A3PE1500-2FGG484I - 1.5M-Gate Flash FPGA 484-FBGA | Microchip
Référence : A3PE1500-2FGG484I ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $262 | $2 620,00 |
| 100 | $238 | $23 800,00 |
| 500 | $214 | $107 000,00 |
| 1 000 | $195 | $195 000,00 |
A3PE1500-2FGG484I Présentation
A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip flash memory rather than an external configuration ROM or volatile SRAM. In the programmable-logic hierarchy, the ProASIC3E family sits under the FPGA umbrella alongside SRAM-FPGA and antifuse alternatives, offering single-chip operation, live-at-power-up (Level 0) behavior, and reprogrammability without a boot device.
Key features include a nonvolatile flash fabric that eliminates external configuration flash, low total cost of ownership as an ASIC replacement, support for optional soft ARM processors, and secure ISP programming. The flash cells are inherently resistant to configuration readback and single-event upsets compared with SRAM FPGAs, an advantage in avionics and industrial systems.
Technically, the device integrates flash-based logic elements, embedded 4,608-bit true dual-port SRAM blocks totaling 504 kbits, and flexible I/O banks operating at 1.5V core supply with wide-select I/O standards. Maximum system performance reaches approximately 310 MHz, and the architecture supports PCIe-compatible and other high-speed interfaces through soft IP.
Typical applications include ASIC prototyping and replacement in consumer, networking/communications, computing, industrial control, and avionics markets, where single-chip, instantly-on programmable logic is valued.
Design consideration: I/O banking rules and power supply sequencing for the multiple VCC/VMV domains must be planned early, since the 484-FBGA pinout fixes bank assignments at layout time.
This page synthesizes distributor pricing, drop-in alternatives, design notes, and FAQs not found in the manufacturer datasheet, as of 2026-09-02.
Alternatives de remplacement direct pour A3PE1500-2FGG484I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec A3PE1500-2FGG484I (même facteur de forme et même empreinte) — différant par Family, System Gates, Package, Operating Temperature, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
A3PE1500-2FGG484Y
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
A3PE1500-FGG484I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
A3PE1500-2FG484I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
A3PE3000-2FGG484I
✅ Remplacement direct✓ En stock
$89.4 / unité
Voir la fiche technique →M1AFS1500-2FGG484I
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$201.11 / unité
Voir la fiche technique →A3PE3000L-1FGG484I
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$104.5 / unité
Voir la fiche technique →A3PE1500-2FGG484I Valeurs maximales et caractéristiques électriques
| Family | ProASIC3E Flash FPGA |
| System Gates | 1500000 |
| Logic Cells | 38400 |
| User I/O | 280 |
| Embedded SRAM | 504 kbits true dual-port |
| Core Supply Voltage | 1.5 V |
| Process Technology | 130 nm, 7-layer metal (6 copper), flash-based CMOS |
| Maximum System Performance | 310 MHz |
| Configuration Memory | On-chip flash, nonvolatile, live at power-up (Level 0) |
| Soft CPU Support | Optional soft ARM support |
| Boîtier | 484-ball FBGA, 1 mm pitch |
| Type de montage | Surface Mount |
| Logic Family | CMOS |
| Grade / Temperature Suffix | I (Industrial) |
| Speed Grade | -2 |
Guide de configuration des broches du A3PE1500-2FGG484I 484-ball fbga, 1 mm pitch
Configuration des broches du A3PE1500-2FGG484I (boîtier 484-ball fbga, 1 mm pitch). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour A3PE1500-2FGG484I.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
A3PE1500-2FGG484I convient pour 6 applications: ASIC Replacement and Prototyping, Networking and Communications Equipment, Avionics and Defense Electronics, Industrial Automation and Motor Control, Medical Instrumentation, Test and Measurement Equipment.
ASIC Replacement and Prototyping
Microchip positions ProASIC3E explicitly as a cost-effective ASIC replacement in the family datasheet. The A3PE1500-2FGG484I provides 1.5 million system gates and 38,400 logic cells in a single nonvolatile chip, eliminating mask costs and NRE for volumes where an ASIC cannot be justified. Its on-chip flash configuration removes the external boot device that SRAM FPGAs require, and the instant-on live-at-power-up Level 0 behavior replicates ASIC power-up timing. Designers prototype RTL in the flash fabric, then ship the same part in production, avoiding costly last-minute conversions and second sources across consumer, computing, and industrial programs.
Recommandé
Networking and Communications Equipment
Line cards, aggregation switches, and backplane interface logic benefit from the A3PE1500-2FGG484I's approximately 310 MHz system performance, 280 user I/O for wide parallel data paths, and 504 kbits of true dual-port SRAM for FIFOs and buffering between clock domains. The flash fabric powers up functional before host processors complete initialization, allowing the FPGA to perform early board bring-up, I2C mux control, and hot-swap supervision. Because configuration is nonvolatile and resistant to readback, firmware-defined packet-processing logic gains a measure of IP protection unavailable on typical SRAM FPGAs, an advantage Microchip highlights for networking markets.
Recommandé
Avionics and Defense Electronics
The flash-based ProASIC3E architecture suits avionics modules where single-chip, instantly-on programmable logic reduces component count and configuration-upset exposure compared with SRAM FPGAs. The A3PE1500-2FGG484I's nonvolatile cells do not lose configuration on power cycling or radiated events in the way SRAM configuration cells can, and the 'I'-grade industrial device supports extended program environments. Typical roles include ARINC bus bridging, sensor interface aggregation, and safety-monitor glue logic, with 1.5M gates providing headroom for redundant channel implementations. Designers should still follow the program's required qualification and screening flow for flight hardware.
Recommandé
Industrial Automation and Motor Control
In industrial drives, PLC I/O modules, and machine-vision sensors, the A3PE1500-2FGG484I implements deterministic PWM generation, encoder decoding, and safety interlock logic with nanosecond-level latency that software controllers cannot match. The 280 user I/O connect dense sensor and actuator banks directly, while 504 kbits of dual-port SRAM buffer high-speed acquisition streams. Flash configuration means the logic is active the instant 24V backplane power arrives - before any embedded CPU boots - enabling safe default states on outputs. The single-chip design also simplifies conformal-coated industrial boards by removing the configuration flash and its reflow/inspection burden.
Recommandé
Medical Instrumentation
Diagnostic imaging front ends, patient-monitoring modules, and laboratory analyzers use the A3PE1500-2FGG484I to aggregate ADC data streams over its 280 user I/O and preprocess them in the 1.5M-gate fabric. The dual-port SRAM (504 kbits) supports ping-pong buffering between acquisition and USB/Ethernet transfer logic. Instant-on flash configuration lets the instrument present calibrated, safe analog front-end states at power-up - important for patient-connected equipment - while configuration readback resistance protects proprietary DSP pipelining IP. The single-chip approach also reduces board area in handheld and cart-based diagnostic units where every cubic centimeter counts.
Recommandé
Test and Measurement Equipment
Bench instruments, protocol analyzers, and automated test fixtures require reprogrammable logic that can be field-updated with new instrument personalities - exactly what the reprogrammable flash A3PE1500-2FGG484I delivers with secure ISP. Its approximately 310 MHz fabric performance handles high-speed pattern capture, while 280 user I/O map to dense channel cards for multi-lane testing. True dual-port SRAM implements time-stamped capture buffers, and nonvolatile configuration means the instrument is functional within milliseconds of mains power, meeting user expectations for instant readiness. Secure ISP programming also protects calibration algorithms stored in the logic design itself.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour A3PE1500-2FGG484I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | A3PE1500-2FGG484Y | A3PE1500-FGG484I | A3PE3000-2FGG484I | M1AFS1500-2FGG484I | A3PE3000L-1FGG484I |
|---|---|---|---|---|---|---|
| Package | 484-ball FBGA (1 mm pitch) | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same footprint | 484-ball FBGA - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 1,500,000 | 1,500,000 | 1,500,000 | 3,000,000 | 1,500,000 class | 3,000,000 |
| Speed Grade | -2 | -2 | -1 (slower) | -2 | -2 | -1 (slower) |
| Configuration | On-chip flash, nonvolatile | On-chip flash - same | On-chip flash - same | On-chip flash - same | On-chip flash + mixed-signal | On-chip flash, low power |
| Temperature Grade | I (Industrial) | Y grade designation | I (Industrial) | I (Industrial) | I (Industrial) | I (Industrial) |
Principaux différenciateurs
- Nonvolatile flash fabric - no external configuration device (vs SRAM-based FPGAs (e.g., Xilinx Spartan class))
- Fastest stock speed grade in the A3PE1500 FG484 family (vs A3PE1500-FGG484I)
- 504 kbits of true dual-port SRAM (vs A3P1500 (base ProASIC3))
Notes de conception
Plan a multi-rail power tree: 1.5 V core plus per-bank I/O supplies. Unlike SRAM FPGAs, the flash-based ProASIC3E fabric has no configuration inrush current, so the core rail does not need a large surge-rated supply; size it for steady-state dynamic current at your clock rates. Sequence I/O bank voltages (VCC/VMV) before or together with the core per the Microchip ProASIC3E power guidelines, and decouple each bank locally with bulk plus 0.1 uF ceramics to minimize simultaneous-switching noise on the 484-FBGA grid.
The 484-ball, 1.0 mm pitch FBGA requires a fine-pitch stack-up: specify a minimum 4-layer PCB with dedicated ground planes, and use via-in-pad or dog-bone fanout per IPC-recommended BGA escape practices. Verify the exact ball map against the ProASIC3E datasheet pin tables before routing - bank assignment is fixed once the PCB is drawn, and I/O standards are constrained per bank. Plan escape routing for the 280 active user I/O; the remaining balls are power/ground/NC. For rework, define a local BGA reflow procedure early given the 1 mm pitch.
A common mistake is ordering a different grade or finish variant without checking drop-in compatibility: A3PE1500-2FGG484I, -2FG484I, -2FGG484Y, and A3PE1500-FGG484I share the same footprint but differ in speed grade or screening. A bitstream meeting timing at -2 may fail at -1 (A3PE1500-FGG484I), so re-run static timing when substituting grades. Also confirm FlashPoint/secure-ISP programming flow support in your programmer, and reserve JTAG/ISP header access on the board for field updates.
Informations de conformité
Compliance status not stated in the provided web data; confirm on the Microchip A3PE1500 product page environmental data. The GG ordering suffix typically denotes lead-free ball finish, but this must be verified with Microchip documentation before treating it as evidence of RoHS compliance.
