A54SX32A-2BGG329 - 48K Gate FPGA, 313MHz | Microchip Technology
Référence : A54SX32A-2BGG329 ✓ Actif| Qté | Prix unitaire | Total |
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| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1 000 | $0 | $0,00 |
A54SX32A-2BGG329 Présentation
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a sea of programmable logic blocks and interconnects that designers configure after manufacturing. The SX-A family belongs to the antifuse FPGA category: unlike SRAM-based FPGAs, its interconnect elements are permanently programmed at the factory or in the lab, so the configuration is retained at power-up without any external boot PROM, improving security and reducing BOM count in the power-management hierarchy of a system design.
Key features of the A54SX32A-2BGG329 include 48K system gates (32K raw gates, 2,880 logic cells) for integrating glue logic, bus interfaces, and state machines into a single chip; 249 user I/Os in the 329-ball BGA, supporting high-pin-count board layouts; and the -2 speed grade supporting 313 MHz internal performance. The antifuse architecture contributes inherently low power, high immunity to configuration readback, and essentially non-volatile, single-chip integration, which Microchip positions as lowering the performance premium versus competing architectures.
Technically, the device uses a sea-of-modules architecture with repeated logic modules (C-cells and R-cells) and a routing fabric programmed by antifuse elements. Because the bitstream is physically burned in, there is no configuration time at power-up and no external configuration device to attack or corrupt, a property valued in defense, avionics, and industrial control where design protection matters.
Typical applications include industrial automation and control, communications and networking line cards, test and measurement instrumentation, aerospace and defense subsystems, and bridging/glue logic for processors and ASICs. The large I/O count and deterministic power-up suit designs requiring many interface signals to be live immediately at reset.
A key design consideration: antifuse FPGAs are one-time programmable. Unlike SRAM FPGAs, you cannot reconfigure the same device; design iteration requires new parts, so verification in simulation and timing closure with the Libero/Designer flow should be complete before programming production units.
This page synthesizes distributor pricing availability, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing information gain over standard catalog listings.
Alternatives de remplacement direct pour A54SX32A-2BGG329 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec A54SX32A-2BGG329 (même facteur de forme et même empreinte) — différant par Package, System Gates, Process Technology, Family, Speed Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
A54SX32A-2BGG329I
✅ Remplacement direct✓ En stock
$95 / unité
Voir la fiche technique →A54SX32A-1BGG329
✅ Remplacement direct✓ En stock
$47.6 / unité
Voir la fiche technique →A54SX32A-1BGG329M
✅ Remplacement direct✓ En stock
$82 / unité
Voir la fiche technique →A54SX32A-BGG329M
✅ Remplacement direct✓ En stock
$97.6 / unité
Voir la fiche technique →A54SX32A-BGG329M
✅ Remplacement direct✓ En stock
$97.6 / unité
Voir la fiche technique →A54SX32A-FBGG329
✅ Remplacement direct✓ En stock
$89.9 / unité
Voir la fiche technique →A54SX32-BGG329
✅ Remplacement direct✓ En stock
$515.58 / unité
Voir la fiche technique →A54SX32A-2BGG329 Valeurs maximales et caractéristiques électriques
| Logic Cells | 2880 |
| System Gates | 48000 |
| Raw Gates | 32000 |
| User I/O | 249 |
| Fréquence d'horloge maximale | 313 MHz |
| Speed Grade | -2 |
| Core Supply Voltage | 2.5 V |
| Process Technology | 0.25 um CMOS |
| Programmable Type | Antifuse (OTP) |
| Family | SX-A |
| Boîtier | 329-BBGA (BGG329) |
| Type de montage | Surface Mount |
| Configuration Retention | Non-volatile (antifuse, retained at power-up) |
Guide de configuration des broches du A54SX32A-2BGG329 329-bbga (bgg329)
Configuration des broches du A54SX32A-2BGG329 (boîtier 329-bbga (bgg329)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour A54SX32A-2BGG329.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
A54SX32A-2BGG329 convient pour 6 applications: Industrial Automation and Control, Communications and Networking, Aerospace and Defense Subsystems, Test and Measurement Instrumentation, Processor and ASIC Glue Logic / System Bridging, Legacy Design Sustainment and Obsolescence Mitigation.
Industrial Automation and Control
The A54SX32A-2BGG329 fits industrial control systems that need deterministic, immediately-live logic at power-up. Its antifuse architecture requires no external configuration device, so 249 user I/Os begin driving sensors, actuators, and fieldbus interfaces the instant 2.5V core power is applied - a benefit for safety interlocks and machine-state sequencing. With 48K system gates and 313 MHz toggle capability, the device integrates PLC glue logic, encoder counters, and communication bridging into one chip, cutting BOM cost and board area. Its non-volatile burned-in configuration also resists corruption from industrial power disturbances that could scramble SRAM-based FPGA bitstreams, improving uptime in factory-floor environments.
Recommandé
Communications and Networking
In networking line cards and telecom backplanes, the A54SX32A-2BGG329 provides high-speed glue logic between PHYs, MACs, and processors. The 313 MHz toggle rate of the -2 speed grade supports clock-domain crossing and datapath functions at line-card speeds, while 249 user I/Os in the 329-ball BGA accommodate wide parallel buses and multiple port interfaces on one footprint. The low-power 0.25 um CMOS 2.5V core helps keep line-card power budgets in check across many channels. Because the antifuse configuration is physically burned in, service providers gain tamper resistance against bitstream readback - a security property that SRAM FPGAs cannot match without additional encryption silicon.
Recommandé
Aerospace and Defense Subsystems
Defense electronics designers value the A54SX32A-2BGG329 for its inherent design security: antifuse interconnect cannot be read back, so proprietary algorithms and crypto control logic remain physically protected without external load-management hardware. Single-chip, non-volatile power-up suits telemetry, guidance interface, and payload control boards where a missing or corrupted configuration is unacceptable. The M temperature variants (A54SX32A-BGG329M, A54SX32A-1BGG329M) extend the same die and 329-ball footprint to extended-temperature platforms. Note that for radiation environments, Microchip's dedicated RT/hi-rel space variants - not this commercial part - should be selected; this device serves ground-based and benign-environment defense applications.
Recommandé
Test and Measurement Instrumentation
Bench and automated test equipment use the A54SX32A-2BGG329 as deterministic timing, trigger, and interface logic. The 313 MHz toggle capability enables precise counter/timer and pattern-generator functions, while 2,880 logic cells provide register banks and state machines for scan controllers and bus masters. Antifuse configuration guarantees identical behavior on every power cycle - important for repeatability specifications in instrumentation - and eliminates configuration boot latency so measurements are valid immediately at turn-on. With 249 user I/Os, one device can address multiple instrument cards from a common motherboard footprint, and the 2.5V core keeps self-heating low for thermally sensitive analog front-end sections.
Recommandé
Processor and ASIC Glue Logic / System Bridging
A classic SX-A use case is integrating the dozens of discrete PAL/GAL/PLD devices that surround a microprocessor into one low-cost chip. The A54SX32A-2BGG329's 48K system gates absorb address decoding, bus arbitration, wait-state generation, interrupt control, and peripheral chip-select logic, while 249 user I/Os connect directly to processor data, address, and control buses on the same board. Single-chip non-volatile operation means the glue logic is live before the processor's first fetch - critical for reset timing. Microchip positions SX-A specifically for such integration-driven system savings, and the 329-ball BGA leaves routing headroom for wide 32/64-bit buses.
Recommandé
Legacy Design Sustainment and Obsolescence Mitigation
Boards originally built with Actel SX-family devices (A54SX32-BG329/BGG329) can be sustained with the A54SX32A-2BGG329, which shares the same 329-ball BGA footprint. The SX-A part offers higher density (48K vs 32K gates) and speed (313 MHz vs 240 MHz), so an original design recompiled for SX-A meets timing with margin - and FindIC classifies the two as package- and terminal-compatible replacements. This makes the device a practical drop-in for life-of-program extensions in avionics, industrial, and telecom platforms that must remain in service for decades, avoiding expensive PCB respins while consolidating on the still-active SX-A product line.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour A54SX32A-2BGG329 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | A54SX32A-2BGG329I | A54SX32A-1BGG329 | A54SX32A-BGG329 | A54SX32-BGG329 |
|---|---|---|---|---|---|
| Package | 329-BBGA (BGG329) | 329-BBGA - same | 329-BBGA - same | 329-BBGA - same | 329-BBGA - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 48000 | 48000 | 48000 | 48000 | 32000 |
| Logic Cells | 2880 | 2880 | 2880 | 2880 | 1800 |
| User I/O | 249 | 249 | 249 | 249 | 249 |
| Temperature Range | Commercial | Industrial (I) | Commercial | Commercial | Commercial |
| Core Supply Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 3.3 V / 5 V |
| Process Technology | 0.25 um CMOS | 0.25 um CMOS | 0.25 um CMOS | 0.25 um CMOS | 0.35 um |
Principaux différenciateurs
- Highest speed grade in the same 329-ball footprint (vs A54SX32A-1BGG329)
- Industrial temperature option on identical die (vs A54SX32A-2BGG329I)
- Higher density and speed than the legacy SX predecessor (vs A54SX32-BGG329)
- Antifuse non-volatile security vs SRAM FPGAs (vs Cross-brand SRAM FPGAs (AMD/Xilinx, Intel/Altera))
Notes de conception
Antifuse FPGAs are one-time programmable: once the A54SX32A-2BGG329 is burned, the configuration is permanent and any design change requires a new device. Complete full functional simulation, timing closure at the -2 corner, and board-level verification in Microchip's Designer software before committing production parts. Order engineering spares (typically 10-15% extra) to cover programming yield and any late ECOs, since a re-spin costs both parts and programming time.
The device operates from a single 2.5V core supply; provide clean, decoupled power with bulk and 0.1 uF ceramic capacitors at each VDD ball group as specified in the SX-A datasheet power section. Do not confuse this 2.5V SX-A part with legacy SX-family parts that use 3.3V/5V I/O - check I/O bank voltage compatibility with surrounding devices (5V/3.3V logic) before layout. Note the estimated supply current depends on toggle rate and routing; use Microchip's Designer power estimator rather than assuming worst-case numbers.
The 329-ball BGA requires careful fanout: follow the SX-A datasheet land-pattern recommendation and verify via-in-pad or dogbone escape strategy against your fab's minimum via and trace capability. Plan the ball map so 249 user I/O groups align with I/O bank voltage domains, and reserve balls around the package perimeter for escape routing. For first-article builds, X-ray inspect the BGA after reflow to confirm solder joint quality before programming the antifuses.
Pin assignment flexibility matters more than in SRAM FPGAs because the device cannot be reprogrammed to accommodate a marginal layout. Perform place-and-route early with your intended ball map in Microchip Designer, lock the assignment, and re-run timing before releasing the PCB. If critical paths fail timing at -2 conditions, consider the same-footprint -1 grade only after confirming it is not the cause; otherwise restructure the design, since you cannot upgrade to a faster speed grade in the same socket beyond the SX-A -2 ceiling.
Informations de conformité
Compliance data not present in the provided web data. The FBGG329 package variant naming convention typically indicates a lead-free/finer-pitch package option; verify RoHS/REACH status on the Microchip product page before export-controlled or EU-market builds.
