A54SX32-BGG329 - 32K Gate SX FPGA, 240MHz, 329-BGA | Microchip
MPN: A54SX32-BGG329 β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $600.58 | $600.58 |
| 10 | $580 | $5,800.00 |
| 100 | $555 | $55,500.00 |
| 500 | $535 | $267,500.00 |
| 1,000 | $515.58 | $515,580.00 |
Drop-in alternatives for A54SX32-BGG329 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
A54SX32-1BGG329
β Drop-Inβ In Stock
$544.99 / Unit
View Datasheet βA54SX32-BGG329I
β Drop-Inπ Reference alternative (not in catalog)
A54SX32-BG329I
β Drop-Inπ Reference alternative (not in catalog)
A54SX32-2BGG329I
β Drop-Inβ In Stock
$88.9 / Unit
View Datasheet βA54SX32A-BGG329
β Drop-Inπ Reference alternative (not in catalog)
A54SX32A-BG329I
β Drop-Inπ Reference alternative (not in catalog)
A54SX32A-1BGG329M
β Drop-Inπ Reference alternative (not in catalog)
A54SX32-BGG329 Maximum Ratings & Electrical Characteristics
| System Gates | 32000 gates |
| Logic Cells | 2880 |
| User I/O | 249 |
| Maximum Internal Frequency | 240 MHz |
| Clock-to-Out (Pin-to-Pin) | 3.7 ns |
| Input Setup Time | 0.1 ns |
| Clock Skew | 0.25 ns |
| Process Technology | 0.35 um CMOS |
| Supply Voltage | 3.3 V / 5 V |
| Programming Technology | Antifuse (one-time programmable) |
| Architecture | Sea-of-modules (Actel SX family) |
| Package | 329-BBGA (31 x 31 mm) |
| Package Ball Pitch | 1.27 mm |
| Logic Family | CMOS |
| Mounting Type | Surface Mount |
| RoHS Status | ROHS COMPLIANT |
| PCI Integration | 66 MHz PCI single-chip solution |
| ECCN | 3A991.d.2 |
A54SX32-BGG329 1.27 mm Pin Configuration Guide
Complete pinout information for A54SX32-BGG329 (1.27 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A54SX32-BGG329.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A54SX32-BGG329 is suitable for 6 applications: 66 MHz PCI Interface Bridging, Industrial Control and Automation, Avionics and Defense Subsystems, Communications and Networking Line Cards, Design-Secure Embedded Systems, Legacy System Life Extension (Obsolescence Management).
66 MHz PCI Interface Bridging
The A54SX32-BGG329 was explicitly characterized by Actel/Microsemi as a single-chip 66 MHz PCI solution, integrating bridge and glue logic that would otherwise require a CPLD plus an FPGA. Its 3.7 ns pin-to-pin clock-to-out and 0.25 ns clock skew meet PCI timing budgets at 66 MHz when combined with the -1 or -2 speed grades. In a typical design, the device sits between a host bus and peripheral logic, with 249 user I/O providing ample width for address/data multiplexing. Because it is antifuse-based, the PCI configuration is fixed at power-up with zero configuration latency - important for PCI enumeration windows.
Recommended
Industrial Control and Automation
In industrial controllers, the A54SX32-BGG329 consolidates sequencer, interlock, and interface logic into one 32K-gate device, replacing multiple CPLDs and discrete glue. The 3.3V/5V I/O support lets it talk directly to legacy 5V TTL PLC signaling and 3.3V microprocessors on the same board, a common requirement in retrofit automation equipment. Deterministic antifuse routing gives fixed propagation delays, which simplifies safety-interlock timing analysis. With 2880 logic cells and 249 I/O, a typical implementation carries a motor-control state machine, encoder interfaces, and fieldbus glue with margin. Designers should budget for the one-time-programmable workflow by freezing logic before production programming.
Recommended
Avionics and Defense Subsystems
Antifuse FPGAs like the A54SX32-BGG329 were widely deployed in avionics, military radio, and mission-critical subsystems because the programmed interconnect cannot be read back or disturbed by configuration upsets the way SRAM fabrics can. The M-suffix and industrial-grade siblings (A54SX32A-1BGG329M) extend temperature ranges for harsh environments. In these systems the 32K gates typically implement bus interfaces (MIL-STD-1553 glue, ARINC formatting), and the 240 MHz internal performance covers signal-formatting pipelines. The non-volatile, instant-on behavior also matters for systems with strict power-up sequencing requirements, eliminating configuration-watchdog circuitry entirely.
Recommended
Communications and Networking Line Cards
Telecom line cards used the SX family's sea-of-modules fabric to implement framing, formatting, and backplane interface logic with deterministic timing. The 0.25 ns clock skew supports synchronous high-speed data paths across the 249 I/O, and the low parasitic capacitance of antifuse routing reduces per-node switching power compared with SRAM FPGAs of the era - beneficial in dense card cages. The A54SX32-BGG329 typically implements T1/E1 or backplane glue functions alongside PHY devices. Because the fabric is fine-grained (C-cell/R-cell), register-heavy framing logic achieves high utilization, often fitting designs that would need larger SRAM devices.
Recommended
Design-Secure Embedded Systems
Where bitstream theft is a concern, the A54SX32-BGG329 offers inherent security: there is no external configuration image to intercept, and the programmed antifuse pattern is practically unobservable. This made SX devices a default choice for products with proprietary algorithms - encryption front-ends, license-control logic, and anti-cloning partitions in industrial and consumer hardware. The 2880 logic cells accommodate a compact AES-class datapath or custom cipher of the period, and the 240 MHz fabric supports pipelined implementations. Boards can ship with zero configuration memory BOM cost, and power-up is immediate with no load cycle that could be glitched by an attacker.
Recommended
Legacy System Life Extension (Obsolescence Management)
Many fielded systems still depend on the A54SX32-BGG329 years after its estimated 2021 EOL date. Sustaining engineers can extend life by qualifying same-footprint alternatives - A54SX32-1BGG329 and A54SX32-BGG329I share the exact 329-ball BGA ballout, so existing PCBs accept them without rework and only the programming file changes. Strategic last-time buys from remaining stock (for example, 3,520 pieces reported at Heisener as of 2026-09-03) combined with a documented migration path to Microchip ProASIC3 devices provides a two-track strategy: bridge with authentic old stock while a recompiled ProASIC3 design is qualified for the next production phase.
Recommended
Recommended Products Summary
Engineering reference data for A54SX32-BGG329 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A54SX32-1BGG329 | A54SX32-BGG329I | A54SX32-2BGG329I | A54SX32A-BGG329 |
|---|---|---|---|---|---|
| Package | 329-BBGA | 329-BBGA - same | 329-BBGA - same | 329-BBGA - same | 329-BBGA - same |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 32000 | 32000 | 32000 | 32000 | 32000 |
| Logic Cells | 2880 | 2880 | 2880 | 2880 | 1800 cells (FindIC) |
| Maximum Internal Frequency | 240 MHz | 280 MHz | 240 MHz | 320 MHz | up to 320 MHz |
| Supply Voltage | 3.3 V / 5 V | 3.3 V / 5 V | 3.3 V / 5 V | 3.3 V / 5 V | 2.5 V core |
| Process Technology | 0.35 um | 0.35 um | 0.35 um | 0.35 um | 0.25 um |
| Temperature Grade | Commercial | Commercial | Industrial | Industrial | Commercial |
| Unit Price (qty 1) | $600.58 (LCSC, as of 2026-09-03) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Lifecycle Status | EOL (est. 2021, limited supply) | EOL (legacy stock) | EOL (legacy stock) | EOL (legacy stock) | EOL (legacy stock) |
Key Differentiators
- Fastest same-package speed grade available as drop-in (vs A54SX32-2BGG329I)
- Extended temperature availability within the same footprint (vs A54SX32-BGG329I)
- 5V-tolerant 3.3V/5V I/O vs SX-A core voltage (vs A54SX32A-BGG329)
- Zero configuration latency vs SRAM/flash FPGAs (vs A3PE600-2FGG484)
Design Notes
The A54SX32-BGG329 requires 3.3V and 5V rails per Microchip datasheet data. Estimated: antifuse FPGA static power is dominated by I/O loading, so estimate rail current by summing (toggle rate x load capacitance x V^2 x f) per output bank plus the device quiescent figure from the 54SX family power calculator. Because there is no configuration surge, inrush is limited to ordinary decoupling recharge; still, provide at least 10 uF bulk plus 0.1 uF per power ball as a starting point and verify against the Microchip power estimation tool for your design.
This is a one-time-programmable antifuse device: you cannot reflash in-circuit. Program speed grade and design in Libero IDE/Designer before committing production devices, and always hold spare programmed units - a logic bug after programming means scrapping the package. Also note the lifecycle risk: estimated EOL 2021 with limited supply and a reported high counterfeit threat level (~69 pct) in the open market per datasheet-directory data, so buy only from franchised distributors and require date-code and provenance verification for broker stock.
The 329-BBGA uses a 1.27 mm ball pitch on a 31 x 31 mm body. For reliable assembly, design fanout with via-in-pad or dogbone escape on the inner ball rows, and follow the manufacturer package drawing for keep-out and stencil guidance. Connect all VCC/GND balls as drawn in the datasheet ballout - antifuse devices rely on every listed supply ball, and omitting decoupling on a shared ball grid invites ground-bounce-induced timing errors. The commercial-grade A54SX32-BGG329 should not be substituted into industrial-temperature sockets without derating analysis.
The SX family achieves 0.25 ns clock skew across the fabric, but board-level clock distribution still dominates pin-to-pin timing. Estimated: at 66 MHz PCI operation, the 3.7 ns clock-to-out budget leaves roughly 3.8 ns for board flight time in a 15 ns cycle; keep clock traces length-matched and short, and series-terminate 5V-tolerant outputs driving heavy buses. Simulate I/O banking with the datasheet output buffer models before final routing, since the 249 I/O are banked and mixed-standard assignment affects timing.
Compliance Information
Distributor data (digchip) lists the part as ROHS COMPLIANT. REACH, lead-free, halogen-free, and conflict-minerals statuses were not stated in the provided data and are marked unknown.
