A3PE1500-1FGG48C - ProASIC3E Flash FPGA 484-BGA | Microchip
MPN: A3PE1500-1FGG48C ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $62.5 | $62.50 |
| 10 | $58.2 | $582.00 |
| 100 | $52.8 | $5,280.00 |
| 500 | $47.6 | $23,800.00 |
| 1,000 | $43.1 | $43,100.00 |
Drop-in alternatives for A3PE1500-1FGG48C — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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A3PE1500-FGG48C
✅ Drop-In✓ In Stock
$96.8 / Unit
View Datasheet →A3PE1500-FGG48I
✅ Drop-In✓ In Stock
$55.4 / Unit
View Datasheet →A3PE1500-1FGG484
✅ Drop-In✓ In Stock
$48.1 / Unit
View Datasheet →A3PE1500-1FGG484I
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Contact for price
View Datasheet →A3PE1500-FG484
✅ Drop-In📋 Reference alternative (not in catalog)
A3PE1500-1FGG48C Maximum Ratings & Electrical Characteristics
| Family | ProASIC3E Flash FPGA |
| System Gates | 1,000,000 |
| User I/O | 280 |
| Configuration Capacity | 276,480 bits |
| Speed Grade | -1 |
| Temperature Grade | C (Commercial) |
| Technology | Nonvolatile Flash |
| Reprogrammable | Yes |
| Soft ARM Support | Optional |
| Package | 484-Ball FBGA (FGG484) |
| Mounting Type | Surface Mount |
| Instant On | Yes (no external boot flash) |
| RoHS | Compliant (G suffix) |
| Package Footprint Compatibility | FG256 and FG484 footprint-compatible |
| VREF Requirement | One voltage-referenced I/O per minibank for voltage-referenced standards |
A3PE1500-1FGG48C fg256 and fg484 footprint-compatible Pin Configuration Guide
Complete pinout information for A3PE1500-1FGG48C (fg256 and fg484 footprint-compatible package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE1500-1FGG48C.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3PE1500-1FGG48C is suitable for 6 applications: Networking and Communications Equipment, Avionics and Defense Subsystems, Industrial Control and Automation, Consumer Electronics ASIC Replacement, Computing and Storage Backplane Logic, Secure Embedded Systems and Design Protection.
Networking and Communications Equipment
The A3PE1500-1FGG48C fits switching, routing, and backplane glue-logic roles because its 280 user I/Os and bank-selectable voltage-referenced I/O standards interface legacy and modern line-card buses without external level shifters. In a typical placement, the device bridges a control FPGA region between a CPU and PHY devices, using its nonvolatile flash fabric so the line card is functional the instant -48V or 12V power arrives, with no configuration-boot delay that could stall link bring-up. The 1,000,000-gate density absorbs address decoding, interrupt aggregation, and serial framing tasks at ASIC-replacement cost. Because FGG484 and FG256 are footprint-compatible per the Microchip datasheet, designers can qualify a smaller, cheaper density variant on the same PCB, protecting volume economics as gate-count needs evolve.
Recommended
Avionics and Defense Subsystems
Avionics designers specify the A3PE1500-1FGG48C's ProASIC3E family because the Microchip datasheet explicitly lists avionics as a target market, driven by single-chip security and Instant-On behavior. The nonvolatile flash configuration cannot be read out as an SRAM bitstream at power-up, reducing reverse-engineering risk in flight-control interfaces, sensor aggregation, and ARINC-style bus glue logic. With 1,000,000 gates and 276,480 configuration bits, the device implements redundant-channel voting and health-monitoring state machines at deterministic startup. For programs requiring extended temperature, the pin-identical A3PE1500-1FGG484I industrial variant drops onto the same 484-ball FGG484 footprint with no PCB change. Designers should assign one VREF per minibank when using voltage-referenced I/O standards and budget industrial-grade procurement lead times of 8-16 weeks.
Recommended
Industrial Control and Automation
In PLC I/O modules, motor-control sequencing panels, and machine-vision interface boards, the A3PE1500-1FGG48C replaces ASIC and gate-array NRE with reprogrammable flash logic at 1,000,000-gate scale. Its Instant-On flash fabric means the controller energizes outputs deterministically at power application - a safety-relevant advantage over SRAM FPGAs that spend milliseconds loading configuration from external flash. The 280 user I/Os drive relay drivers, encoder inputs, and fieldbus transceivers across multiple voltage banks, while optional soft ARM support lets firmware-assisted sequencing share the fabric. Estimated benefit: eliminating one external configuration flash device and its footprint trims BOM cost and a common failure point. For dusty, high-temperature cabinets, the industrial -FGG484I variant on the identical footprint is the recommended procurement choice.
Recommended
Consumer Electronics ASIC Replacement
The Microchip ProASIC3E datasheet positions the family as a cost-effective ASIC replacement for consumer applications, and the A3PE1500-1FGG48C is the 1M-gate point in that strategy. Consumer set-top, display-timing, and peripheral-controller boards exploit ASIC-level unit cost without mask-set NRE: the flash fabric is reprogrammed in-house when specifications change mid-lifecycle, protecting product schedules. The 484-ball FGG484 fine-pitch BGA suits dense consumer PCBs, and because configuration is nonvolatile, no external boot flash delays first-frame video or first-button response after standby power-up. Volume pricing tiers - roughly 43.10 USD at qty 1000 as of 2026-09-02 - keep per-unit logic cost competitive against multi-chip solutions. Footprint compatibility with smaller FG256 densities allows a single PCB platform across product tiers.
Recommended
Computing and Storage Backplane Logic
Server backplanes, storage enclosures, and slot-mapping circuits use the A3PE1500-1FGG48C for hot-swap arbitration, LED/EEPROM aggregation, and power-good sequencing across dozens of slots. The device's 280 I/Os span multiple banks so 3.3V management buses and 1.8V/2.5V signaling coexist on one chip, and voltage-referenced standards are supported with one VREF pin per minibank per the Microchip datasheet. Instant-On flash configuration is critical here: enclosure management must enumerate drives the moment auxiliary power arrives, before any host CPU configuration sequence completes. The 1,000,000-gate fabric absorbs per-slot state machines that would otherwise demand several CPLDs. Estimated benefit: consolidating four mid-density CPLDs into one A3PE1500 reduces board area and quiescent management power on always-on standby rails.
Recommended
Secure Embedded Systems and Design Protection
Applications protecting IP - license-control dongles, encryption key storage logic, and anti-counterfeiting subsystems - choose the A3PE1500-1FGG48C because nonvolatile flash FPGA configuration is inherently more secure than SRAM bitstreams, which must be streamed from external memory and are interceptable at boot. The Microchip datasheet lists security as a defining ProASIC3E advantage: with no external configuration device, there is no bus on which to snoop the design. The 1M-gate fabric hosts proprietary protocol engines and optional soft ARM cores, while 280 I/Os connect tamper sensors, real-time clocks, and host interfaces. Instant-On operation additionally enforces secure-state entry before host software runs. Teams migrating designs can reprogram in-system through the reprogrammable flash fabric, supporting field security updates without device replacement.
Recommended
Recommended Products Summary
Engineering reference data for A3PE1500-1FGG48C — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3PE1500-FGG48C | A3PE1500-FGG48I | A3PE1500-1FGG484 | A3PE1500-1FGG484I | A3PE1500-FG484 |
|---|---|---|---|---|---|---|
| Package | 484-BGA (FGG484) | 484-BGA (FGG484) - same | 484-BGA (FGG484) - same | 484-BGA (FGG484) - same | 484-BGA (FGG484) - same | 484-BGA (FG484) - footprint-compatible |
| Brand | Microchip Technology (Actel heritage) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microsemi / Microchip |
| System Gates | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 | 1,000,000 |
| User I/O | 280 | 280 | 280 | 280 | 280 | 280 |
| Speed Grade | -1 | Standard | Standard | -1 | -1 | Standard |
| Temperature Grade | C (Commercial) | C (Commercial) | I (Industrial) | Commercial/Industrial per suffix | I (Industrial) | [DATA_NEEDED] |
| RoHS Compliant (G suffix) | Yes | Yes | Yes | Yes | Yes | No (no G suffix) |
| Soft ARM Support | Optional | Optional | Optional | Optional | Optional | Optional |
Key Differentiators
- Highest binar speed grade in commercial package (vs A3PE1500-FGG48C)
- Industrial-temperature drop-in available (vs A3PE1500-1FGG484I)
- Nonvolatile secure Instant-On fabric (vs A3PE1500-FG484)
Design Notes
Leverage the footprint compatibility documented in the Microchip ProASIC3E datasheet (note 4: FG256 and FG484 are footprint-compatible packages). Design the 484-ball FGG484 land pattern so that future density or temperature-grade migrations (A3PE1500-1FGG484I, or Fusion M1AFS1500 FG484-class devices) require no PCB respin. Follow standard fine-pitch BGA layout practice: 1.0 mm pitch, via-in-pad or dogbone escape, and 4+ layer stack with dedicated ground plane under the die for signal return.
When using voltage-referenced I/O standards, the datasheet requires assigning at least one I/O pin as a VREF pin per minibank (group of I/Os). Omitting this causes bank-wide I/O standard failures at timing signoff. Additionally, verify the speed grade suffix before layout signoff: -1 parts meet tighter timing than standard grade; substituting a non-1 part on an existing bitstream can violate setup/hold on critical paths. Match the G suffix for RoHS-required builds.
Estimated: flash FPGA core power scales with toggle rate; at 1M gates in typical networking glue-logic duty, budget core and I/O rails per the ProASIC3E datasheet power estimator rather than worst-case numbers. Because configuration is nonvolatile, there is no inrush associated with configuration flash read at power-up - useful for hot-swap and Instant-On designs. Decouple each I/O bank supply with at least 10 uF bulk plus 0.1 uF per few pins per standard FPGA practice, and validate against Microchip's Libero power analysis.
Compliance Information
Per the Microchip ProASIC3E datasheet, G in the part number suffix indicates RoHS-compliant packages (see ProASIC3E Ordering Information). REACH, lead-free, and halogen-free certificates should be confirmed on the official Microchip A3PE1500 product page per date code.
