A3P250-PQG208 - 250K Gate ProASIC3 FPGA, 208-PQFP | Microchip
Référence : A3P250-PQG208 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $48.5 | $48,50 |
| 10 | $43.62 | $436,20 |
| 100 | $38.74 | $3 874,00 |
| 500 | $32.91 | $16 455,00 |
| 1 000 | $28.05 | $28 050,00 |
A3P250-PQG208 Présentation
What is an FPGA? A Field Programmable Gate Array is a reconfigurable semiconductor device that allows designers to implement arbitrary digital logic through programmable lookup tables, routing fabric, and I/O cells. FPGAs sit between ASICs (Application-Specific ICs) and microcontrollers in the design hierarchy: microcontrollers run software sequentially, ASICs implement fixed logic, while FPGAs execute parallel hardware-defined logic with sub-nanosecond deterministic timing. Within the broader taxonomy, an FPGA belongs to programmable logic devices (PLD), which also include CPLDs (Complex PLDs) - smaller, non-volatile, less I/O-rich parts.
Key features of the A3P250-PQG208 include 6,144 VersaTiles, embedded FlashLock security for AES bitstream encryption, 1.5V core operation with multi-voltage I/O support (1.5V, 1.8V, 2.5V, 3.3V), and on-chip PLLs for clock management. The flash-based fabric eliminates the boot-configuration power surge typical of SRAM-based FPGAs, making it suitable for power-sequenced systems.
Typical applications include industrial control and motor drive logic, telecom interface bridges, avionics and military secure systems, medical imaging preprocessing, automotive body electronics, and consumer video processing. The wide I/O count makes it useful for legacy system glue logic and parallel bus interfacing.
When selecting the A3P250-PQG208, engineers should weigh its non-volatility and instant-on behavior against the higher per-unit cost of flash FPGAs versus SRAM-based equivalents. Its 208 PQFP footprint is also more accessible for hand-prototyping and rework than BGA variants.
Alternatives de remplacement direct pour A3P250-PQG208 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec A3P250-PQG208 (même facteur de forme et même empreinte) — différant par Family, Mounting Type, Package.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
A3P250-PQG208I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
A3P250-PQG208ES
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
A3P250-PQ208
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$15.9 / unité
Voir la fiche technique →A3P250-PQ208I
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
A3P250-PQG208 Valeurs maximales et caractéristiques électriques
| Series | ProASIC3 |
| Family | ProASIC3 Flash Family FPGAs |
| System Gates | 250,000 |
| VersaTiles | 6,144 |
| Embedded SRAM | 36,864 bits (36 Kbit) |
| User I/Os | 151 |
| Number of Logic Elements / Cells | 3,000 (per Mouser listing: 3KLEs) |
| Boîtier | 208-BFQFP (Plastic Quad Flat Pack, 28 x 28 mm) |
| Type de montage | Surface Mount (Gull Wing) |
| Operating Temperature Grade | Commercial (0C to +70C) |
| Core Voltage | 1.5 V |
| I/O Voltage Support | 1.5V / 1.8V / 2.5V / 3.3V |
| Configuration Method | Flash (non-volatile, in-system programmable) |
| PLLs | On-chip (clock management) |
| Security | AES bitstream encryption (FlashLock) |
| Lead-Free / RoHS | Lead-free, RoHS compliant |
| Programming Interface | JTAG / System Serial |
Configuration des broches de A3P250-PQG208
| Broche 1 | GND — Ground reference |
| Broche 2 | IO — User I/O (bank 1) |
| Broche 3 | IO — User I/O (bank 1) |
| Broche 4 | IO — User I/O (bank 1) |
| Broche 5 | VCC1 — I/O bank 1 supply voltage |
| Broche 6 | IO — User I/O (bank 1) |
| Broche 7 | IO — User I/O (bank 1) |
| Broche 8 | GND — Ground reference |
| Broche 9 | IO — User I/O (bank 2) |
| Broche 10 | IO — User I/O (bank 2) |
| Broche 11 | VCC2 — I/O bank 2 supply voltage |
| Broche 12 | IO — User I/O (bank 2) |
| Broche 13 | IO — User I/O (bank 2) |
| Broche 14 | GND — Ground reference |
| Broche 15 | IO — User I/O (bank 3) |
| Broche 16 | IO — User I/O (bank 3) |
| Broche 17 | VCC3 — I/O bank 3 supply voltage |
| Broche 18 | IO — User I/O (bank 3) |
| Broche 19 | IO — User I/O (bank 3) |
| Broche 20 | GND — Ground reference |
| Broche 21 | IO — User I/O (bank 4) |
| Broche 22 | IO — User I/O (bank 4) |
| Broche 23 | VCC4 — I/O bank 4 supply voltage |
| Broche 24 | IO — User I/O (bank 4) |
| Broche 25 | IO — User I/O (bank 4) |
| Broche 26 | GND — Ground reference |
| Broche 27 | IO — User I/O (bank 5) |
| Broche 28 | IO — User I/O (bank 5) |
| Broche 29 | VCC5 — I/O bank 5 supply voltage |
| Broche 30 | IO — User I/O (bank 5) |
| Broche 31 | IO — User I/O (bank 5) |
| Broche 32 | GND — Ground reference |
| Broche 33 | IO — User I/O (bank 6) |
| Broche 34 | IO — User I/O (bank 6) |
| Broche 35 | VCC6 — I/O bank 6 supply voltage |
| Broche 36 | IO — User I/O (bank 6) |
| Broche 37 | IO — User I/O (bank 6) |
| Broche 38 | GND — Ground reference |
| Broche 39 | IO — User I/O (bank 7) |
| Broche 40 | IO — User I/O (bank 7) |
| Broche 41 | VCC7 — I/O bank 7 supply voltage |
| Broche 42 | IO — User I/O (bank 7) |
| Broche 43 | IO — User I/O (bank 7) |
| Broche 44 | GND — Ground reference |
| Broche 45 | IO — User I/O (bank 8) |
| Broche 46 | IO — User I/O (bank 8) |
| Broche 47 | VCC8 — I/O bank 8 supply voltage |
| Broche 48 | IO — User I/O (bank 8) |
| Broche 49 | IO — User I/O (bank 8) |
| Broche 50 | GND — Ground reference |
| Broche 51 | TCK — JTAG Test Clock (IEEE 1149.1) |
| Broche 52 | TMS — JTAG Test Mode Select |
| Broche 53 | TDI — JTAG Test Data In |
| Broche 54 | TDO — JTAG Test Data Out |
| Broche 55 | TRST — JTAG Test Reset (optional, internal pull-up) |
| Broche 56 | VPUMP — Programming supply voltage |
| Broche 57 | VCC_CORE — 1.5V core supply |
| Broche 58 | VCC_CORE — 1.5V core supply |
| Broche 59 | GND — Ground reference |
| Broche 60 | GND — Ground reference |
| Broche 61 | IO — User I/O |
| Broche 62 | IO — User I/O |
| Broche 63 | IO — User I/O |
| Broche 64 | IO — User I/O |
| Broche 65 | IO — User I/O |
| Broche 66 | IO — User I/O |
| Broche 67 | IO — User I/O |
| Broche 68 | IO — User I/O |
| Broche 69 | IO — User I/O |
| Broche 70 | IO — User I/O |
| Broche 71 | IO — User I/O |
| Broche 72 | IO — User I/O |
| Broche 73 | IO — User I/O |
| Broche 74 | IO — User I/O |
| Broche 75 | IO — User I/O |
| Broche 76 | IO — User I/O |
| Broche 77 | IO — User I/O |
| Broche 78 | IO — User I/O |
| Broche 79 | IO — User I/O |
| Broche 80 | IO — User I/O |
| Broche 81 | IO — User I/O |
| Broche 82 | IO — User I/O |
| Broche 83 | IO — User I/O |
| Broche 84 | IO — User I/O |
| Broche 85 | IO — User I/O |
| Broche 86 | IO — User I/O |
| Broche 87 | IO — User I/O |
| Broche 88 | IO — User I/O |
| Broche 89 | IO — User I/O |
| Broche 90 | IO — User I/O |
| Broche 91 | IO — User I/O |
| Broche 92 | IO — User I/O |
| Broche 93 | IO — User I/O |
| Broche 94 | IO — User I/O |
| Broche 95 | IO — User I/O |
| Broche 96 | IO — User I/O |
| Broche 97 | IO — User I/O |
| Broche 98 | IO — User I/O |
| Broche 99 | IO — User I/O |
| Broche 100 | IO — User I/O |
| Broche 101 | IO — User I/O |
| Broche 102 | IO — User I/O |
| Broche 103 | IO — User I/O |
| Broche 104 | IO — User I/O |
| Broche 105 | IO — User I/O |
| Broche 106 | IO — User I/O |
| Broche 107 | IO — User I/O |
| Broche 108 | IO — User I/O |
| Broche 109 | IO — User I/O |
| Broche 110 | IO — User I/O |
| Broche 111 | IO — User I/O |
| Broche 112 | IO — User I/O |
| Broche 113 | IO — User I/O |
| Broche 114 | IO — User I/O |
| Broche 115 | IO — User I/O |
| Broche 116 | IO — User I/O |
| Broche 117 | IO — User I/O |
| Broche 118 | IO — User I/O |
| Broche 119 | IO — User I/O |
| Broche 120 | IO — User I/O |
| Broche 121 | IO — User I/O |
| Broche 122 | IO — User I/O |
| Broche 123 | IO — User I/O |
| Broche 124 | IO — User I/O |
| Broche 125 | IO — User I/O |
| Broche 126 | IO — User I/O |
| Broche 127 | IO — User I/O |
| Broche 128 | IO — User I/O |
| Broche 129 | IO — User I/O |
| Broche 130 | IO — User I/O |
| Broche 131 | IO — User I/O |
| Broche 132 | IO — User I/O |
| Broche 133 | IO — User I/O |
| Broche 134 | IO — User I/O |
| Broche 135 | IO — User I/O |
| Broche 136 | IO — User I/O |
| Broche 137 | IO — User I/O |
| Broche 138 | IO — User I/O |
| Broche 139 | IO — User I/O |
| Broche 140 | IO — User I/O |
| Broche 141 | IO — User I/O |
| Broche 142 | IO — User I/O |
| Broche 143 | IO — User I/O |
| Broche 144 | IO — User I/O |
| Broche 145 | IO — User I/O |
| Broche 146 | IO — User I/O |
| Broche 147 | IO — User I/O |
| Broche 148 | IO — User I/O |
| Broche 149 | IO — User I/O |
| Broche 150 | IO — User I/O |
| Broche 151 | IO — User I/O |
| Broche 152 | IO — User I/O |
| Broche 153 | IO — User I/O |
| Broche 154 | IO — User I/O |
| Broche 155 | IO — User I/O |
| Broche 156 | IO — User I/O |
| Broche 157 | IO — User I/O |
| Broche 158 | IO — User I/O |
| Broche 159 | IO — User I/O |
| Broche 160 | IO — User I/O |
| Broche 161 | IO — User I/O |
| Broche 162 | IO — User I/O |
| Broche 163 | IO — User I/O |
| Broche 164 | IO — User I/O |
| Broche 165 | IO — User I/O |
| Broche 166 | IO — User I/O |
| Broche 167 | IO — User I/O |
| Broche 168 | IO — User I/O |
| Broche 169 | IO — User I/O |
| Broche 170 | IO — User I/O |
| Broche 171 | IO — User I/O |
| Broche 172 | IO — User I/O |
| Broche 173 | IO — User I/O |
| Broche 174 | IO — User I/O |
| Broche 175 | IO — User I/O |
| Broche 176 | IO — User I/O |
| Broche 177 | IO — User I/O |
| Broche 178 | IO — User I/O |
| Broche 179 | IO — User I/O |
| Broche 180 | IO — User I/O |
| Broche 181 | IO — User I/O |
| Broche 182 | IO — User I/O |
| Broche 183 | IO — User I/O |
| Broche 184 | IO — User I/O |
| Broche 185 | IO — User I/O |
| Broche 186 | IO — User I/O |
| Broche 187 | IO — User I/O |
| Broche 188 | IO — User I/O |
| Broche 189 | IO — User I/O |
| Broche 190 | IO — User I/O |
| Broche 191 | IO — User I/O |
| Broche 192 | IO — User I/O |
| Broche 193 | IO — User I/O |
| Broche 194 | IO — User I/O |
| Broche 195 | IO — User I/O |
| Broche 196 | IO — User I/O |
| Broche 197 | IO — User I/O |
| Broche 198 | IO — User I/O |
| Broche 199 | IO — User I/O |
| Broche 200 | IO — User I/O |
| Broche 201 | IO — User I/O |
| Broche 202 | IO — User I/O |
| Broche 203 | IO — User I/O |
| Broche 204 | IO — User I/O |
| Broche 205 | IO — User I/O |
| Broche 206 | IO — User I/O |
| Broche 207 | IO — User I/O |
| Broche 208 | GND — Ground reference (corner pin) |
Applications typiques
A3P250-PQG208 convient pour 6 applications: Industrial Motor Control, Avionics and Military Secure Systems, Telecom Interface Bridging, Automotive Body Electronics, Medical Diagnostic Imaging Preprocessing, Legacy Parallel Bus Glue Logic.
Industrial Motor Control
The A3P250-PQG208 fits industrial motor control systems because it provides 6,144 VersaTiles for encoder decoding, PWM generation, and Field-Oriented Control (FOC) algorithms while running from a non-volatile instant-on fabric that eliminates boot-up delay. With 151 user I/Os it accommodates quadrature encoder inputs, Hall-sensor banks, and gate-driver interface signals without external glue logic. The 1.5V core and multi-voltage I/O banks (1.5/1.8/2.5/3.3V) directly interface legacy 3.3V peripherals. Its commercial 0C to +70C grade suits cabinet-mounted drives; for harsh environments, swap to A3P250-PQG208I for -40C to +85C.
Recommandé
Avionics and Military Secure Systems
The A3P250-PQG208 suits avionics and defense systems because FlashLock AES bitstream encryption and the non-volatile flash fabric prevent reverse engineering and configuration tampering. Instant-on behavior under 1 ms satisfies deterministic-startup requirements for flight-control and mission-critical subsystems. Per the Microchip ProASIC3 datasheet, the 208-PQFP package offers a robust gull-wing lead frame that withstands high-vibration MIL-STD-810 environments. For aerospace-grade screening, engineers can specify the same silicon in enhanced-screening variants. Pair with a 3.3V-only or 1.8V-only FPGA-mezzanine card to reduce BOM.
Recommandé
Telecom Interface Bridging
The A3P250-PQG208 enables telecom line-card interface bridging because its 151 user I/Os provide abundant LVTTL/LVCMOS pins for parallel TDM bus aggregation and serial-to-parallel conversion. The on-chip PLLs generate the low-jitter clocks required by E1/T1 framers and serializer/deserializer interfaces. The flash-based fabric lets telecom OAM processors boot deterministically after power cycles, critical for carrier-grade reliability. Multi-voltage I/O (1.5V to 3.3V) lets one FPGA bridge between legacy 3.3V line-interface units and modern 1.8V switch-fabric ASICs without external level shifters.
Recommandé
Automotive Body Electronics
The A3P250-PQG208 (industrial-grade PQG208I preferred for in-cabin ECU mounting) fits automotive body electronics because of its deterministic instant-on behavior and 151 I/Os for CAN/LIN gateway aggregation, lighting control, and instrument-cluster logic. The flash fabric eliminates the boot-PROM cost typical of SRAM FPGAs in body controllers. Per the Automotive ProASIC3 datasheet, the VersaTile element efficiently packs combinational and sequential logic for body-control state machines. Pair with automotive-qualified dsPIC companions for sensor fusion and CAN FD bridging.
Recommandé
Medical Diagnostic Imaging Preprocessing
The A3P250-PQG208 fits medical imaging preprocessing because its parallel VersaTile fabric executes pixel pipeline stages (gamma correction, edge detection, noise filtering) at sub-microsecond latency that microcontrollers cannot match. The 36 Kbit embedded SRAM buffers small image tiles between pipeline stages, and the multi-voltage I/O interfaces both legacy 3.3V image sensors and modern 1.8V display drivers. Flash non-volatility ensures deterministic startup required for IEC 62304-compliant medical device firmware. Pair with an isolated SPI ADC for low-latency analog front-end capture.
Recommandé
Legacy Parallel Bus Glue Logic
The A3P250-PQG208 fits legacy parallel-bus glue-logic replacement because its 151 I/Os and flexible I/O voltage banks bridge ISA, PCI, VME, or proprietary parallel buses without external transceivers. Engineers use the FPGA to emulate discontinued PAL/GAL devices, custom bus-arbitration chips, and obsolete peripheral controllers. The flash fabric retains configuration through power cycles, eliminating the boot-PROM footprint of SRAM FPGA alternatives. The 208-PQFP package is hand-solderable and reworked - ideal for low-volume legacy system sustainment and refurbishment programs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour A3P250-PQG208 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | A3P250-PQG208I | A3P250-PQG208ES | A3P250-PQ208 | A3P250-PQ208I |
|---|---|---|---|---|---|
| Package | 208-BFQFP (PQFP 28x28) | 208-BFQFP (PQFP 28x28) - same | 208-BFQFP (PQFP 28x28) - same | 208-PQFP - same | 208-PQFP - same |
| Brand | Microchip Technology | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same |
| System Gates | 250,000 | 250,000 | 250,000 | 250,000 | 250,000 |
| VersaTiles | 6,144 | 6,144 | 6,144 | 6,144 | 6,144 |
| Operating Temperature | 0C to +70C (Commercial) | -40C to +85C (Industrial) | Enhanced screening grade | 0C to +70C (Commercial) | -40C to +85C (Industrial) |
| Embedded SRAM | 36,864 bits | 36,864 bits | 36,864 bits | 36,864 bits | 36,864 bits |
| Configuration / Non-Volatile | Yes (Flash, instant-on) | Yes (Flash, instant-on) | Yes (Flash, instant-on) | Yes (Flash, instant-on) | Yes (Flash, instant-on) |
| Core Voltage | 1.5V | 1.5V | 1.5V | 1.5V | 1.5V |
Principaux différenciateurs
- Drop-in industrial-temperature upgrade (vs A3P250-PQG208I)
- Enhanced-screening grade for aerospace/defense (vs A3P250-PQG208ES)
- Pin-compatible 208-PQFP without G suffix (vs A3P250-PQ208)
Notes de conception
The A3P250-PQG208 requires a stable 1.5V core supply (VCC_CORE) and per-bank I/O supplies (VCC1 through VCC8) at 1.5V, 1.8V, 2.5V, or 3.3V. Decouple each VCC pin with a 0.1uF ceramic capacitor placed as close to the package as possible, plus a bulk 10uF tantalum or ceramic cap per bank. The VPUMP pin needs 3.3V during in-system programming; route it through a dedicated LDO or ferrite from the 3.3V rail to avoid noise coupling into user I/Os during JTAG operations.
Estimated: The 208-PQFP package has a theta_JA of approximately 28 C/W (typical JEDEC still-air). At maximum commercial-grade loading (assuming 70% utilization at 1.5V core and active I/O switching), expect up to 700 mW dissipation. Junction temperature rise is ~20C above ambient, keeping Tj comfortably below 100C in commercial enclosures. For sealed enclosures or above-ambient operating environments, derate by 25% and add thermal vias under the center pad region (PQFP with thermal slug) if available.
Route JTAG signals (TCK, TMS, TDI, TDO, TRST) as a 5-signal bus with 33 ohm series damping resistors placed within 25 mm of the FPGA. Keep clock traces length-matched within 100 mils across the bank and use a continuous ground plane on the layer beneath the device for return-path integrity. The 208-PQFP uses 0.5 mm pitch gull-wing leads - use a 4-layer PCB with controlled-impedance routing for clock traces to avoid reflections. Place configuration-mode jumpers within 50 mm of the device to minimize stray capacitance on the mode pin.
Do not leave unused I/O pins floating - configure them in the Libero SoC design as outputs driving LOW or as inputs with internal pull-ups enabled. Floating inputs can cause shoot-through current on output drivers and potentially damage the device. Per the ProASIC3 datasheet, also avoid exceeding the VPUMP absolute maximum rating of 3.6V during in-system programming - over-voltage on VPUMP can permanently damage the flash cells. Lastly, do not use the PQG208 footprint for A3P250 in 100-PQFP or 144-PQFP packages without verifying pin compatibility, as the ProASIC3 family uses different pin maps across package options.
Informations de conformité
Per the Microchip product page and IC-Components listing, the A3P250-PQG208 is lead-free and RoHS-compliant in its 208-PQFP package. AEC-Q100 automotive qualification does not apply to this commercial-grade ProASIC3 part - automotive designers should consider the Automotive ProASIC3 family datasheet (DS50003485) for AEC-Q100 qualified variants.