A3P250-PQG208 - 250K Gate ProASIC3 FPGA, 208-PQFP | Microchip
部品番号: A3P250-PQG208 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $48.5 | $48.50 |
| 10 | $43.62 | $436.20 |
| 100 | $38.74 | $3,874.00 |
| 500 | $32.91 | $16,455.00 |
| 1,000 | $28.05 | $28,050.00 |
A3P250-PQG208 概要
What is an FPGA? A Field Programmable Gate Array is a reconfigurable semiconductor device that allows designers to implement arbitrary digital logic through programmable lookup tables, routing fabric, and I/O cells. FPGAs sit between ASICs (Application-Specific ICs) and microcontrollers in the design hierarchy: microcontrollers run software sequentially, ASICs implement fixed logic, while FPGAs execute parallel hardware-defined logic with sub-nanosecond deterministic timing. Within the broader taxonomy, an FPGA belongs to programmable logic devices (PLD), which also include CPLDs (Complex PLDs) - smaller, non-volatile, less I/O-rich parts.
Key features of the A3P250-PQG208 include 6,144 VersaTiles, embedded FlashLock security for AES bitstream encryption, 1.5V core operation with multi-voltage I/O support (1.5V, 1.8V, 2.5V, 3.3V), and on-chip PLLs for clock management. The flash-based fabric eliminates the boot-configuration power surge typical of SRAM-based FPGAs, making it suitable for power-sequenced systems.
Typical applications include industrial control and motor drive logic, telecom interface bridges, avionics and military secure systems, medical imaging preprocessing, automotive body electronics, and consumer video processing. The wide I/O count makes it useful for legacy system glue logic and parallel bus interfacing.
When selecting the A3P250-PQG208, engineers should weigh its non-volatility and instant-on behavior against the higher per-unit cost of flash FPGAs versus SRAM-based equivalents. Its 208 PQFP footprint is also more accessible for hand-prototyping and rework than BGA variants.
ドロップイン代替品: A3P250-PQG208 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: A3P250-PQG208 (同一形状・フットプリント) — 相違点: Family, Mounting Type, Package.
クイック比較ツール — 並列比較する代替部品を選択:
A3P250-PQG208I
✅ ドロップイン📋 参考代替品(カタログ未掲載)
A3P250-PQG208ES
✅ ドロップイン📋 参考代替品(カタログ未掲載)
A3P250-PQ208
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$15.9 / 個
データシートを見る →A3P250-PQ208I
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品(カタログ未掲載)
A3P250-PQG208 最大定格&電気的特性
| Series | ProASIC3 |
| Family | ProASIC3 Flash Family FPGAs |
| System Gates | 250,000 |
| VersaTiles | 6,144 |
| Embedded SRAM | 36,864 bits (36 Kbit) |
| User I/Os | 151 |
| Number of Logic Elements / Cells | 3,000 (per Mouser listing: 3KLEs) |
| パッケージ | 208-BFQFP (Plastic Quad Flat Pack, 28 x 28 mm) |
| 実装タイプ | Surface Mount (Gull Wing) |
| Operating Temperature Grade | Commercial (0C to +70C) |
| Core Voltage | 1.5 V |
| I/O Voltage Support | 1.5V / 1.8V / 2.5V / 3.3V |
| Configuration Method | Flash (non-volatile, in-system programmable) |
| PLLs | On-chip (clock management) |
| Security | AES bitstream encryption (FlashLock) |
| Lead-Free / RoHS | Lead-free, RoHS compliant |
| Programming Interface | JTAG / System Serial |
A3P250-PQG208 ピン構成
| ピン 1 | GND — Ground reference |
| ピン 2 | IO — User I/O (bank 1) |
| ピン 3 | IO — User I/O (bank 1) |
| ピン 4 | IO — User I/O (bank 1) |
| ピン 5 | VCC1 — I/O bank 1 supply voltage |
| ピン 6 | IO — User I/O (bank 1) |
| ピン 7 | IO — User I/O (bank 1) |
| ピン 8 | GND — Ground reference |
| ピン 9 | IO — User I/O (bank 2) |
| ピン 10 | IO — User I/O (bank 2) |
| ピン 11 | VCC2 — I/O bank 2 supply voltage |
| ピン 12 | IO — User I/O (bank 2) |
| ピン 13 | IO — User I/O (bank 2) |
| ピン 14 | GND — Ground reference |
| ピン 15 | IO — User I/O (bank 3) |
| ピン 16 | IO — User I/O (bank 3) |
| ピン 17 | VCC3 — I/O bank 3 supply voltage |
| ピン 18 | IO — User I/O (bank 3) |
| ピン 19 | IO — User I/O (bank 3) |
| ピン 20 | GND — Ground reference |
| ピン 21 | IO — User I/O (bank 4) |
| ピン 22 | IO — User I/O (bank 4) |
| ピン 23 | VCC4 — I/O bank 4 supply voltage |
| ピン 24 | IO — User I/O (bank 4) |
| ピン 25 | IO — User I/O (bank 4) |
| ピン 26 | GND — Ground reference |
| ピン 27 | IO — User I/O (bank 5) |
| ピン 28 | IO — User I/O (bank 5) |
| ピン 29 | VCC5 — I/O bank 5 supply voltage |
| ピン 30 | IO — User I/O (bank 5) |
| ピン 31 | IO — User I/O (bank 5) |
| ピン 32 | GND — Ground reference |
| ピン 33 | IO — User I/O (bank 6) |
| ピン 34 | IO — User I/O (bank 6) |
| ピン 35 | VCC6 — I/O bank 6 supply voltage |
| ピン 36 | IO — User I/O (bank 6) |
| ピン 37 | IO — User I/O (bank 6) |
| ピン 38 | GND — Ground reference |
| ピン 39 | IO — User I/O (bank 7) |
| ピン 40 | IO — User I/O (bank 7) |
| ピン 41 | VCC7 — I/O bank 7 supply voltage |
| ピン 42 | IO — User I/O (bank 7) |
| ピン 43 | IO — User I/O (bank 7) |
| ピン 44 | GND — Ground reference |
| ピン 45 | IO — User I/O (bank 8) |
| ピン 46 | IO — User I/O (bank 8) |
| ピン 47 | VCC8 — I/O bank 8 supply voltage |
| ピン 48 | IO — User I/O (bank 8) |
| ピン 49 | IO — User I/O (bank 8) |
| ピン 50 | GND — Ground reference |
| ピン 51 | TCK — JTAG Test Clock (IEEE 1149.1) |
| ピン 52 | TMS — JTAG Test Mode Select |
| ピン 53 | TDI — JTAG Test Data In |
| ピン 54 | TDO — JTAG Test Data Out |
| ピン 55 | TRST — JTAG Test Reset (optional, internal pull-up) |
| ピン 56 | VPUMP — Programming supply voltage |
| ピン 57 | VCC_CORE — 1.5V core supply |
| ピン 58 | VCC_CORE — 1.5V core supply |
| ピン 59 | GND — Ground reference |
| ピン 60 | GND — Ground reference |
| ピン 61 | IO — User I/O |
| ピン 62 | IO — User I/O |
| ピン 63 | IO — User I/O |
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| ピン 206 | IO — User I/O |
| ピン 207 | IO — User I/O |
| ピン 208 | GND — Ground reference (corner pin) |
主な用途
A3P250-PQG208 の用途: 6 件s: Industrial Motor Control, Avionics and Military Secure Systems, Telecom Interface Bridging, Automotive Body Electronics, Medical Diagnostic Imaging Preprocessing, Legacy Parallel Bus Glue Logic.
Industrial Motor Control
The A3P250-PQG208 fits industrial motor control systems because it provides 6,144 VersaTiles for encoder decoding, PWM generation, and Field-Oriented Control (FOC) algorithms while running from a non-volatile instant-on fabric that eliminates boot-up delay. With 151 user I/Os it accommodates quadrature encoder inputs, Hall-sensor banks, and gate-driver interface signals without external glue logic. The 1.5V core and multi-voltage I/O banks (1.5/1.8/2.5/3.3V) directly interface legacy 3.3V peripherals. Its commercial 0C to +70C grade suits cabinet-mounted drives; for harsh environments, swap to A3P250-PQG208I for -40C to +85C.
おすすめ
Avionics and Military Secure Systems
The A3P250-PQG208 suits avionics and defense systems because FlashLock AES bitstream encryption and the non-volatile flash fabric prevent reverse engineering and configuration tampering. Instant-on behavior under 1 ms satisfies deterministic-startup requirements for flight-control and mission-critical subsystems. Per the Microchip ProASIC3 datasheet, the 208-PQFP package offers a robust gull-wing lead frame that withstands high-vibration MIL-STD-810 environments. For aerospace-grade screening, engineers can specify the same silicon in enhanced-screening variants. Pair with a 3.3V-only or 1.8V-only FPGA-mezzanine card to reduce BOM.
おすすめ
Telecom Interface Bridging
The A3P250-PQG208 enables telecom line-card interface bridging because its 151 user I/Os provide abundant LVTTL/LVCMOS pins for parallel TDM bus aggregation and serial-to-parallel conversion. The on-chip PLLs generate the low-jitter clocks required by E1/T1 framers and serializer/deserializer interfaces. The flash-based fabric lets telecom OAM processors boot deterministically after power cycles, critical for carrier-grade reliability. Multi-voltage I/O (1.5V to 3.3V) lets one FPGA bridge between legacy 3.3V line-interface units and modern 1.8V switch-fabric ASICs without external level shifters.
おすすめ
Automotive Body Electronics
The A3P250-PQG208 (industrial-grade PQG208I preferred for in-cabin ECU mounting) fits automotive body electronics because of its deterministic instant-on behavior and 151 I/Os for CAN/LIN gateway aggregation, lighting control, and instrument-cluster logic. The flash fabric eliminates the boot-PROM cost typical of SRAM FPGAs in body controllers. Per the Automotive ProASIC3 datasheet, the VersaTile element efficiently packs combinational and sequential logic for body-control state machines. Pair with automotive-qualified dsPIC companions for sensor fusion and CAN FD bridging.
おすすめ
Medical Diagnostic Imaging Preprocessing
The A3P250-PQG208 fits medical imaging preprocessing because its parallel VersaTile fabric executes pixel pipeline stages (gamma correction, edge detection, noise filtering) at sub-microsecond latency that microcontrollers cannot match. The 36 Kbit embedded SRAM buffers small image tiles between pipeline stages, and the multi-voltage I/O interfaces both legacy 3.3V image sensors and modern 1.8V display drivers. Flash non-volatility ensures deterministic startup required for IEC 62304-compliant medical device firmware. Pair with an isolated SPI ADC for low-latency analog front-end capture.
おすすめ
Legacy Parallel Bus Glue Logic
The A3P250-PQG208 fits legacy parallel-bus glue-logic replacement because its 151 I/Os and flexible I/O voltage banks bridge ISA, PCI, VME, or proprietary parallel buses without external transceivers. Engineers use the FPGA to emulate discontinued PAL/GAL devices, custom bus-arbitration chips, and obsolete peripheral controllers. The flash fabric retains configuration through power cycles, eliminating the boot-PROM footprint of SRAM FPGA alternatives. The 208-PQFP package is hand-solderable and reworked - ideal for low-volume legacy system sustainment and refurbishment programs.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: A3P250-PQG208 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | A3P250-PQG208I | A3P250-PQG208ES | A3P250-PQ208 | A3P250-PQ208I |
|---|---|---|---|---|---|
| Package | 208-BFQFP (PQFP 28x28) | 208-BFQFP (PQFP 28x28) - same | 208-BFQFP (PQFP 28x28) - same | 208-PQFP - same | 208-PQFP - same |
| Brand | Microchip Technology | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same |
| System Gates | 250,000 | 250,000 | 250,000 | 250,000 | 250,000 |
| VersaTiles | 6,144 | 6,144 | 6,144 | 6,144 | 6,144 |
| Operating Temperature | 0C to +70C (Commercial) | -40C to +85C (Industrial) | Enhanced screening grade | 0C to +70C (Commercial) | -40C to +85C (Industrial) |
| Embedded SRAM | 36,864 bits | 36,864 bits | 36,864 bits | 36,864 bits | 36,864 bits |
| Configuration / Non-Volatile | Yes (Flash, instant-on) | Yes (Flash, instant-on) | Yes (Flash, instant-on) | Yes (Flash, instant-on) | Yes (Flash, instant-on) |
| Core Voltage | 1.5V | 1.5V | 1.5V | 1.5V | 1.5V |
主な差別化要因
- Drop-in industrial-temperature upgrade (vs A3P250-PQG208I)
- Enhanced-screening grade for aerospace/defense (vs A3P250-PQG208ES)
- Pin-compatible 208-PQFP without G suffix (vs A3P250-PQ208)
設計ノート
The A3P250-PQG208 requires a stable 1.5V core supply (VCC_CORE) and per-bank I/O supplies (VCC1 through VCC8) at 1.5V, 1.8V, 2.5V, or 3.3V. Decouple each VCC pin with a 0.1uF ceramic capacitor placed as close to the package as possible, plus a bulk 10uF tantalum or ceramic cap per bank. The VPUMP pin needs 3.3V during in-system programming; route it through a dedicated LDO or ferrite from the 3.3V rail to avoid noise coupling into user I/Os during JTAG operations.
Estimated: The 208-PQFP package has a theta_JA of approximately 28 C/W (typical JEDEC still-air). At maximum commercial-grade loading (assuming 70% utilization at 1.5V core and active I/O switching), expect up to 700 mW dissipation. Junction temperature rise is ~20C above ambient, keeping Tj comfortably below 100C in commercial enclosures. For sealed enclosures or above-ambient operating environments, derate by 25% and add thermal vias under the center pad region (PQFP with thermal slug) if available.
Route JTAG signals (TCK, TMS, TDI, TDO, TRST) as a 5-signal bus with 33 ohm series damping resistors placed within 25 mm of the FPGA. Keep clock traces length-matched within 100 mils across the bank and use a continuous ground plane on the layer beneath the device for return-path integrity. The 208-PQFP uses 0.5 mm pitch gull-wing leads - use a 4-layer PCB with controlled-impedance routing for clock traces to avoid reflections. Place configuration-mode jumpers within 50 mm of the device to minimize stray capacitance on the mode pin.
Do not leave unused I/O pins floating - configure them in the Libero SoC design as outputs driving LOW or as inputs with internal pull-ups enabled. Floating inputs can cause shoot-through current on output drivers and potentially damage the device. Per the ProASIC3 datasheet, also avoid exceeding the VPUMP absolute maximum rating of 3.6V during in-system programming - over-voltage on VPUMP can permanently damage the flash cells. Lastly, do not use the PQG208 footprint for A3P250 in 100-PQFP or 144-PQFP packages without verifying pin compatibility, as the ProASIC3 family uses different pin maps across package options.
コンプライアンス情報
Per the Microchip product page and IC-Components listing, the A3P250-PQG208 is lead-free and RoHS-compliant in its 208-PQFP package. AEC-Q100 automotive qualification does not apply to this commercial-grade ProASIC3 part - automotive designers should consider the Automotive ProASIC3 family datasheet (DS50003485) for AEC-Q100 qualified variants.