A3PE1500-2FGG484I - 1.5M-Gate Flash FPGA 484-FBGA | Microchip
MPN: A3PE1500-2FGG484I β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $262 | $2,620.00 |
| 100 | $238 | $23,800.00 |
| 500 | $214 | $107,000.00 |
| 1,000 | $195 | $195,000.00 |
Drop-in alternatives for A3PE1500-2FGG484I β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
A3PE1500-2FGG484Y
β Drop-Inπ Reference alternative (not in catalog)
A3PE1500-FGG484I
β Drop-Inπ Reference alternative (not in catalog)
A3PE1500-2FG484I
β Drop-Inπ Reference alternative (not in catalog)
A3PE3000-2FGG484I
β Drop-Inπ Reference alternative (not in catalog)
M1AFS1500-2FGG484I
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$201.11 / Unit
View Datasheet βA3PE3000L-1FGG484I
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$104.5 / Unit
View Datasheet βA3PE1500-2FGG484I Maximum Ratings & Electrical Characteristics
| Family | ProASIC3E Flash FPGA |
| System Gates | 1500000 |
| Logic Cells | 38400 |
| User I/O | 280 |
| Embedded SRAM | 504 kbits true dual-port |
| Core Supply Voltage | 1.5 V |
| Process Technology | 130 nm, 7-layer metal (6 copper), flash-based CMOS |
| Maximum System Performance | 310 MHz |
| Configuration Memory | On-chip flash, nonvolatile, live at power-up (Level 0) |
| Soft CPU Support | Optional soft ARM support |
| Package | 484-ball FBGA, 1 mm pitch |
| Mounting Type | Surface Mount |
| Logic Family | CMOS |
| Grade / Temperature Suffix | I (Industrial) |
| Speed Grade | -2 |
A3PE1500-2FGG484I 484-ball fbga, 1 mm pitch Pin Configuration Guide
Complete pinout information for A3PE1500-2FGG484I (484-ball fbga, 1 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE1500-2FGG484I.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3PE1500-2FGG484I is suitable for 6 applications: ASIC Replacement and Prototyping, Networking and Communications Equipment, Avionics and Defense Electronics, Industrial Automation and Motor Control, Medical Instrumentation, Test and Measurement Equipment.
ASIC Replacement and Prototyping
Microchip positions ProASIC3E explicitly as a cost-effective ASIC replacement in the family datasheet. The A3PE1500-2FGG484I provides 1.5 million system gates and 38,400 logic cells in a single nonvolatile chip, eliminating mask costs and NRE for volumes where an ASIC cannot be justified. Its on-chip flash configuration removes the external boot device that SRAM FPGAs require, and the instant-on live-at-power-up Level 0 behavior replicates ASIC power-up timing. Designers prototype RTL in the flash fabric, then ship the same part in production, avoiding costly last-minute conversions and second sources across consumer, computing, and industrial programs.
Recommended
Networking and Communications Equipment
Line cards, aggregation switches, and backplane interface logic benefit from the A3PE1500-2FGG484I's approximately 310 MHz system performance, 280 user I/O for wide parallel data paths, and 504 kbits of true dual-port SRAM for FIFOs and buffering between clock domains. The flash fabric powers up functional before host processors complete initialization, allowing the FPGA to perform early board bring-up, I2C mux control, and hot-swap supervision. Because configuration is nonvolatile and resistant to readback, firmware-defined packet-processing logic gains a measure of IP protection unavailable on typical SRAM FPGAs, an advantage Microchip highlights for networking markets.
Recommended
Avionics and Defense Electronics
The flash-based ProASIC3E architecture suits avionics modules where single-chip, instantly-on programmable logic reduces component count and configuration-upset exposure compared with SRAM FPGAs. The A3PE1500-2FGG484I's nonvolatile cells do not lose configuration on power cycling or radiated events in the way SRAM configuration cells can, and the 'I'-grade industrial device supports extended program environments. Typical roles include ARINC bus bridging, sensor interface aggregation, and safety-monitor glue logic, with 1.5M gates providing headroom for redundant channel implementations. Designers should still follow the program's required qualification and screening flow for flight hardware.
Recommended
Industrial Automation and Motor Control
In industrial drives, PLC I/O modules, and machine-vision sensors, the A3PE1500-2FGG484I implements deterministic PWM generation, encoder decoding, and safety interlock logic with nanosecond-level latency that software controllers cannot match. The 280 user I/O connect dense sensor and actuator banks directly, while 504 kbits of dual-port SRAM buffer high-speed acquisition streams. Flash configuration means the logic is active the instant 24V backplane power arrives - before any embedded CPU boots - enabling safe default states on outputs. The single-chip design also simplifies conformal-coated industrial boards by removing the configuration flash and its reflow/inspection burden.
Recommended
Medical Instrumentation
Diagnostic imaging front ends, patient-monitoring modules, and laboratory analyzers use the A3PE1500-2FGG484I to aggregate ADC data streams over its 280 user I/O and preprocess them in the 1.5M-gate fabric. The dual-port SRAM (504 kbits) supports ping-pong buffering between acquisition and USB/Ethernet transfer logic. Instant-on flash configuration lets the instrument present calibrated, safe analog front-end states at power-up - important for patient-connected equipment - while configuration readback resistance protects proprietary DSP pipelining IP. The single-chip approach also reduces board area in handheld and cart-based diagnostic units where every cubic centimeter counts.
Recommended
Test and Measurement Equipment
Bench instruments, protocol analyzers, and automated test fixtures require reprogrammable logic that can be field-updated with new instrument personalities - exactly what the reprogrammable flash A3PE1500-2FGG484I delivers with secure ISP. Its approximately 310 MHz fabric performance handles high-speed pattern capture, while 280 user I/O map to dense channel cards for multi-lane testing. True dual-port SRAM implements time-stamped capture buffers, and nonvolatile configuration means the instrument is functional within milliseconds of mains power, meeting user expectations for instant readiness. Secure ISP programming also protects calibration algorithms stored in the logic design itself.
Recommended
Recommended Products Summary
Engineering reference data for A3PE1500-2FGG484I β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3PE1500-2FGG484Y | A3PE1500-FGG484I | A3PE3000-2FGG484I | M1AFS1500-2FGG484I | A3PE3000L-1FGG484I |
|---|---|---|---|---|---|---|
| Package | 484-ball FBGA (1 mm pitch) | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same footprint | 484-ball FBGA - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 1,500,000 | 1,500,000 | 1,500,000 | 3,000,000 | 1,500,000 class | 3,000,000 |
| User I/O | 280 | 280 | 280 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Speed Grade | -2 | -2 | -1 (slower) | -2 | -2 | -1 (slower) |
| Embedded SRAM | 504 kbits dual-port | 504 kbits | 504 kbits | up to 504 kbits (family) | Fusion fabric SRAM [DATA_NEEDED] | up to 504 kbits (family) |
| Configuration | On-chip flash, nonvolatile | On-chip flash - same | On-chip flash - same | On-chip flash - same | On-chip flash + mixed-signal | On-chip flash, low power |
| Temperature Grade | I (Industrial) | Y grade designation | I (Industrial) | I (Industrial) | I (Industrial) | I (Industrial) |
Key Differentiators
- Nonvolatile flash fabric - no external configuration device (vs SRAM-based FPGAs (e.g., Xilinx Spartan class))
- Fastest stock speed grade in the A3PE1500 FG484 family (vs A3PE1500-FGG484I)
- 504 kbits of true dual-port SRAM (vs A3P1500 (base ProASIC3))
Design Notes
Plan a multi-rail power tree: 1.5 V core plus per-bank I/O supplies. Unlike SRAM FPGAs, the flash-based ProASIC3E fabric has no configuration inrush current, so the core rail does not need a large surge-rated supply; size it for steady-state dynamic current at your clock rates. Sequence I/O bank voltages (VCC/VMV) before or together with the core per the Microchip ProASIC3E power guidelines, and decouple each bank locally with bulk plus 0.1 uF ceramics to minimize simultaneous-switching noise on the 484-FBGA grid.
The 484-ball, 1.0 mm pitch FBGA requires a fine-pitch stack-up: specify a minimum 4-layer PCB with dedicated ground planes, and use via-in-pad or dog-bone fanout per IPC-recommended BGA escape practices. Verify the exact ball map against the ProASIC3E datasheet pin tables before routing - bank assignment is fixed once the PCB is drawn, and I/O standards are constrained per bank. Plan escape routing for the 280 active user I/O; the remaining balls are power/ground/NC. For rework, define a local BGA reflow procedure early given the 1 mm pitch.
A common mistake is ordering a different grade or finish variant without checking drop-in compatibility: A3PE1500-2FGG484I, -2FG484I, -2FGG484Y, and A3PE1500-FGG484I share the same footprint but differ in speed grade or screening. A bitstream meeting timing at -2 may fail at -1 (A3PE1500-FGG484I), so re-run static timing when substituting grades. Also confirm FlashPoint/secure-ISP programming flow support in your programmer, and reserve JTAG/ISP header access on the board for field updates.
Compliance Information
Compliance status not stated in the provided web data; confirm on the Microchip A3PE1500 product page environmental data. The GG ordering suffix typically denotes lead-free ball finish, but this must be verified with Microchip documentation before treating it as evidence of RoHS compliance.
