A3PE1500-1FGG48C - ProASIC3E Flash FPGA 484-BGA | Microchip
Référence : A3PE1500-1FGG48C ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $62.5 | $62,50 |
| 10 | $58.2 | $582,00 |
| 100 | $52.8 | $5 280,00 |
| 500 | $47.6 | $23 800,00 |
| 1 000 | $43.1 | $43 100,00 |
A3PE1500-1FGG48C Présentation
A flash-based FPGA is a reprogrammable logic device whose configuration is stored in on-chip nonvolatile flash memory cells rather than volatile SRAM. Because the configuration data is retained when power is removed, flash FPGAs are Instant On single-chip solutions that require no external boot flash, occupy a smaller board footprint, and offer inherently higher security against design theft than SRAM FPGAs. Within the programmable logic hierarchy, the ProASIC3E family sits above the ProASICPLUS generation and serves as a cost-effective ASIC replacement in the broader power-management and system-logic semiconductor taxonomy.
Key features include nonvolatile flash programming, 276,480 bits of embedded configuration capacity, support for optional soft ARM processor cores, and abundant user I/O with bank-selectable voltage-referenced standards. The -1 speed grade provides balanced logic performance for high-volume systems, while the reprogrammable flash fabric lowers total cost of ownership by eliminating external configuration devices.
Architecturally, ProASIC3E uses third-generation flash switch technology with a uniform sea-of-vanilla-gates fabric, built around Versatile logic elements, embedded SRAM blocks, and advanced I/O structures supporting single-ended and differential standards. The nonvolatile nature enables secure, low-power single-chip designs with time-to-market benefits at ASIC-level unit cost.
Typical applications include consumer electronics, networking and communications equipment, computing platforms, industrial control, and avionics subsystems that benefit from secure, instant-on programmable logic without external configuration memory.
Design consideration: because FGG484 and FG256 packages are footprint-compatible within the family, boards can be designed to migrate between densities without re-layout; always assign one VREF pin per minibank when using voltage-referenced I/O standards.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour A3PE1500-1FGG48C — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec A3PE1500-1FGG48C (même facteur de forme et même empreinte) — différant par System Gates, Package, Configuration Memory, Process Technology, Temperature Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
A3PE1500-FGG48C
✅ Remplacement direct✓ En stock
$96.8 / unité
Voir la fiche technique →A3PE1500-FGG48I
✅ Remplacement direct✓ En stock
$55.4 / unité
Voir la fiche technique →A3PE1500-1FGG484
✅ Remplacement direct✓ En stock
$48.1 / unité
Voir la fiche technique →A3PE1500-1FGG484I
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →A3PE1500-FG484
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
A3PE1500-1FGG48C Valeurs maximales et caractéristiques électriques
| Family | ProASIC3E Flash FPGA |
| System Gates | 1,000,000 |
| User I/O | 280 |
| Configuration Capacity | 276,480 bits |
| Speed Grade | -1 |
| Temperature Grade | C (Commercial) |
| Technology | Nonvolatile Flash |
| Reprogrammable | Yes |
| Soft ARM Support | Optional |
| Boîtier | 484-Ball FBGA (FGG484) |
| Type de montage | Surface Mount |
| Instant On | Yes (no external boot flash) |
| RoHS | Compliant (G suffix) |
| Package Footprint Compatibility | FG256 and FG484 footprint-compatible |
| VREF Requirement | One voltage-referenced I/O per minibank for voltage-referenced standards |
Guide de configuration des broches du A3PE1500-1FGG48C fg256 and fg484 footprint-compatible
Configuration des broches du A3PE1500-1FGG48C (boîtier fg256 and fg484 footprint-compatible). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour A3PE1500-1FGG48C.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
A3PE1500-1FGG48C convient pour 6 applications: Networking and Communications Equipment, Avionics and Defense Subsystems, Industrial Control and Automation, Consumer Electronics ASIC Replacement, Computing and Storage Backplane Logic, Secure Embedded Systems and Design Protection.
Networking and Communications Equipment
The A3PE1500-1FGG48C fits switching, routing, and backplane glue-logic roles because its 280 user I/Os and bank-selectable voltage-referenced I/O standards interface legacy and modern line-card buses without external level shifters. In a typical placement, the device bridges a control FPGA region between a CPU and PHY devices, using its nonvolatile flash fabric so the line card is functional the instant -48V or 12V power arrives, with no configuration-boot delay that could stall link bring-up. The 1,000,000-gate density absorbs address decoding, interrupt aggregation, and serial framing tasks at ASIC-replacement cost. Because FGG484 and FG256 are footprint-compatible per the Microchip datasheet, designers can qualify a smaller, cheaper density variant on the same PCB, protecting volume economics as gate-count needs evolve.
Recommandé
Avionics and Defense Subsystems
Avionics designers specify the A3PE1500-1FGG48C's ProASIC3E family because the Microchip datasheet explicitly lists avionics as a target market, driven by single-chip security and Instant-On behavior. The nonvolatile flash configuration cannot be read out as an SRAM bitstream at power-up, reducing reverse-engineering risk in flight-control interfaces, sensor aggregation, and ARINC-style bus glue logic. With 1,000,000 gates and 276,480 configuration bits, the device implements redundant-channel voting and health-monitoring state machines at deterministic startup. For programs requiring extended temperature, the pin-identical A3PE1500-1FGG484I industrial variant drops onto the same 484-ball FGG484 footprint with no PCB change. Designers should assign one VREF per minibank when using voltage-referenced I/O standards and budget industrial-grade procurement lead times of 8-16 weeks.
Recommandé
Industrial Control and Automation
In PLC I/O modules, motor-control sequencing panels, and machine-vision interface boards, the A3PE1500-1FGG48C replaces ASIC and gate-array NRE with reprogrammable flash logic at 1,000,000-gate scale. Its Instant-On flash fabric means the controller energizes outputs deterministically at power application - a safety-relevant advantage over SRAM FPGAs that spend milliseconds loading configuration from external flash. The 280 user I/Os drive relay drivers, encoder inputs, and fieldbus transceivers across multiple voltage banks, while optional soft ARM support lets firmware-assisted sequencing share the fabric. Estimated benefit: eliminating one external configuration flash device and its footprint trims BOM cost and a common failure point. For dusty, high-temperature cabinets, the industrial -FGG484I variant on the identical footprint is the recommended procurement choice.
Recommandé
Consumer Electronics ASIC Replacement
The Microchip ProASIC3E datasheet positions the family as a cost-effective ASIC replacement for consumer applications, and the A3PE1500-1FGG48C is the 1M-gate point in that strategy. Consumer set-top, display-timing, and peripheral-controller boards exploit ASIC-level unit cost without mask-set NRE: the flash fabric is reprogrammed in-house when specifications change mid-lifecycle, protecting product schedules. The 484-ball FGG484 fine-pitch BGA suits dense consumer PCBs, and because configuration is nonvolatile, no external boot flash delays first-frame video or first-button response after standby power-up. Volume pricing tiers - roughly 43.10 USD at qty 1000 as of 2026-09-02 - keep per-unit logic cost competitive against multi-chip solutions. Footprint compatibility with smaller FG256 densities allows a single PCB platform across product tiers.
Recommandé
Computing and Storage Backplane Logic
Server backplanes, storage enclosures, and slot-mapping circuits use the A3PE1500-1FGG48C for hot-swap arbitration, LED/EEPROM aggregation, and power-good sequencing across dozens of slots. The device's 280 I/Os span multiple banks so 3.3V management buses and 1.8V/2.5V signaling coexist on one chip, and voltage-referenced standards are supported with one VREF pin per minibank per the Microchip datasheet. Instant-On flash configuration is critical here: enclosure management must enumerate drives the moment auxiliary power arrives, before any host CPU configuration sequence completes. The 1,000,000-gate fabric absorbs per-slot state machines that would otherwise demand several CPLDs. Estimated benefit: consolidating four mid-density CPLDs into one A3PE1500 reduces board area and quiescent management power on always-on standby rails.
Recommandé
Secure Embedded Systems and Design Protection
Applications protecting IP - license-control dongles, encryption key storage logic, and anti-counterfeiting subsystems - choose the A3PE1500-1FGG48C because nonvolatile flash FPGA configuration is inherently more secure than SRAM bitstreams, which must be streamed from external memory and are interceptable at boot. The Microchip datasheet lists security as a defining ProASIC3E advantage: with no external configuration device, there is no bus on which to snoop the design. The 1M-gate fabric hosts proprietary protocol engines and optional soft ARM cores, while 280 I/Os connect tamper sensors, real-time clocks, and host interfaces. Instant-On operation additionally enforces secure-state entry before host software runs. Teams migrating designs can reprogram in-system through the reprogrammable flash fabric, supporting field security updates without device replacement.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour A3PE1500-1FGG48C — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | A3PE1500-FGG48C | A3PE1500-FGG48I | A3PE1500-1FGG484 | A3PE1500-1FGG484I | A3PE1500-FG484 |
|---|---|---|---|---|---|---|
| Package | 484-BGA (FGG484) | 484-BGA (FGG484) - same | 484-BGA (FGG484) - same | 484-BGA (FGG484) - same | 484-BGA (FGG484) - same | 484-BGA (FG484) - footprint-compatible |
| Brand | Microchip Technology (Actel heritage) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microsemi / Microchip |
| System Gates | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 |
| User I/O | 280 | 280 | 280 | 280 | 280 | 280 |
| Speed Grade | -1 | Standard | Standard | -1 | -1 | Standard |
| RoHS Compliant (G suffix) | Yes | Yes | Yes | Yes | Yes | No (no G suffix) |
| Soft ARM Support | Optional | Optional | Optional | Optional | Optional | Optional |
Principaux différenciateurs
- Highest binar speed grade in commercial package (vs A3PE1500-FGG48C)
- Industrial-temperature drop-in available (vs A3PE1500-1FGG484I)
- Nonvolatile secure Instant-On fabric (vs A3PE1500-FG484)
Notes de conception
Leverage the footprint compatibility documented in the Microchip ProASIC3E datasheet (note 4: FG256 and FG484 are footprint-compatible packages). Design the 484-ball FGG484 land pattern so that future density or temperature-grade migrations (A3PE1500-1FGG484I, or Fusion M1AFS1500 FG484-class devices) require no PCB respin. Follow standard fine-pitch BGA layout practice: 1.0 mm pitch, via-in-pad or dogbone escape, and 4+ layer stack with dedicated ground plane under the die for signal return.
When using voltage-referenced I/O standards, the datasheet requires assigning at least one I/O pin as a VREF pin per minibank (group of I/Os). Omitting this causes bank-wide I/O standard failures at timing signoff. Additionally, verify the speed grade suffix before layout signoff: -1 parts meet tighter timing than standard grade; substituting a non-1 part on an existing bitstream can violate setup/hold on critical paths. Match the G suffix for RoHS-required builds.
Estimated: flash FPGA core power scales with toggle rate; at 1M gates in typical networking glue-logic duty, budget core and I/O rails per the ProASIC3E datasheet power estimator rather than worst-case numbers. Because configuration is nonvolatile, there is no inrush associated with configuration flash read at power-up - useful for hot-swap and Instant-On designs. Decouple each I/O bank supply with at least 10 uF bulk plus 0.1 uF per few pins per standard FPGA practice, and validate against Microchip's Libero power analysis.
Informations de conformité
Per the Microchip ProASIC3E datasheet, G in the part number suffix indicates RoHS-compliant packages (see ProASIC3E Ordering Information). REACH, lead-free, and halogen-free certificates should be confirmed on the official Microchip A3PE1500 product page per date code.
