A3PE600-2PQG208 - ProASIC3E 600K Gate Flash FPGA | Microchip
Référence : A3PE600-2PQG208 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1 000 | $0 | $0,00 |
A3PE600-2PQG208 Présentation
A flash-based FPGA stores its configuration in on-chip flash memory rather than an external configuration PROM. Unlike SRAM FPGAs, this single-chip approach means the device is live at power-up, requires no external boot device, and is inherently more secure because the bitstream never leaves the package. Within the programmable logic hierarchy, the A3PE600 sits in the mid-density tier of the ProASIC3E family, which spans from low-density consumer devices up to 3M-gate avionics-grade parts, built on a 130 nm flash process with a 1.5 V core supply.
Key features include a low total cost of ownership thanks to single-chip operation, reprogrammable flash fabric, support for 1.425V to 1.575V core supply, industrial-relevant performance of up to 310 MHz, and 147 programmable I/Os supporting common single-ended standards. The -2 speed grade balances performance and cost within the family, while the commercial temperature range of 0C to +85C suits controlled-environment systems.
The ProASIC3E architecture combines VersTiles (logic modules), embedded flash, and distributed RAM to implement glue logic, bus bridging, state machines, and control-plane functions. Embedded 110,592 bits of RAM support FIFOs and small buffers in networking and communications designs. As a cost-effective ASIC replacement, the family is documented for consumer, networking/communications, computing, and avionics markets per the Microchip ProASIC3E datasheet.
Typical applications include industrial control and automation, communications bridging, battery-powered and power-sensitive computing platforms, and single-chip ASIC-replacement designs where instant-on operation and configuration security matter.
Design consideration: budget the 1.5V core rail (1.425V to 1.575V tolerance) carefully and follow Microchip power-supply decoupling guidance in the ProASIC3E handbook; the 208-pin PQFP requires careful signal-integrity practice for fast edge rates.
This page synthesizes distributor availability, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour A3PE600-2PQG208 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec A3PE600-2PQG208 (même facteur de forme et même empreinte) — différant par Package, Configuration Memory, Operating Temperature, Maximum System Frequency, Programmability.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
A3PE600-2PQG208I
✅ Remplacement direct✓ En stock
$45.2 / unité
Voir la fiche technique →A3PE600-1PQG208
✅ Remplacement direct✓ En stock
$32.1 / unité
Voir la fiche technique →A3PE600-1PQG208I
✅ Remplacement direct✓ En stock
$44.6 / unité
Voir la fiche technique →A3PE600-PQG208
✅ Remplacement direct✓ En stock
$24.64 / unité
Voir la fiche technique →A3PE600-2PQG208 Valeurs maximales et caractéristiques électriques
| Family | ProASIC3E |
| Logic Gates | 600000 gates |
| Total RAM Bits | 110592 bits |
| User I/O | 147 |
| System Performance | 310 MHz |
| Process Technology | 130 nm flash |
| Core Supply Voltage | 1.425 V to 1.575 V |
| Speed Grade | -2 |
| Boîtier | 208-BFQFP (PQFP, 28x28 mm) |
| Type de montage | Surface Mount |
| Température de fonctionnement | 0C to +85C |
| Configuration Memory | Internal flash (single-chip, live at power-up) |
| Programmability | Reprogrammable (In-System Programmable) |
| Typical Application Markets | Consumer, networking/communications, computing, avionics |
Guide de configuration des broches du A3PE600-2PQG208 208-bfqfp (pqfp, 28x28 mm)
Configuration des broches du A3PE600-2PQG208 (boîtier 208-bfqfp (pqfp, 28x28 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour A3PE600-2PQG208.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
A3PE600-2PQG208 convient pour 6 applications: Industrial Control and Automation, Networking and Communications Bridging, ASIC Replacement and Single-Chip Prototyping, Computing Platforms and Board-Level Glue Logic, Avionics and Secure Configuration Systems, Consumer and Cost-Sensitive Electronics.
Industrial Control and Automation
The A3PE600-2PQG208 suits industrial control and factory automation because it combines 600K gates of reprogrammable fabric with instant-on flash configuration, eliminating FPGA configuration time at power-up - critical for machines expected to respond immediately after energization. Its 147 user I/Os interface motor drives, sensors, and PLC backplanes, while the 310 MHz capability in the -2 speed grade handles deterministic state machines and bus bridging. Single-chip operation reduces BOM cost and board area versus SRAM FPGAs that need a separate boot flash. Place the device on a clean 1.5V core rail (1.425V to 1.575V) with local decoupling, and use the commercial 0C to +85C rating only inside controlled cabinets; choose the I-grade variant for open-enclosure installations.
Recommandé
Networking and Communications Bridging
In networking and communications equipment, the A3PE600-2PQG208 implements glue logic, protocol adaptation, bus width conversion, and line-card control functions. The 110,592 bits of embedded RAM support FIFO buffering between interfaces with different clock domains, and the 310 MHz system performance covers timing-critical bridging paths. Microchip positions the ProASIC3E family explicitly for networking/communications as a cost-effective ASIC replacement, allowing field reprogrammability as standards evolve. The 208-pin PQFP with 147 I/Os provides enough pin budget for parallel bus interfaces and status/control signals. Design the I/O banks to match the voltage standards of the connected PHYs or switch fabric, and reserve JTAG access for in-system firmware updates across the product lifecycle.
Recommandé
ASIC Replacement and Single-Chip Prototyping
The ProASIC3E family is designed by Microchip as a cost-effective ASIC replacement: the A3PE600-2PQG208 lets teams prototype and deploy 600K-gate designs in a single chip without mask charges or the external configuration PROM that SRAM FPGAs require. Because configuration lives in on-chip flash, the chip is live at power-up - matching ASIC behavior - and the design is protected since the bitstream never traverses the board. The 130 nm flash fabric supports reprogrammability for design iterations, while the -2 speed grade at up to 310 MHz covers moderate-performance control and datapath logic. Use it for low-to-mid-volume production where ASIC NRE is unjustified, and keep pin-compatible -1 grade parts in mind as supply-chain fallbacks with recompilation.
Recommandé
Computing Platforms and Board-Level Glue Logic
Server, storage, and embedded computing boards use the A3PE600-2PQG208 for power sequencing, reset distribution, BIOS flash multiplexing, hot-swap control, and legacy interface emulation. Instant-on operation matters here: the FPGA is functional before the CPU comes out of reset, so it can gate power rails and hold the processor in reset until supplies stabilize - something SRAM FPGAs cannot do while still loading their bitstream. The 147 I/Os support parallel status buses across the board, and the commercial 0C to +85C range fits climate-controlled datacenter environments. Estimated power for control-plane utilization is low, but follow Microchip decoupling guidance per supply pin group to protect signal integrity on the 208-pin PQFP.
Recommandé
Avionics and Secure Configuration Systems
Microchip targets the ProASIC3E family at avionics markets, and the A3PE600-2PQG208 fits line-replaceable-unit control logic where single-chip flash configuration avoids external boot devices - reducing component count and eliminating a common failure point. Internal flash also protects the configuration image from board-level readout, addressing design-security concerns in aerospace platforms. The 600K-gate density implements ARINC-style discrete interfaces, backplane control logic, and built-in-test sequencers, while 110,592 RAM bits buffer telemetry. Note that this specific commercial part is rated 0C to +85C; avionics programs requiring wider ranges or higher reliability screening should evaluate the -I variant and Microchip's military/aerospace screening options through authorized channels.
Recommandé
Consumer and Cost-Sensitive Electronics
For consumer platforms needing moderate programmable logic, the A3PE600-2PQG208 delivers a low total cost of ownership: single-chip configuration removes the boot-PROM line item, and flash reprogrammability supports late-stage feature changes without a respin. Microchip's own positioning lists consumer among the family's target markets. The 600K gates implement display timing, peripheral arbitration, and custom interface logic, while the 310 MHz -2 grade comfortably covers consumer clock domains. In high-volume consumer builds, verify long-term supply commitments with the distributor, since mature 130 nm families face eventual lifecycle transitions, and consider the ProASIC3 (non-E) A3P600 parts in the same 208-pin PQFP when embedded RAM is unnecessary.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour A3PE600-2PQG208 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | A3PE600-2PQG208I | A3PE600-1PQG208 | A3PE600-1PQG208I | A3PE600-PQG208 |
|---|---|---|---|---|---|
| Package | 208-BFQFP (PQFP, 28x28 mm) | 208-BFQFP (PQFP, 28x28 mm) - same | 208-BFQFP (PQFP, 28x28 mm) - same | 208-BFQFP (PQFP, 28x28 mm) - same | 208-BFQFP (PQFP, 28x28 mm) - same |
| Brand | Microchip Technology (Microsemi) | Microchip Technology (Microsemi) | Microchip Technology (Microsemi) | Microchip Technology (Microsemi) | Microchip Technology (Microsemi) |
| Logic Gates | 600000 | 600000 | 600000 | 600000 | 600000 |
| Total RAM Bits | 110592 | 110592 | 110592 | 110592 | 110592 |
| User I/O | 147 | 147 | 147 | 147 | 147 |
| Core Supply Voltage | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V |
| Speed Grade | -2 | -2 | -1 | -1 | standard |
| Operating Temperature | 0C to +85C | -40C to +100C | 0C to +85C | -40C to +100C | 0C to +85C |
| Configuration Memory | Internal flash, live at power-up | Internal flash | Internal flash | Internal flash | Internal flash |
Principaux différenciateurs
- Instant-on single-chip flash configuration (vs SRAM FPGAs requiring external boot flash)
- Industrial temperature drop-in availability (vs A3PE600-2PQG208I)
- Embedded RAM on the E-variant fabric (vs A3P600-2PQG208 (non-E ProASIC3))
Notes de conception
Supply the core with a regulated 1.5V rail held within 1.425V to 1.575V per the ProASIC3E datasheet. Estimate core current with the Microchip power calculator in Libero SoC, since it depends on logic utilization and toggle rates rather than a fixed figure. Decouple every VCC and GND pin pair of the 208-pin PQFP with local ceramics, and add bulk capacitance near the package. I/O bank supplies must match the standards assigned in Libero; mixing standards across a bank is a common power-budget error.
The 208-pin PQFP has relatively long lead-frame inductances compared with BGAs, so fast-switching output groups can ring when driving heavy loads. Limit the number of simultaneously switching outputs per ground return, use the slowest slew rate setting in Libero SoC that meets timing, and series-terminate long point-to-point lines. Keep the PQFP land pattern per the datasheet mechanical drawing and avoid routing high-edge-rate clocks on the outermost package leads.
Do not substitute a -1 speed grade for the -2 in production without re-running timing closure in Libero SoC - pinout, package, and configuration are identical, but critical paths that met timing on the -2 can fail on the -1. Also confirm the commercial 0C to +85C rating against your environment: field-deployed equipment outside climate control should use the -I industrial variant. Finally, program via JTAG with a FlashPro tool and keep JTAG access on the PCB for field updates.
Informations de conformité
Compliance data not present in the provided web sources; verify RoHS/REACH status on the official Microchip product page or distributor environmental datasheet before procurement.