A3P250-PQG208 - 250K Gate ProASIC3 FPGA, 208-PQFP | Microchip
N.º da peça: A3P250-PQG208 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $48.5 | $48,50 |
| 10 | $43.62 | $436,20 |
| 100 | $38.74 | $3.874,00 |
| 500 | $32.91 | $16.455,00 |
| 1.000 | $28.05 | $28.050,00 |
A3P250-PQG208 Visão geral
What is an FPGA? A Field Programmable Gate Array is a reconfigurable semiconductor device that allows designers to implement arbitrary digital logic through programmable lookup tables, routing fabric, and I/O cells. FPGAs sit between ASICs (Application-Specific ICs) and microcontrollers in the design hierarchy: microcontrollers run software sequentially, ASICs implement fixed logic, while FPGAs execute parallel hardware-defined logic with sub-nanosecond deterministic timing. Within the broader taxonomy, an FPGA belongs to programmable logic devices (PLD), which also include CPLDs (Complex PLDs) - smaller, non-volatile, less I/O-rich parts.
Key features of the A3P250-PQG208 include 6,144 VersaTiles, embedded FlashLock security for AES bitstream encryption, 1.5V core operation with multi-voltage I/O support (1.5V, 1.8V, 2.5V, 3.3V), and on-chip PLLs for clock management. The flash-based fabric eliminates the boot-configuration power surge typical of SRAM-based FPGAs, making it suitable for power-sequenced systems.
Typical applications include industrial control and motor drive logic, telecom interface bridges, avionics and military secure systems, medical imaging preprocessing, automotive body electronics, and consumer video processing. The wide I/O count makes it useful for legacy system glue logic and parallel bus interfacing.
When selecting the A3P250-PQG208, engineers should weigh its non-volatility and instant-on behavior against the higher per-unit cost of flash FPGAs versus SRAM-based equivalents. Its 208 PQFP footprint is also more accessible for hand-prototyping and rework than BGA variants.
Alternativas drop-in para A3P250-PQG208 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com A3P250-PQG208 (mesmo formato e footprint) — diferindo em Family, Mounting Type, Package.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
A3P250-PQG208I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
A3P250-PQG208ES
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
A3P250-PQ208
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$15.9 / unidade
Ver ficha técnica →A3P250-PQ208I
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
A3P250-PQG208 Classificações máximas e características elétricas
| Series | ProASIC3 |
| Family | ProASIC3 Flash Family FPGAs |
| System Gates | 250,000 |
| VersaTiles | 6,144 |
| Embedded SRAM | 36,864 bits (36 Kbit) |
| User I/Os | 151 |
| Number of Logic Elements / Cells | 3,000 (per Mouser listing: 3KLEs) |
| Encapsulamento | 208-BFQFP (Plastic Quad Flat Pack, 28 x 28 mm) |
| Tipo de montagem | Surface Mount (Gull Wing) |
| Operating Temperature Grade | Commercial (0C to +70C) |
| Core Voltage | 1.5 V |
| I/O Voltage Support | 1.5V / 1.8V / 2.5V / 3.3V |
| Configuration Method | Flash (non-volatile, in-system programmable) |
| PLLs | On-chip (clock management) |
| Security | AES bitstream encryption (FlashLock) |
| Lead-Free / RoHS | Lead-free, RoHS compliant |
| Programming Interface | JTAG / System Serial |
Configuração de pinos do A3P250-PQG208
| Pino 1 | GND — Ground reference |
| Pino 2 | IO — User I/O (bank 1) |
| Pino 3 | IO — User I/O (bank 1) |
| Pino 4 | IO — User I/O (bank 1) |
| Pino 5 | VCC1 — I/O bank 1 supply voltage |
| Pino 6 | IO — User I/O (bank 1) |
| Pino 7 | IO — User I/O (bank 1) |
| Pino 8 | GND — Ground reference |
| Pino 9 | IO — User I/O (bank 2) |
| Pino 10 | IO — User I/O (bank 2) |
| Pino 11 | VCC2 — I/O bank 2 supply voltage |
| Pino 12 | IO — User I/O (bank 2) |
| Pino 13 | IO — User I/O (bank 2) |
| Pino 14 | GND — Ground reference |
| Pino 15 | IO — User I/O (bank 3) |
| Pino 16 | IO — User I/O (bank 3) |
| Pino 17 | VCC3 — I/O bank 3 supply voltage |
| Pino 18 | IO — User I/O (bank 3) |
| Pino 19 | IO — User I/O (bank 3) |
| Pino 20 | GND — Ground reference |
| Pino 21 | IO — User I/O (bank 4) |
| Pino 22 | IO — User I/O (bank 4) |
| Pino 23 | VCC4 — I/O bank 4 supply voltage |
| Pino 24 | IO — User I/O (bank 4) |
| Pino 25 | IO — User I/O (bank 4) |
| Pino 26 | GND — Ground reference |
| Pino 27 | IO — User I/O (bank 5) |
| Pino 28 | IO — User I/O (bank 5) |
| Pino 29 | VCC5 — I/O bank 5 supply voltage |
| Pino 30 | IO — User I/O (bank 5) |
| Pino 31 | IO — User I/O (bank 5) |
| Pino 32 | GND — Ground reference |
| Pino 33 | IO — User I/O (bank 6) |
| Pino 34 | IO — User I/O (bank 6) |
| Pino 35 | VCC6 — I/O bank 6 supply voltage |
| Pino 36 | IO — User I/O (bank 6) |
| Pino 37 | IO — User I/O (bank 6) |
| Pino 38 | GND — Ground reference |
| Pino 39 | IO — User I/O (bank 7) |
| Pino 40 | IO — User I/O (bank 7) |
| Pino 41 | VCC7 — I/O bank 7 supply voltage |
| Pino 42 | IO — User I/O (bank 7) |
| Pino 43 | IO — User I/O (bank 7) |
| Pino 44 | GND — Ground reference |
| Pino 45 | IO — User I/O (bank 8) |
| Pino 46 | IO — User I/O (bank 8) |
| Pino 47 | VCC8 — I/O bank 8 supply voltage |
| Pino 48 | IO — User I/O (bank 8) |
| Pino 49 | IO — User I/O (bank 8) |
| Pino 50 | GND — Ground reference |
| Pino 51 | TCK — JTAG Test Clock (IEEE 1149.1) |
| Pino 52 | TMS — JTAG Test Mode Select |
| Pino 53 | TDI — JTAG Test Data In |
| Pino 54 | TDO — JTAG Test Data Out |
| Pino 55 | TRST — JTAG Test Reset (optional, internal pull-up) |
| Pino 56 | VPUMP — Programming supply voltage |
| Pino 57 | VCC_CORE — 1.5V core supply |
| Pino 58 | VCC_CORE — 1.5V core supply |
| Pino 59 | GND — Ground reference |
| Pino 60 | GND — Ground reference |
| Pino 61 | IO — User I/O |
| Pino 62 | IO — User I/O |
| Pino 63 | IO — User I/O |
| Pino 64 | IO — User I/O |
| Pino 65 | IO — User I/O |
| Pino 66 | IO — User I/O |
| Pino 67 | IO — User I/O |
| Pino 68 | IO — User I/O |
| Pino 69 | IO — User I/O |
| Pino 70 | IO — User I/O |
| Pino 71 | IO — User I/O |
| Pino 72 | IO — User I/O |
| Pino 73 | IO — User I/O |
| Pino 74 | IO — User I/O |
| Pino 75 | IO — User I/O |
| Pino 76 | IO — User I/O |
| Pino 77 | IO — User I/O |
| Pino 78 | IO — User I/O |
| Pino 79 | IO — User I/O |
| Pino 80 | IO — User I/O |
| Pino 81 | IO — User I/O |
| Pino 82 | IO — User I/O |
| Pino 83 | IO — User I/O |
| Pino 84 | IO — User I/O |
| Pino 85 | IO — User I/O |
| Pino 86 | IO — User I/O |
| Pino 87 | IO — User I/O |
| Pino 88 | IO — User I/O |
| Pino 89 | IO — User I/O |
| Pino 90 | IO — User I/O |
| Pino 91 | IO — User I/O |
| Pino 92 | IO — User I/O |
| Pino 93 | IO — User I/O |
| Pino 94 | IO — User I/O |
| Pino 95 | IO — User I/O |
| Pino 96 | IO — User I/O |
| Pino 97 | IO — User I/O |
| Pino 98 | IO — User I/O |
| Pino 99 | IO — User I/O |
| Pino 100 | IO — User I/O |
| Pino 101 | IO — User I/O |
| Pino 102 | IO — User I/O |
| Pino 103 | IO — User I/O |
| Pino 104 | IO — User I/O |
| Pino 105 | IO — User I/O |
| Pino 106 | IO — User I/O |
| Pino 107 | IO — User I/O |
| Pino 108 | IO — User I/O |
| Pino 109 | IO — User I/O |
| Pino 110 | IO — User I/O |
| Pino 111 | IO — User I/O |
| Pino 112 | IO — User I/O |
| Pino 113 | IO — User I/O |
| Pino 114 | IO — User I/O |
| Pino 115 | IO — User I/O |
| Pino 116 | IO — User I/O |
| Pino 117 | IO — User I/O |
| Pino 118 | IO — User I/O |
| Pino 119 | IO — User I/O |
| Pino 120 | IO — User I/O |
| Pino 121 | IO — User I/O |
| Pino 122 | IO — User I/O |
| Pino 123 | IO — User I/O |
| Pino 124 | IO — User I/O |
| Pino 125 | IO — User I/O |
| Pino 126 | IO — User I/O |
| Pino 127 | IO — User I/O |
| Pino 128 | IO — User I/O |
| Pino 129 | IO — User I/O |
| Pino 130 | IO — User I/O |
| Pino 131 | IO — User I/O |
| Pino 132 | IO — User I/O |
| Pino 133 | IO — User I/O |
| Pino 134 | IO — User I/O |
| Pino 135 | IO — User I/O |
| Pino 136 | IO — User I/O |
| Pino 137 | IO — User I/O |
| Pino 138 | IO — User I/O |
| Pino 139 | IO — User I/O |
| Pino 140 | IO — User I/O |
| Pino 141 | IO — User I/O |
| Pino 142 | IO — User I/O |
| Pino 143 | IO — User I/O |
| Pino 144 | IO — User I/O |
| Pino 145 | IO — User I/O |
| Pino 146 | IO — User I/O |
| Pino 147 | IO — User I/O |
| Pino 148 | IO — User I/O |
| Pino 149 | IO — User I/O |
| Pino 150 | IO — User I/O |
| Pino 151 | IO — User I/O |
| Pino 152 | IO — User I/O |
| Pino 153 | IO — User I/O |
| Pino 154 | IO — User I/O |
| Pino 155 | IO — User I/O |
| Pino 156 | IO — User I/O |
| Pino 157 | IO — User I/O |
| Pino 158 | IO — User I/O |
| Pino 159 | IO — User I/O |
| Pino 160 | IO — User I/O |
| Pino 161 | IO — User I/O |
| Pino 162 | IO — User I/O |
| Pino 163 | IO — User I/O |
| Pino 164 | IO — User I/O |
| Pino 165 | IO — User I/O |
| Pino 166 | IO — User I/O |
| Pino 167 | IO — User I/O |
| Pino 168 | IO — User I/O |
| Pino 169 | IO — User I/O |
| Pino 170 | IO — User I/O |
| Pino 171 | IO — User I/O |
| Pino 172 | IO — User I/O |
| Pino 173 | IO — User I/O |
| Pino 174 | IO — User I/O |
| Pino 175 | IO — User I/O |
| Pino 176 | IO — User I/O |
| Pino 177 | IO — User I/O |
| Pino 178 | IO — User I/O |
| Pino 179 | IO — User I/O |
| Pino 180 | IO — User I/O |
| Pino 181 | IO — User I/O |
| Pino 182 | IO — User I/O |
| Pino 183 | IO — User I/O |
| Pino 184 | IO — User I/O |
| Pino 185 | IO — User I/O |
| Pino 186 | IO — User I/O |
| Pino 187 | IO — User I/O |
| Pino 188 | IO — User I/O |
| Pino 189 | IO — User I/O |
| Pino 190 | IO — User I/O |
| Pino 191 | IO — User I/O |
| Pino 192 | IO — User I/O |
| Pino 193 | IO — User I/O |
| Pino 194 | IO — User I/O |
| Pino 195 | IO — User I/O |
| Pino 196 | IO — User I/O |
| Pino 197 | IO — User I/O |
| Pino 198 | IO — User I/O |
| Pino 199 | IO — User I/O |
| Pino 200 | IO — User I/O |
| Pino 201 | IO — User I/O |
| Pino 202 | IO — User I/O |
| Pino 203 | IO — User I/O |
| Pino 204 | IO — User I/O |
| Pino 205 | IO — User I/O |
| Pino 206 | IO — User I/O |
| Pino 207 | IO — User I/O |
| Pino 208 | GND — Ground reference (corner pin) |
Aplicações típicas
A3P250-PQG208 é adequado para 6 aplicaçãos: Industrial Motor Control, Avionics and Military Secure Systems, Telecom Interface Bridging, Automotive Body Electronics, Medical Diagnostic Imaging Preprocessing, Legacy Parallel Bus Glue Logic.
Industrial Motor Control
The A3P250-PQG208 fits industrial motor control systems because it provides 6,144 VersaTiles for encoder decoding, PWM generation, and Field-Oriented Control (FOC) algorithms while running from a non-volatile instant-on fabric that eliminates boot-up delay. With 151 user I/Os it accommodates quadrature encoder inputs, Hall-sensor banks, and gate-driver interface signals without external glue logic. The 1.5V core and multi-voltage I/O banks (1.5/1.8/2.5/3.3V) directly interface legacy 3.3V peripherals. Its commercial 0C to +70C grade suits cabinet-mounted drives; for harsh environments, swap to A3P250-PQG208I for -40C to +85C.
Recomendado
Avionics and Military Secure Systems
The A3P250-PQG208 suits avionics and defense systems because FlashLock AES bitstream encryption and the non-volatile flash fabric prevent reverse engineering and configuration tampering. Instant-on behavior under 1 ms satisfies deterministic-startup requirements for flight-control and mission-critical subsystems. Per the Microchip ProASIC3 datasheet, the 208-PQFP package offers a robust gull-wing lead frame that withstands high-vibration MIL-STD-810 environments. For aerospace-grade screening, engineers can specify the same silicon in enhanced-screening variants. Pair with a 3.3V-only or 1.8V-only FPGA-mezzanine card to reduce BOM.
Recomendado
Telecom Interface Bridging
The A3P250-PQG208 enables telecom line-card interface bridging because its 151 user I/Os provide abundant LVTTL/LVCMOS pins for parallel TDM bus aggregation and serial-to-parallel conversion. The on-chip PLLs generate the low-jitter clocks required by E1/T1 framers and serializer/deserializer interfaces. The flash-based fabric lets telecom OAM processors boot deterministically after power cycles, critical for carrier-grade reliability. Multi-voltage I/O (1.5V to 3.3V) lets one FPGA bridge between legacy 3.3V line-interface units and modern 1.8V switch-fabric ASICs without external level shifters.
Recomendado
Automotive Body Electronics
The A3P250-PQG208 (industrial-grade PQG208I preferred for in-cabin ECU mounting) fits automotive body electronics because of its deterministic instant-on behavior and 151 I/Os for CAN/LIN gateway aggregation, lighting control, and instrument-cluster logic. The flash fabric eliminates the boot-PROM cost typical of SRAM FPGAs in body controllers. Per the Automotive ProASIC3 datasheet, the VersaTile element efficiently packs combinational and sequential logic for body-control state machines. Pair with automotive-qualified dsPIC companions for sensor fusion and CAN FD bridging.
Recomendado
Medical Diagnostic Imaging Preprocessing
The A3P250-PQG208 fits medical imaging preprocessing because its parallel VersaTile fabric executes pixel pipeline stages (gamma correction, edge detection, noise filtering) at sub-microsecond latency that microcontrollers cannot match. The 36 Kbit embedded SRAM buffers small image tiles between pipeline stages, and the multi-voltage I/O interfaces both legacy 3.3V image sensors and modern 1.8V display drivers. Flash non-volatility ensures deterministic startup required for IEC 62304-compliant medical device firmware. Pair with an isolated SPI ADC for low-latency analog front-end capture.
Recomendado
Legacy Parallel Bus Glue Logic
The A3P250-PQG208 fits legacy parallel-bus glue-logic replacement because its 151 I/Os and flexible I/O voltage banks bridge ISA, PCI, VME, or proprietary parallel buses without external transceivers. Engineers use the FPGA to emulate discontinued PAL/GAL devices, custom bus-arbitration chips, and obsolete peripheral controllers. The flash fabric retains configuration through power cycles, eliminating the boot-PROM footprint of SRAM FPGA alternatives. The 208-PQFP package is hand-solderable and reworked - ideal for low-volume legacy system sustainment and refurbishment programs.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para A3P250-PQG208 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | A3P250-PQG208I | A3P250-PQG208ES | A3P250-PQ208 | A3P250-PQ208I |
|---|---|---|---|---|---|
| Package | 208-BFQFP (PQFP 28x28) | 208-BFQFP (PQFP 28x28) - same | 208-BFQFP (PQFP 28x28) - same | 208-PQFP - same | 208-PQFP - same |
| Brand | Microchip Technology | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same |
| System Gates | 250,000 | 250,000 | 250,000 | 250,000 | 250,000 |
| VersaTiles | 6,144 | 6,144 | 6,144 | 6,144 | 6,144 |
| Operating Temperature | 0C to +70C (Commercial) | -40C to +85C (Industrial) | Enhanced screening grade | 0C to +70C (Commercial) | -40C to +85C (Industrial) |
| Embedded SRAM | 36,864 bits | 36,864 bits | 36,864 bits | 36,864 bits | 36,864 bits |
| Configuration / Non-Volatile | Yes (Flash, instant-on) | Yes (Flash, instant-on) | Yes (Flash, instant-on) | Yes (Flash, instant-on) | Yes (Flash, instant-on) |
| Core Voltage | 1.5V | 1.5V | 1.5V | 1.5V | 1.5V |
Principais diferenciais
- Drop-in industrial-temperature upgrade (vs A3P250-PQG208I)
- Enhanced-screening grade for aerospace/defense (vs A3P250-PQG208ES)
- Pin-compatible 208-PQFP without G suffix (vs A3P250-PQ208)
Notas de projeto
The A3P250-PQG208 requires a stable 1.5V core supply (VCC_CORE) and per-bank I/O supplies (VCC1 through VCC8) at 1.5V, 1.8V, 2.5V, or 3.3V. Decouple each VCC pin with a 0.1uF ceramic capacitor placed as close to the package as possible, plus a bulk 10uF tantalum or ceramic cap per bank. The VPUMP pin needs 3.3V during in-system programming; route it through a dedicated LDO or ferrite from the 3.3V rail to avoid noise coupling into user I/Os during JTAG operations.
Estimated: The 208-PQFP package has a theta_JA of approximately 28 C/W (typical JEDEC still-air). At maximum commercial-grade loading (assuming 70% utilization at 1.5V core and active I/O switching), expect up to 700 mW dissipation. Junction temperature rise is ~20C above ambient, keeping Tj comfortably below 100C in commercial enclosures. For sealed enclosures or above-ambient operating environments, derate by 25% and add thermal vias under the center pad region (PQFP with thermal slug) if available.
Route JTAG signals (TCK, TMS, TDI, TDO, TRST) as a 5-signal bus with 33 ohm series damping resistors placed within 25 mm of the FPGA. Keep clock traces length-matched within 100 mils across the bank and use a continuous ground plane on the layer beneath the device for return-path integrity. The 208-PQFP uses 0.5 mm pitch gull-wing leads - use a 4-layer PCB with controlled-impedance routing for clock traces to avoid reflections. Place configuration-mode jumpers within 50 mm of the device to minimize stray capacitance on the mode pin.
Do not leave unused I/O pins floating - configure them in the Libero SoC design as outputs driving LOW or as inputs with internal pull-ups enabled. Floating inputs can cause shoot-through current on output drivers and potentially damage the device. Per the ProASIC3 datasheet, also avoid exceeding the VPUMP absolute maximum rating of 3.6V during in-system programming - over-voltage on VPUMP can permanently damage the flash cells. Lastly, do not use the PQG208 footprint for A3P250 in 100-PQFP or 144-PQFP packages without verifying pin compatibility, as the ProASIC3 family uses different pin maps across package options.
Informações de conformidade
Per the Microchip product page and IC-Components listing, the A3P250-PQG208 is lead-free and RoHS-compliant in its 208-PQFP package. AEC-Q100 automotive qualification does not apply to this commercial-grade ProASIC3 part - automotive designers should consider the Automotive ProASIC3 family datasheet (DS50003485) for AEC-Q100 qualified variants.