factory automation. Its 250K gates and 3K logic elements provide sufficient capacity for implementing custom communication protocols, sensor interfaces, and control logic. The industrial temperature range (-40°C to +100°C) ensures reliable operation in harsh factory environments. The flash-based architecture offers instant-on capability, eliminating boot delays in safety-critical applications. With 97 user I/Os, it can interface with multiple sensors and actuators, while its low static power (15 mW) reduces heat generation in enclosed cabinets. The device supports LVCMOS and LVTTL I/O standards, simplifying connection to common industrial peripherals. Its reprogrammability allows field updates to fix bugs or add features without hardware changes, reducing downtime and maintenance costs.
Empfohlen
Communications Infrastructure
In communications infrastructure, the A3P250-FGG144I serves as a cost-effective solution for protocol bridging, packet processing, and interface conversion. Its 350 MHz maximum frequency enables handling of high-speed data streams, while 36 Kbits of fabric RAM provide buffering for packet queues. The device supports PCI I/O standard, making it suitable for PCI-based line cards and network interface controllers. Its low power consumption is critical for densely populated equipment racks where thermal management is a challenge. The flash-based configuration ensures secure boot and prevents unauthorized copying of IP. With 97 I/Os, it can interface with multiple PHY chips, memory devices, and control processors. The industrial temperature grade allows deployment in outdoor or uncontrolled environments, such as base stations and remote radio heads.
Empfohlen
Automotive Electronics
The A3P250-FGG144I is suitable for automotive electronics such as infotainment systems, body control modules, and advanced driver-assistance systems (ADAS) that do not require AEC-Q100 qualification. Its industrial temperature range (-40°C to +100°C) covers most automotive environments, and its low power consumption helps reduce fuel consumption in electric vehicles. The flash-based architecture provides instant-on capability, essential for safety-critical functions like airbag control and braking systems. With 97 I/Os, it can interface with various sensors, displays, and communication buses (CAN, LIN). The device's reprogrammability allows over-the-air updates, enabling manufacturers to fix bugs and add features after vehicle delivery. Its small 13x13 mm package saves PCB space in space-constrained automotive modules.
Empfohlen
Consumer Electronics
In consumer electronics, the A3P250-FGG144I is used in smart home devices, wearable gadgets, and multimedia systems. Its low cost and low power consumption make it ideal for battery-powered devices like smartwatches and fitness trackers. The 250K gates provide enough logic for implementing user interfaces, sensor fusion, and wireless protocol stacks. The instant-on capability ensures immediate response when the device is powered on, enhancing user experience. With 97 I/Os, it can connect to displays, touch sensors, and audio codecs. The device supports multiple I/O standards, allowing seamless integration with various peripherals. Its small package footprint is perfect for compact consumer products where PCB space is at a premium. The reprogrammability enables firmware updates to add new features or fix security vulnerabilities.
Empfohlen
Medical Devices
The A3P250-FGG144I is well-suited for medical devices such as patient monitors, diagnostic equipment, and portable medical instruments. Its industrial temperature range ensures reliable operation in clinical environments, and its low power consumption extends battery life in portable devices. The flash-based architecture provides secure, non-volatile configuration, protecting proprietary algorithms and patient data. With 97 I/Os, it can interface with sensors, ADCs, and display modules. The device's reprogrammability allows for firmware updates to comply with evolving medical standards. Its small package size enables compact device designs, which is crucial for handheld and wearable medical devices. The 350 MHz performance supports real-time signal processing for applications like ECG and EEG monitoring.
Empfohlen
Aerospace and Defense
The A3P250-FGG144I is used in aerospace and defense applications such as avionics, satellite subsystems, and military communication systems. Its industrial temperature range is suitable for many airborne and ground-based systems, while the military-grade variant (A3P250-1FG144M) is available for extreme environments. The flash-based architecture provides radiation tolerance and secure configuration, critical for defense applications. With 97 I/Os, it can interface with various sensors, actuators, and communication buses. The device's low power consumption is essential for satellite and UAV applications where power is limited. Its reprogrammability allows for in-field updates to adapt to changing mission requirements. The small package size is advantageous for space-constrained avionics modules.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für A3P250-FGG144I – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | A3P250-FGG144 | A3P250-FG256I | A3P250-PQ208 | A3P250-1FG144M |
|---|---|---|---|---|---|
| Package | 144-LBGA | 144-LBGA | 256-FBGA | 208-PQFP | 144-FBGA |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 250,000 | 250,000 | 250,000 | 250,000 | 250,000 |
| Logic Elements | 3K | 3K | 3K | 3K | 3K |
| User I/Os | 97 | 97 | 157 | 151 | 97 |
| Fabric RAM | 36 Kbits | 36 Kbits | 36 Kbits | 36 Kbits | 36 Kbits |
| Max Frequency | 350 MHz | 350 MHz | 350 MHz | 350 MHz | 350 MHz |
| Temperature Grade | Industrial (-40°C to +100°C) | Commercial (0°C to +70°C) | Industrial (-40°C to +100°C) | Industrial (-40°C to +100°C) | Military (-55°C to +125°C) |
Wichtigste Unterscheidungsmerkmale
- Flash-based instant-on configuration (vs. SRAM-based FPGAs (e.g., Lattice ECP3))
- Low static power consumption (vs. A3P250-FG256I)
- Industrial temperature grade (vs. A3P250-FGG144)
Designhinweise
The A3P250-FGG144I requires a 1.5V core supply and separate I/O bank supplies (1.5V, 1.8V, 2.5V, or 3.3V). Use low-ESR ceramic capacitors (0.1uF and 10uF) placed close to each VCC and VCCIO pin to minimize power supply noise. The flash-based FPGA has low static power (~15 mW), but dynamic power scales with switching activity and frequency. Estimate total power using the Microchip Power Calculator tool to ensure adequate thermal management.
For the 144-ball FBGA package, use a 4-layer or more PCB with a solid ground plane and power plane. Route high-speed I/O signals with controlled impedance (e.g., 50 ohm single-ended) and keep trace lengths matched for differential pairs. Place decoupling capacitors on the bottom side directly under the FPGA to minimize loop inductance. Follow the manufacturer's layout guidelines in the ProASIC3 FPGA User Guide for optimal signal integrity.
A common pitfall is forgetting to connect the JTAG pins for programming. Ensure TCK, TDI, TDO, TMS, and TRST are properly terminated and accessible for in-system programming. Also, do not leave unused I/O pins floating; configure them as outputs or tie them to a defined level to avoid excessive leakage current. Verify that all VCC and GND pins are connected, as missing connections can cause erratic behavior.
Compliance-Informationen
RoHS compliant per distributor listings. Not AEC-Q100 qualified. Lead-free per package description. REACH and conflict minerals status not specified in provided data.
