A3PE600-FGG484I - 600K-Gate ProASIC3E Flash FPGA | Microchip
Référence : A3PE600-FGG484I ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $68.5 | $68,50 |
| 10 | $61.65 | $616,50 |
| 100 | $54.8 | $5 480,00 |
| 500 | $49.32 | $24 660,00 |
| 1 000 | $44.03 | $44 030,00 |
A3PE600-FGG484I Présentation
A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip nonvolatile flash memory rather than an external configuration device or volatile SRAM. Within the programmable logic hierarchy, the A3PE600 sits in the low-to-mid density tier of the ProASIC3E family, positioned between smaller ProASIC3 devices and higher-density A3PE1500/A3PE3000 parts, all of which belong to the broader category of power management-friendly, single-chip programmable logic ICs.
Key features include nonvolatile flash programming that makes the device Instant On and removes the external boot flash, reprogrammability without a configuration PROM, single-chip operation that reduces BOM cost and board area, and flash-based security that resists cloning and bitstream extraction. The FGG484 package exposes up to 270 user I/Os supporting voltage-referenced standards with one VREF pin per I/O minibank.
Technically, the A3PE600 uses a 1.5V core CMOS fabric built from 13,824 VersaTiles, with system-level performance up to 350 MHz. The ProASIC3E generation adds embedded memory blocks and PLL support beyond the earlier ProASICPLUS family, delivering ASIC-like unit cost with FPGA time-to-market benefits. The fabric is backed by Microchip's Libero SoC design suite.
Typical applications include industrial automation controllers, aerospace and defense subsystems requiring single-chip instant-on logic, medical instrumentation glue logic, and secure communication bridges where a nonvolatile, low-power FPGA is preferred over SRAM-based alternatives.
Designers should note that FG256 and FG484 packages are footprint-compatible, so designs can migrate densities within the family; however, voltage-referenced I/O standards require one VREF assignment per minibank, which constrains pin planning in dense designs.
This page synthesizes distributor pricing, drop-in speed-grade and packaging alternatives, and practical design guidance not found in the manufacturer datasheet alone. Pricing reflects distributor data as of 2026-09-02.
Alternatives de remplacement direct pour A3PE600-FGG484I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec A3PE600-FGG484I (même facteur de forme et même empreinte) — différant par Package, Configuration Memory, Operating Temperature, RoHS Status, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
A3PE600-2FGG484I
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →A3PE600-1FGG484IY
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
A3PE600-FG484I
✅ Remplacement direct✓ En stock
$86.1 / unité
Voir la fiche technique →A3PE600-1FGG484
✅ Remplacement direct✓ En stock
$44.9 / unité
Voir la fiche technique →A3PE600-2FGG484
✅ Remplacement direct✓ En stock
$45.6 / unité
Voir la fiche technique →A3PE600-FGG484
✅ Remplacement direct✓ En stock
$53.7 / unité
Voir la fiche technique →A3PE600-FGG484I Valeurs maximales et caractéristiques électriques
| Logic Cells | 13824 cells |
| CLBs | 13824 |
| System Gates | 600000 |
| Maximum Frequency | 350 MHz |
| User I/Os | 270 |
| Embedded Flash Memory | 110592 bits |
| Technology | CMOS, flash-based nonvolatile |
| Family | ProASIC3E |
| Boîtier | FBGA-484 (PBGA484), green |
| Package Dimensions | 23 x 23 mm, 2.23 mm height, 1.0 mm ball pitch |
| Type de montage | Surface Mount (BGA) |
| Terminal Form | Ball |
| Number of Terminals | 484 |
| Température de fonctionnement | -40C to +85C (Industrial) |
| Configuration Memory | On-chip flash (Instant On, single chip) |
| Statut RoHS | Compliant (green package per Jotrin) |
Guide de configuration des broches du A3PE600-FGG484I 23 x 23 mm, 2.23 mm height, 1.0 mm ball pitch
Configuration des broches du A3PE600-FGG484I (boîtier 23 x 23 mm, 2.23 mm height, 1.0 mm ball pitch). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour A3PE600-FGG484I.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
A3PE600-FGG484I convient pour 6 applications: Industrial Automation Controllers, Aerospace and Defense Subsystems, Medical Instrumentation, Secure Communication Bridges, Test and Measurement Equipment, IoT Edge Gateways and Smart Sensors.
Industrial Automation Controllers
The A3PE600-FGG484I fits industrial automation because its 600k gates and 13,824 CLBs absorb motor-control state machines, fieldbus interfaces, and safety interlock logic in one nonvolatile device. Its -40C to +85C industrial rating and 270 user I/Os allow direct interfacing with 3.3V/2.5V sensors, encoders, and communication PHYs without glue logic. Because the flash fabric is Instant On, controller logic is active within microseconds of power-up - critical for deterministic machine startup and fail-safe watchdog designs. Compared with an SRAM FPGA plus boot flash, the single-chip solution reduces BOM count, board area, and configuration-failure modes on the factory floor. Place the part on a solid 1.5V core / 2.5V or 3.3V I/O rail plan with one bulk capacitor per rail pair, and use the 350 MHz fabric headroom for future functional upgrades via Libero recompilation.
Recommandé
Aerospace and Defense Subsystems
Aerospace and defense programs choose the A3PE600-FGG484I because flash-based configuration eliminates the external bitstream storage that dominates SRAM-FPGA threat surfaces, providing single-chip Instant On logic for payload processors, telemetry interfaces, and secure boot bridges. The industrial -40C to +85C grade and availability of the Y-qualified A3PE600-1FGG484IY variant support high-reliability procurement with traceability, which distributors such as FPGAX specifically provide for this MPN. With 270 I/Os and 350 MHz fabric performance, the device implements radiation-tolerant system wrappers, bus bridges (MIL-STD-1553-style framing, UART/SPI/parallel), and sensor aggregation. Designers should apply conservative timing derating at the standard speed grade, lock I/O assignments early due to VREF minibank constraints, and use Libero secure design flows to prevent design extraction from the programmed flash.
Recommandé
Medical Instrumentation
Medical diagnostic and monitoring equipment benefits from the A3PE600-FGG484I's deterministic Instant On behavior and low-power flash fabric. Its 13,824 logic cells handle sensor front-end sequencing, ADC framing, and display-interface glue logic, while 270 I/Os connect analog front ends, isolation barriers, and communication modules (USB, Ethernet PHY, CAN). Because the device configures from internal flash, patient-facing instruments power up into a known-safe state without boot delays or configuration readback failures - valuable for devices cycling power between examinations. The green RoHS-compliant FBGA-484 package supports standard SMT assembly for medical contract manufacturers. Designers should partition noise-sensitive analog support logic away from clock domains using the fabric's modular floorplanning in Libero, and verify industrial temperature compliance for sterilization-adjacent operating environments.
Recommandé
Secure Communication Bridges
The A3PE600-FGG484I is well suited to secure protocol bridges, translating between legacy fieldbuses and modern Ethernet or serial links at up to 350 MHz internal clock rates. Flash-based security is the headline fit: Microchip's ProASIC3E flash fabric resists bitstream readback and cloning, so proprietary bridge logic remains protected without an external security IC. The 600k-gate fabric accommodates dual MAC-like framing engines, FIFO structures in fabric registers, and CRC/parity engines, while 270 I/Os support wide parallel buses to host CPUs plus multiple serial PHYs. Because the design is nonvolatile and single-chip, boards can be conformally coated and sealed for harsh environments without exposing a configuration device. Apply conservative decoupling (multiple 0.1uF ceramics per I/O bank plus bulk capacitance) and review I/O minibank VREF assignments early, as voltage-referenced standards consume one pin per minibank.
Recommandé
Test and Measurement Equipment
Bench and automated test instruments use the A3PE600-FGG484I as the digital backbone for trigger logic, pattern generation, and timing capture. The 350 MHz fabric performance and 13,824 VersaTiles implement high-resolution event counters and delay generators, while 270 I/Os drive multi-channel digital pins, relay matrices, and front-panel interfaces. Instant On flash configuration means instruments are ready the moment power is applied - important for rack systems switched by master power sequencing. Compared with SRAM FPGAs, the single-chip design simplifies calibration records since the logic image is fixed in flash and cannot be corrupted by a failed configuration load. Designers should exploit footprint compatibility to FG484 and FG256 family packages when planning cost-reduced variants, and allocate PLL resources for clock multiplication from a low-jitter reference oscillator.
Recommandé
IoT Edge Gateways and Smart Sensors
Edge gateways benefit from the A3PE600-FGG484I's combination of low static power flash fabric, 270 flexible I/Os, and security-resistant configuration. The device aggregates multiple sensor buses (SPI, I2C-style, UART, parallel) into a single deterministic interface toward a host MCU or wireless module, pre-processing data in the 600k-gate fabric to offload the host. Instant On behavior enables battery-backed or energy-harvesting nodes to become operational immediately, and the single-chip nonvolatile design removes the boot-flash attack surface in deployed IoT hardware. The industrial temperature grade covers unconditioned outdoor enclosures. Power planning matters: budget the 1.5V core rail and use Libero power-analysis to exploit the fabric's low static draw, keeping gateways within passive-cooling thermal budgets in sealed enclosures.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour A3PE600-FGG484I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | A3PE600-2FGG484I | A3PE600-1FGG484IY | A3PE600-FG484I | A3PE600-1FGG484 |
|---|---|---|---|---|---|
| Package | FBGA-484 (23 x 23 mm, 1.0 mm pitch) | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 |
| Logic Cells / CLBs | 13,824 | 13,824 | 13,824 | 13,824 | 13,824 |
| Speed Grade | Standard | -2 (faster) | -1 | Standard | -1 |
| User I/Os | 270 | 270 | 270 | 270 | 270 |
| Configuration Technology | On-chip flash (Instant On) | On-chip flash | On-chip flash | On-chip flash | On-chip flash |
Principaux différenciateurs
- Instant On nonvolatile flash configuration (vs SRAM-based FPGAs (e.g., external-config parts))
- Faster timing margin available without PCB change (vs A3PE600-FG484I (standard grade))
- High-reliability procurement path (vs A3PE600-FGG484 (commercial temp))
Notes de conception
For the FBGA-484 (1.0 mm pitch, 23 x 23 mm), plan a via-in-pad or dog-bone escape strategy on 4+ layer stackups; 0.5 mm via capture pads with 0.25 mm microvias keep inner routing channels open. Reserve one I/O per minibank as VREF when using voltage-referenced standards, as the ProASIC3E datasheet requires. Verify the ball map against the datasheet tables (document 50003270B) rather than third-party summaries before releasing the footprint.
Budget three rails: 1.5V core, plus I/O bank voltages (typically 3.3V/2.5V). Estimated decoupling: at least one 0.1uF ceramic per supply ball pair plus 10uF bulk per rail and 47uF bulk at the regulator. Estimated: core current scales with toggle rate and utilized CLBs; use Microchip Libero power analysis with your actual design utilization (600k gates / 13,824 CLBs) to size the 1.5V regulator rather than assuming worst-case datasheet values.
Do not mix speed grades in a single design without re-running timing in Libero: substituting the slower standard grade for an -2 build invalidates prior timing closure. Also confirm the temperature suffix on incoming parts - FGG484 (commercial) and FGG484I (industrial, -40C to +85C) share a footprint but not the environmental rating, and the FG vs FGG prefix changes lead finish for compliance documentation.
With 270 user I/Os at up to hundreds of MHz edge rates, group fast-switching outputs away from clock-capable balls and use the fabric drive-strength and slew settings in Libero to limit simultaneous switching noise. Maintain a continuous ground reference plane under the BGA and series-terminate long single-ended traces (estimated 22-33 ohm typical starting point, verify per IBIS simulation).
Informations de conformité
Jotrin lists the package as GREEN FBGA-484; FGG suffix denotes lead-free ball finish per Microchip naming. REACH, halogen-free, and conflict-minerals status not stated in provided data.
