A3PE600-2FGG484 - 600K Gate ProASIC3E FPGA 484-BGA | Microchip
Référence : A3PE600-2FGG484 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $62.5 | $62,50 |
| 10 | $58.2 | $582,00 |
| 100 | $53.4 | $5 340,00 |
| 500 | $49.1 | $24 550,00 |
| 1 000 | $45.6 | $45 600,00 |
A3PE600-2FGG484 Présentation
A flash-based FPGA (Field-Programmable Gate Array) is a reprogrammable logic device that stores its configuration in non-volatile on-chip flash memory rather than an external configuration PROM. Within the programmable logic hierarchy (FPGA -> programmable logic device -> digital IC -> semiconductor), ProASIC3E devices differ from SRAM FPGAs by being single-chip, instantly-on, and inherently secure, since no bitstream is exposed at power-up.
Key features of the A3PE600 include non-volatile flash configuration (no external boot device required), 600K system gates, 270 versatile user I/Os supporting multiple single-ended and differential standards, embedded SRAM blocks for on-chip buffering, and low total cost of ownership through single-chip integration and reprogrammability. The 484-ball FBGA package supports surface-mount assembly with a 1.000 mm ball pitch.
Technically, the A3PE600 uses Microsemi's proven flash switch and 130nm seven-layer metal flash CMOS process. The VersaTile architecture allows each logic tile to be configured as a 3-input LUT, D-flip-flop, or memory element, delivering high logic utilization. The ProASIC3E variant adds embedded SRAM and supports bus-friendly interfaces typical of bridge and control applications.
Typical applications include industrial automation control, motor drive interface logic, communication bridge functions, aerospace sub-systems, test equipment, and secure single-chip control logic where instant-on behavior and configuration security matter.
For design-in, ensure the 1.5V core rail is within 1.425V to 1.575V under all load transients, and follow Microchip's power-up sequencing and decoupling guidance in the manufacturer datasheet.
This page synthesizes verified distributor data from DigiKey, Mouser, Octopart, and Microchip product pages with drop-in alternatives, comparison tables, and design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour A3PE600-2FGG484 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec A3PE600-2FGG484 (même facteur de forme et même empreinte) — différant par Configuration Memory, Package, Operating Temperature, Maximum System Frequency, Family.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
A3PE600-2FGG484I
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →A3PE600-FGG484
✅ Remplacement direct✓ En stock
$53.7 / unité
Voir la fiche technique →A3PE600-FGG484I
✅ Remplacement direct✓ En stock
$44.03 / unité
Voir la fiche technique →A3PE600-2FG484
✅ Remplacement direct✓ En stock
$83.27 / unité
Voir la fiche technique →A3PE600-2FG484I
✅ Remplacement direct✓ En stock
$79.9 / unité
Voir la fiche technique →A3PE600-1FGG484I
✅ Remplacement direct✓ En stock
$42.4 / unité
Voir la fiche technique →A3PE600-1FG484I
✅ Remplacement direct✓ En stock
$48.6 / unité
Voir la fiche technique →A3PE600-2FGG484 Valeurs maximales et caractéristiques électriques
| Family | ProASIC3E |
| Number of Gates | 600000 |
| Logic Elements (LEs) | 7K LEs |
| User I/O | 270 |
| Configuration Bits | 110592 |
| Speed Grade | -2 |
| Maximum System Performance | 310 MHz |
| Technology | 130 nm flash CMOS |
| Supply Voltage (Core) | 1.425 V to 1.575 V |
| Configuration Memory | Non-volatile flash, single-chip |
| Température de fonctionnement | 0C to +85C (TJ) |
| Boîtier | 484-FPBGA (23x23 mm), 1.000 mm pitch |
| Type de montage | Surface Mount |
| Packaging | Tray |
| Statut RoHS | RoHS3 Compliant, Lead Free |
| Manufacturer Lead Time | 8 weeks |
| Product Status | Active |
Guide de configuration des broches du A3PE600-2FGG484 484-fpbga (23x23 mm), 1.000 mm pitch
Configuration des broches du A3PE600-2FGG484 (boîtier 484-fpbga (23x23 mm), 1.000 mm pitch). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour A3PE600-2FGG484.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
A3PE600-2FGG484 convient pour 6 applications: Industrial Automation Control, Communication Bridge and Interface Logic, Aerospace and Defense Subsystems, Test and Measurement Equipment, Motor Drive and Power Control Interface, Secure Single-Chip Embedded Control.
Industrial Automation Control
The A3PE600-2FGG484 fits industrial automation controllers where instant-on, deterministic start-up and configuration integrity are required. Its 600K gates and 270 user I/Os integrate PLC I/O handling, encoder interfaces, and fieldbus glue logic in a single 484-ball FBGA device, reducing BOM count versus an SRAM FPGA plus boot flash. Operating from a 1.5V core at 1.425V-1.575V, it supports the typical backplane 3.3V/2.5V I/O standards across its banks, and the -2 speed grade (up to 310 MHz) provides timing headroom for pipelined control state machines. Because configuration is stored in on-chip flash, machines power up with valid logic within microseconds, and field firmware updates can be performed via JTAG without socketing the device.
Recommandé
Communication Bridge and Interface Logic
In networking and telecom line cards, the A3PE600-2FGG484 serves as a protocol bridge between processors, PHYs, and backplane connectors. Its 270 I/Os support common single-ended and differential standards, letting one device implement bus-width conversion, register translation, and handshaking that would otherwise need several CPLDs. The embedded SRAM blocks in the ProASIC3E variant buffer packet fragments during rate adaptation, while the -2 speed grade supports clock-domain crossing logic at hundreds of MHz per distributor data. Flash configuration eliminates the boot-latency and bitstream-pull attack surface of SRAM FPGAs, which matters in carrier equipment subject to integrity requirements. Place on 1.5V core with bank-appropriate I/O voltages for 3.3V and 2.5V backplane domains.
Recommandé
Aerospace and Defense Subsystems
ProASIC3E flash FPGAs are widely deployed in aerospace subsystem payloads because the single-chip flash fabric avoids configuration readout at power-up and tolerates the benign radiation environment of many LEO missions when derated appropriately. The A3PE600-2FGG484 provides 600K gates for sensor interface formatting, telemetry glue logic, and redundancy-control state machines, with 270 I/Os to reach spacecraft backplanes and payload boards. Designers should select the industrial or military temperature variant and apply Microchip/Microsemi hi-rel screening guidance; the same fabric is the basis of the RTAX radiation-tolerant family (see related RTAX250S/RTAX2000 devices). Instant-on behavior ensures control logic is live before processors complete boot, a key requirement for power-switch and safe-mode circuits.
Recommandé
Test and Measurement Equipment
Bench and automated test instruments use the A3PE600-2FGG484 as timing, trigger, and channel-formatting logic. The -2 speed grade sustains state machines and counter chains at hundreds of megahertz, while 270 flexible I/Os connect to front-end comparators, relays, and digitizer front ends across multiple voltage domains thanks to per-bank I/O supply flexibility. The flash configuration means instruments are ready the instant power is applied - no configuration download delay before front-panel operation - and firmware can be field-updated via JTAG during calibration service. The 484-ball 23x23 mm FBGA suits the dense multilayer boards typical of instrument mainframes, with the 1.000 mm ball pitch easing rework compared with finer-pitch BGA alternatives.
Recommandé
Motor Drive and Power Control Interface
In variable-frequency drives and power converters, the A3PE600-2FGG484 implements PWM distribution, dead-time generation, gate-driver interlock, and protective trip logic. Deterministic flash-based start-up ensures interlocks are active before the MCU releases the drive, improving functional-safety margins. The 600K-gate fabric absorbs quadrature-encoder decoding, position interpolation, and fault latching, while 270 I/Os interface 3.3V/2.5V/1.8V domains for current-sense ADCs and gate drivers. The -2 speed grade allows fine PWM resolution even at high carrier frequencies (for example, 15-bit counters at hundreds of MHz per distributor data). Place the device on the controller board away from power stages, honoring the 1.425V-1.575V core tolerance with local bulk decoupling.
Recommandé
Secure Single-Chip Embedded Control
For embedded systems where configuration IP must be protected, the A3PE600-2FGG484's on-chip flash keeps the bitstream non-volatile and unread at power-up - unlike SRAM FPGAs whose configuration is shifted in from external memory where it can be intercepted. The 600K gates host the full control plane: secure boot assist, tamper-response state machines, and peripheral interfaces across the 270 I/O banks. Single-chip operation removes the external configuration PROM from the BOM, shrinking board area and removing a counterfeit-component vector. The 484-ball FBGA with 1.000 mm pitch supports standard SMT assembly and JTAG in-system reprogramming for authenticated field updates. Designs requiring wider environmental margin should use the -I industrial variant of the same die.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour A3PE600-2FGG484 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | A3PE600-2FGG484I | A3PE600-FGG484 | A3PE600-2FG484 | A3PE600-1FGG484I |
|---|---|---|---|---|---|
| Package | 484-FPBGA (23x23 mm) | 484-FPBGA (23x23 mm) - same | 484-FPBGA (23x23 mm) - same | 484-BGA (FG484) - same footprint | 484-FPBGA (23x23 mm) - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600000 | 600000 | 600000 | 600000 | 600000 |
| Speed Grade | -2 (up to 310 MHz) | -2 (up to 310 MHz) | Standard (~231 MHz) | -2 (up to 310 MHz) | -1 |
| User I/O | 270 | 270 | 270 | 270 | 270 |
| Operating Temperature | 0C to +85C (TJ) | -40C to +100C (TJ), industrial | 0C to +85C (TJ) | 0C to +85C (TJ) | -40C to +100C (TJ), industrial |
| Core Supply Voltage | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V |
| RoHS Status | RoHS3 Compliant | RoHS Compliant | RoHS Compliant | RoHS Compliant | RoHS Compliant |
Principaux différenciateurs
- Fastest commercial speed grade in the 484-ball family (vs A3PE600-FGG484)
- Non-volatile flash configuration, single-chip (vs SRAM FPGAs (Xilinx/Intel, functional alternatives only))
- Extended-temperature drop-in available (vs A3PE600-2FGG484I)
Notes de conception
Keep the 1.5V core rail within 1.425V-1.575V under all transients - the flash fabric is sensitive to brown-out during configuration reads. Size the core regulator for the datasheet's worst-case ICC at your clock rate, and provision bulk capacitance plus local 0.1 uF ceramics at each supply pin group per the Microchip ProASIC3E datasheet decoupling table. Sequence I/O bank supplies per the documented power-up order; per-bank voltages depend on the I/O standards you assign in Libero SoC, so confirm bank assignments before finalizing the power tree.
The 484-ball FBGA at 1.000 mm pitch is reworkable but requires an accurate land pattern per the Microchip package drawing and a well-designed escape fanout (typically dog-bone vias on 0.8 mm+ grid channels). Place JTAG (TDI/TMS/TCK/TDO) header and FlashPro programming connector during first layout even if production programming is planned via gang programmer - retrofitting a test point later on a dense board is costly. Reserve at least one spare user I/O routed to a header for debug.
Do not substitute speed grades without re-running static timing analysis: migrating a design from A3PE600-2FGG484 (-2, ~310 MHz) to standard grade (~231 MHz) or -1 grade commonly breaks timing closure on wide counters and pipelined datapaths. Also confirm the temperature suffix for your environment - the commercial 0C to +85C part is unsuitable for -40C industrial enclosures; use the -I variants. Finally, verify configuration security settings in Libero (FlashLock) if bitstream protection matters.
Informations de conformité
RoHS3 Compliant and lead free per Microchip USA product page. REACH, halogen-free, and conflict-minerals declarations not stated in verified data - request from Microchip. Not advertised as AEC-Q100 qualified in verified data.
