A3PE600-1FG484I - 600K-Gate Flash FPGA, 270 I/O | Microchip
Référence : A3PE600-1FG484I ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $68.5 | $68,50 |
| 10 | $62.3 | $623,00 |
| 100 | $56.8 | $5 680,00 |
| 500 | $52.1 | $26 050,00 |
| 1 000 | $48.6 | $48 600,00 |
A3PE600-1FG484I Présentation
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a fabric of configurable logic blocks, routing resources, and I/O cells that the designer programs after manufacturing. The ProASIC3E family belongs to the nonvolatile flash FPGA class within the broader FPGA -> programmable logic -> digital IC hierarchy, meaning configuration data is stored on-chip in flash cells rather than an external configuration PROM.
Key features include Live-at-Power-Up (Level 0) operation for single-chip solutions, true dual-port SRAM of up to 504 kbits across the family, and a 130-nm, 7-layer metal (6 copper) flash-based CMOS process. The -1 speed grade supports system performance up to 231 MHz, and the industrial-grade -I suffix supports extended temperature operation for harsh environments.
Architecturally, the A3PE600 uses VersaTiles - fine-grained logic modules that implement both combinational and sequential functions - plus embedded block RAM and flash-based switch routing that eliminates the configuration time and volatility of SRAM FPGAs. The E variant of ProASIC3 adds a higher effective system-gate density and abundant embedded memory versus base ProASIC3.
Typical applications include industrial automation controllers, communications and networking line cards, medical instrumentation, aerospace/defense systems requiring instant-on operation, and test equipment glue-logic consolidation.
A key design consideration: the FBGA-484 footprint requires careful PCB escape routing at 1.0 mm pitch, and core supply (1.5 V) versus I/O bank supplies must be decoupled per the Microchip power guidelines in the manufacturer datasheet.
This page synthesizes distributor pricing, drop-in same-footprint alternatives, practical design notes, and comparison data not consolidated in the manufacturer datasheet.
Alternatives de remplacement direct pour A3PE600-1FG484I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec A3PE600-1FG484I (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Configuration Memory, RoHS Status, Speed Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
A3PE600-FG484I
✅ Remplacement direct✓ En stock
$86.1 / unité
Voir la fiche technique →A3PE600-1FGG484I
✅ Remplacement direct✓ En stock
$42.4 / unité
Voir la fiche technique →A3PE600-FGG484I
✅ Remplacement direct✓ En stock
$44.03 / unité
Voir la fiche technique →A3PE600-2FG484I
✅ Remplacement direct✓ En stock
$79.9 / unité
Voir la fiche technique →A3PE600-2FGG484I
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →A3PE600-1FG484
✅ Remplacement direct✓ En stock
$48.1 / unité
Voir la fiche technique →A3PE600-1FG484I Valeurs maximales et caractéristiques électriques
| Family | ProASIC3E |
| System Gates | 600000 |
| Logic Cells (CLBs) | 13824 |
| User I/O | 270 |
| Speed Grade | -1 |
| Maximum System Frequency | 231 MHz |
| Core Supply Voltage | 1.5 V |
| Process Technology | 130 nm, 7-layer metal (6 copper), flash-based CMOS |
| Configuration Memory | Flash-based (nonvolatile, Live-at-Power-Up Level 0) |
| Embedded Memory (family max) | Up to 504 kbits True Dual-Port SRAM |
| Boîtier | 484-ball FBGA (PBGA484), 1.0 mm pitch |
| Package Dimensions | 23 x 23 mm, 2.23 mm height |
| Logic Family | CMOS |
| Type de montage | Surface Mount |
| Single-Chip Solution | Yes (no external configuration device required) |
Guide de configuration des broches du A3PE600-1FG484I 23 x 23 mm, 2.23 mm height
Configuration des broches du A3PE600-1FG484I (boîtier 23 x 23 mm, 2.23 mm height). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour A3PE600-1FG484I.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
A3PE600-1FG484I convient pour 6 applications: Industrial Automation Controllers, Communications and Networking Line Cards, Medical Instrumentation, Aerospace and Defense Systems, Test and Measurement Equipment, Battery-Powered and Handheld Systems.
Industrial Automation Controllers
The A3PE600-1FG484I fits industrial automation controllers because its nonvolatile flash fabric powers up live (Level 0) with zero configuration delay - critical for machines that must resume deterministic operation immediately after power cycles. With 600K system gates, 13,824 logic cells, and 270 user I/Os, it consolidates motor-interface glue logic, encoder decoding, and fieldbus interfaces into one chip. The industrial -I temperature rating covers harsh factory-floor environments, and the 1.5 V core keeps power consumption manageable in sealed enclosures. Used between sensor terminals and a host CPU, the FPGA offloads real-time PWM generation and pulse counting; unlike SRAM FPGAs it needs no boot PROM, removing one failure point and roughly 100 ms of startup latency.
Recommandé
Communications and Networking Line Cards
The A3PE600-1FG484I suits communications and networking line cards where moderate gate density and abundant I/O outweigh raw fabric speed. The 270 user I/Os in the 484-ball FBGA support parallel PHY interfaces, backplane signaling, and status aggregation, while up to 504 kbits of true dual-port SRAM (family capability) implements FIFOs and packet buffers. The -1 speed grade supports system performance up to 231 MHz, adequate for many framing and bridging functions, and the single-chip flash solution simplifies hot-swap power sequencing. Placed between MAC/PHY devices and a control CPU, it manages register access and data path muxing; the trade-off versus SRAM FPGAs is lower top-end fabric speed, so use the -2 grade variant for sub-5 ns critical paths.
Recommandé
Medical Instrumentation
The A3PE600-1FG484I is a strong fit for medical instrumentation such as patient monitors, diagnostic analyzers, and imaging front ends, where instant-on behavior and deterministic logic improve both safety and user experience. Flash-based configuration means the logic is active the moment power is applied - essential for safety interlocks and front-end calibration circuits that must be operational before a host processor boots. The 600K-gate fabric with 270 I/Os integrates sensor-interface state machines, ADC sequencing, and display-control glue logic, while the true dual-port SRAM buffers sample streams. In a typical design it sits between analog front-end converters and an embedded CPU; the nonvolatile fabric also resists single-event configuration upset, improving long-term reliability in always-on monitoring equipment.
Recommandé
Aerospace and Defense Systems
The A3PE600-1FG484I fits aerospace and defense applications because the ProASIC3E flash fabric offers inherent single-event upset immunity at the configuration level - unlike SRAM FPGAs, whose configuration must be continuously scrubbed. Live-at-Power-Up operation supports immediate radar-trigger, telemetry, and weapon-system arming logic on power application without boot delay. The 600K-gate capacity with 270 I/Os handles interface bridging, protocol translation, and redundancy voting logic, and the industrial -I grade tolerates extended environments. Deployed between mission computers and sensor payloads, it provides trusted single-chip logic with no external configuration memory to corrupt or intercept; designers should verify microelectronics sourcing and screening requirements with their program office beyond the standard flow.
Recommandé
Test and Measurement Equipment
The A3PE600-1FG484I serves test and measurement equipment such as bench instruments, data-acquisition chassis, and protocol analyzers, where reprogrammability, instant-on logic, and rich I/O are decisive. The flash fabric permits field updates of stimulus/response logic without external programming hardware at the customer site, and 270 user I/Os handle multi-channel trigger lines, bus sniffing interfaces, and instrument backplanes. Up to 504 kbits of true dual-port SRAM supports capture buffers and pattern generators, while the 231 MHz -1 timing envelope covers most counter and formatter functions. Integrated between analog capture circuitry and a host controller, it timestamp-stamps events deterministically; the FBGA-484's 1.0 mm pitch enables dense multilayer routing in portable instruments where board area is constrained.
Recommandé
Battery-Powered and Handheld Systems
The A3PE600-1FG484I is attractive for battery-powered and handheld systems that need programmable logic without the standby cost of an external configuration flash re-reading cycle. The flash fabric is nonvolatile, so the device can reside in a low-leakage state and resume instantly, and the single-chip solution saves board area and BOM versus SRAM FPGA plus PROM combinations. The compact 23 x 23 mm FBGA-484 with 1.0 mm pitch fits dense portable layouts while still exposing 270 user I/Os for keypads, displays, and sensor buses. Placed as a co-processor beside a low-power MCU, it accelerates fixed-function datapaths; the trade-off is the 1.5 V core supply requirement, so designers should budget an efficient point-of-load regulator and verify power-down sequencing per the Microchip power application notes.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour A3PE600-1FG484I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | A3PE600-FG484I | A3PE600-1FGG484I | A3PE600-2FG484I | A3PE600-1FG484 |
|---|---|---|---|---|---|
| Package | FBGA-484 (1.0 mm pitch, 23 x 23 mm) | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600000 | 600000 | 600000 | 600000 | 600000 |
| User I/O | 270 | 270 | 270 | 270 | 270 |
| Speed Grade | -1 (up to 231 MHz) | default grade | -1 | -2 (faster) | -1 |
| Temperature Grade | Industrial (-I) | Industrial (-I) | Industrial (-I) | Industrial (-I) | Commercial |
| Configuration Memory | On-chip flash (single-chip, Live-at-Power-Up) | On-chip flash | On-chip flash | On-chip flash | On-chip flash |
Principaux différenciateurs
- Nonvolatile flash fabric - true single-chip solution (vs SRAM-based FPGAs (Xilinx/Altera equivalents))
- Faster timing margin option within same footprint (vs A3PE600-2FG484I)
- Industrial temperature rating at this density (vs A3PE600-1FG484)
Notes de conception
The A3PE600-1FG484I requires a 1.5 V core supply with separate I/O bank supplies. Provide independent, sequenced rails and follow the Microchip ProASIC3E power-up requirements: core voltage must reach its operating window before or with the I/O banks to avoid latch-up risk during configuration. Estimated: at 600K gates with moderate toggling activity, core current typically ranges in the tens-to-low-hundreds of milliamps - perform a Libero power analysis for your specific design before sizing the point-of-load regulator. Place bulk 10 uF plus 0.1 uF decoupling at each VCC/VCCI pin group.
The 1.0 mm-pitch FBGA-484 requires via-in-pad or dog-bone escape routing; a 4-layer board minimum is recommended, with dedicated inner layers for the 1.5 V core plane and a solid ground plane directly under the die for return-current integrity. Assign I/O banks before routing so bank voltage domains (VCCI) group compatible I/O standards together - mixed-standard placement across bank boundaries is a common re-spin cause. Follow Microchip's ProASIC3E PCB layout application notes for ball-map breakout patterns.
Do not assume timing closure portability: a design that closed on the -1 grade will likely close on the -2 grade (A3PE600-2FG484I drop-in), but designs migrated from other packages or grades must be re-implemented and re-verified in Libero SoC. Also confirm the temperature suffix against your environment - the commercial A3PE600-1FG484 is NOT a substitute for the industrial -I part in extended-temperature deployments, even though it is pin-identical.
Informations de conformité
FindIC describes the A3PE600-FG484 family packaging as GREEN, and FGG variants denote green/lead-free packaging; verify the exact A3PE600-1FG484I material declaration on the Microchip compliance portal before regulatory sign-off.
