A3PE1500-2FGG484I - 1.5M-Gate Flash FPGA 484-FBGA | Microchip
MPN： A3PE1500-2FGG484I ✓ 啟用中A3PE1500-2FGG484I 概覽
A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip flash memory rather than an external configuration ROM or volatile SRAM. In the programmable-logic hierarchy, the ProASIC3E family sits under the FPGA umbrella alongside SRAM-FPGA and antifuse alternatives, offering single-chip operation, live-at-power-up (Level 0) behavior, and reprogrammability without a boot device.
Key features include a nonvolatile flash fabric that eliminates external configuration flash, low total cost of ownership as an ASIC replacement, support for optional soft ARM processors, and secure ISP programming. The flash cells are inherently resistant to configuration readback and single-event upsets compared with SRAM FPGAs, an advantage in avionics and industrial systems.
Technically, the device integrates flash-based logic elements, embedded 4,608-bit true dual-port SRAM blocks totaling 504 kbits, and flexible I/O banks operating at 1.5V core supply with wide-select I/O standards. Maximum system performance reaches approximately 310 MHz, and the architecture supports PCIe-compatible and other high-speed interfaces through soft IP.
Typical applications include ASIC prototyping and replacement in consumer, networking/communications, computing, industrial control, and avionics markets, where single-chip, instantly-on programmable logic is valued.
Design consideration: I/O banking rules and power supply sequencing for the multiple VCC/VMV domains must be planned early, since the 484-FBGA pinout fixes bank assignments at layout time.
This page synthesizes distributor pricing, drop-in alternatives, design notes, and FAQs not found in the manufacturer datasheet, as of 2026-09-02.
直接替換替代品，適用於 A3PE1500-2FGG484I — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： A3PE1500-2FGG484I （相同外形與佔位） — 差異在於 Family, System Gates, Package, Operating Temperature, Process Technology.
A3PE1500-2FGG484Y
✅ 直接替換📋 參考替代品（不在目錄中）
A3PE1500-FGG484I
✅ 直接替換📋 參考替代品（不在目錄中）
A3PE1500-2FG484I
✅ 直接替換📋 參考替代品（不在目錄中）
A3PE3000-2FGG484I
✅ 直接替換聯絡詢價
查看資料表 →M1AFS1500-2FGG484I
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →A3PE3000L-1FGG484I
✅ 直接替換 ⚠️ 規格未經驗證聯絡詢價
查看資料表 →A3PE1500-2FGG484I 最大額定值與電氣特性
| Family | ProASIC3E Flash FPGA |
| System Gates | 1500000 |
| Logic Cells | 38400 |
| User I/O | 280 |
| Embedded SRAM | 504 kbits true dual-port |
| Core Supply Voltage | 1.5 V |
| Process Technology | 130 nm, 7-layer metal (6 copper), flash-based CMOS |
| Maximum System Performance | 310 MHz |
| Configuration Memory | On-chip flash, nonvolatile, live at power-up (Level 0) |
| Soft CPU Support | Optional soft ARM support |
| 封裝 | 484-ball FBGA, 1 mm pitch |
| 安裝類型 | Surface Mount |
| Logic Family | CMOS |
| Grade / Temperature Suffix | I (Industrial) |
| Speed Grade | -2 |
A3PE1500-2FGG484I 484-ball fbga, 1 mm pitch 腳位配置指南
A3PE1500-2FGG484I（484-ball fbga, 1 mm pitch 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： A3PE1500-2FGG484I.
請參閱 資料表 以查看完整腳位配置。
典型應用
A3PE1500-2FGG484I 適用於 6 應用s: ASIC Replacement and Prototyping, Networking and Communications Equipment, Avionics and Defense Electronics, Industrial Automation and Motor Control, Medical Instrumentation, Test and Measurement Equipment.
ASIC Replacement and Prototyping
Microchip positions ProASIC3E explicitly as a cost-effective ASIC replacement in the family datasheet. The A3PE1500-2FGG484I provides 1.5 million system gates and 38,400 logic cells in a single nonvolatile chip, eliminating mask costs and NRE for volumes where an ASIC cannot be justified. Its on-chip flash configuration removes the external boot device that SRAM FPGAs require, and the instant-on live-at-power-up Level 0 behavior replicates ASIC power-up timing. Designers prototype RTL in the flash fabric, then ship the same part in production, avoiding costly last-minute conversions and second sources across consumer, computing, and industrial programs.
推薦
Networking and Communications Equipment
Line cards, aggregation switches, and backplane interface logic benefit from the A3PE1500-2FGG484I's approximately 310 MHz system performance, 280 user I/O for wide parallel data paths, and 504 kbits of true dual-port SRAM for FIFOs and buffering between clock domains. The flash fabric powers up functional before host processors complete initialization, allowing the FPGA to perform early board bring-up, I2C mux control, and hot-swap supervision. Because configuration is nonvolatile and resistant to readback, firmware-defined packet-processing logic gains a measure of IP protection unavailable on typical SRAM FPGAs, an advantage Microchip highlights for networking markets.
推薦
Avionics and Defense Electronics
The flash-based ProASIC3E architecture suits avionics modules where single-chip, instantly-on programmable logic reduces component count and configuration-upset exposure compared with SRAM FPGAs. The A3PE1500-2FGG484I's nonvolatile cells do not lose configuration on power cycling or radiated events in the way SRAM configuration cells can, and the 'I'-grade industrial device supports extended program environments. Typical roles include ARINC bus bridging, sensor interface aggregation, and safety-monitor glue logic, with 1.5M gates providing headroom for redundant channel implementations. Designers should still follow the program's required qualification and screening flow for flight hardware.
推薦
Industrial Automation and Motor Control
In industrial drives, PLC I/O modules, and machine-vision sensors, the A3PE1500-2FGG484I implements deterministic PWM generation, encoder decoding, and safety interlock logic with nanosecond-level latency that software controllers cannot match. The 280 user I/O connect dense sensor and actuator banks directly, while 504 kbits of dual-port SRAM buffer high-speed acquisition streams. Flash configuration means the logic is active the instant 24V backplane power arrives - before any embedded CPU boots - enabling safe default states on outputs. The single-chip design also simplifies conformal-coated industrial boards by removing the configuration flash and its reflow/inspection burden.
推薦
Medical Instrumentation
Diagnostic imaging front ends, patient-monitoring modules, and laboratory analyzers use the A3PE1500-2FGG484I to aggregate ADC data streams over its 280 user I/O and preprocess them in the 1.5M-gate fabric. The dual-port SRAM (504 kbits) supports ping-pong buffering between acquisition and USB/Ethernet transfer logic. Instant-on flash configuration lets the instrument present calibrated, safe analog front-end states at power-up - important for patient-connected equipment - while configuration readback resistance protects proprietary DSP pipelining IP. The single-chip approach also reduces board area in handheld and cart-based diagnostic units where every cubic centimeter counts.
推薦
Test and Measurement Equipment
Bench instruments, protocol analyzers, and automated test fixtures require reprogrammable logic that can be field-updated with new instrument personalities - exactly what the reprogrammable flash A3PE1500-2FGG484I delivers with secure ISP. Its approximately 310 MHz fabric performance handles high-speed pattern capture, while 280 user I/O map to dense channel cards for multi-lane testing. True dual-port SRAM implements time-stamped capture buffers, and nonvolatile configuration means the instrument is functional within milliseconds of mains power, meeting user expectations for instant readiness. Secure ISP programming also protects calibration algorithms stored in the logic design itself.
推薦
推薦產品摘要
工程參考資料，適用於 A3PE1500-2FGG484I — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | A3PE1500-2FGG484Y | A3PE1500-FGG484I | A3PE3000-2FGG484I | M1AFS1500-2FGG484I | A3PE3000L-1FGG484I |
|---|---|---|---|---|---|---|
| Package | 484-ball FBGA (1 mm pitch) | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same footprint | 484-ball FBGA - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 1,500,000 | 1,500,000 | 1,500,000 | 3,000,000 | 1,500,000 class | 3,000,000 |
| Speed Grade | -2 | -2 | -1 (slower) | -2 | -2 | -1 (slower) |
| Configuration | On-chip flash, nonvolatile | On-chip flash - same | On-chip flash - same | On-chip flash - same | On-chip flash + mixed-signal | On-chip flash, low power |
| Temperature Grade | I (Industrial) | Y grade designation | I (Industrial) | I (Industrial) | I (Industrial) | I (Industrial) |
主要差異化特點
- Nonvolatile flash fabric - no external configuration device (對比SRAM-based FPGAs (e.g., Xilinx Spartan class))
- Fastest stock speed grade in the A3PE1500 FG484 family (對比A3PE1500-FGG484I)
- 504 kbits of true dual-port SRAM (對比A3P1500 (base ProASIC3))
設計說明
Plan a multi-rail power tree: 1.5 V core plus per-bank I/O supplies. Unlike SRAM FPGAs, the flash-based ProASIC3E fabric has no configuration inrush current, so the core rail does not need a large surge-rated supply; size it for steady-state dynamic current at your clock rates. Sequence I/O bank voltages (VCC/VMV) before or together with the core per the Microchip ProASIC3E power guidelines, and decouple each bank locally with bulk plus 0.1 uF ceramics to minimize simultaneous-switching noise on the 484-FBGA grid.
The 484-ball, 1.0 mm pitch FBGA requires a fine-pitch stack-up: specify a minimum 4-layer PCB with dedicated ground planes, and use via-in-pad or dog-bone fanout per IPC-recommended BGA escape practices. Verify the exact ball map against the ProASIC3E datasheet pin tables before routing - bank assignment is fixed once the PCB is drawn, and I/O standards are constrained per bank. Plan escape routing for the 280 active user I/O; the remaining balls are power/ground/NC. For rework, define a local BGA reflow procedure early given the 1 mm pitch.
A common mistake is ordering a different grade or finish variant without checking drop-in compatibility: A3PE1500-2FGG484I, -2FG484I, -2FGG484Y, and A3PE1500-FGG484I share the same footprint but differ in speed grade or screening. A bitstream meeting timing at -2 may fail at -1 (A3PE1500-FGG484I), so re-run static timing when substituting grades. Also confirm FlashPoint/secure-ISP programming flow support in your programmer, and reserve JTAG/ISP header access on the board for field updates.
合規資訊
Compliance status not stated in the provided web data; confirm on the Microchip A3PE1500 product page environmental data. The GG ordering suffix typically denotes lead-free ball finish, but this must be verified with Microchip documentation before treating it as evidence of RoHS compliance.
