A54SX32A-2BGG329 - 48K Gate FPGA, 313MHz | Microchip Technology
MPN: A54SX32A-2BGG329 ✓ Active| Qty | Unit Price | Extended |
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Drop-in alternatives for A54SX32A-2BGG329 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
A54SX32A-2BGG329I
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View Datasheet →A54SX32A-1BGG329
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View Datasheet →A54SX32A-1BGG329M
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View Datasheet →A54SX32A-BGG329M
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View Datasheet →A54SX32A-BGG329M
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View Datasheet →A54SX32A-FBGG329
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View Datasheet →A54SX32-BGG329
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View Datasheet →A54SX32A-2BGG329 Maximum Ratings & Electrical Characteristics
| Logic Cells | 2880 |
| System Gates | 48000 |
| Raw Gates | 32000 |
| User I/O | 249 |
| Maximum Clock Frequency | 313 MHz |
| Speed Grade | -2 |
| Core Supply Voltage | 2.5 V |
| Process Technology | 0.25 um CMOS |
| Programmable Type | Antifuse (OTP) |
| Family | SX-A |
| Package | 329-BBGA (BGG329) |
| Mounting Type | Surface Mount |
| Configuration Retention | Non-volatile (antifuse, retained at power-up) |
A54SX32A-2BGG329 329-bbga (bgg329) Pin Configuration Guide
Complete pinout information for A54SX32A-2BGG329 (329-bbga (bgg329) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A54SX32A-2BGG329.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A54SX32A-2BGG329 is suitable for 6 applications: Industrial Automation and Control, Communications and Networking, Aerospace and Defense Subsystems, Test and Measurement Instrumentation, Processor and ASIC Glue Logic / System Bridging, Legacy Design Sustainment and Obsolescence Mitigation.
Industrial Automation and Control
The A54SX32A-2BGG329 fits industrial control systems that need deterministic, immediately-live logic at power-up. Its antifuse architecture requires no external configuration device, so 249 user I/Os begin driving sensors, actuators, and fieldbus interfaces the instant 2.5V core power is applied - a benefit for safety interlocks and machine-state sequencing. With 48K system gates and 313 MHz toggle capability, the device integrates PLC glue logic, encoder counters, and communication bridging into one chip, cutting BOM cost and board area. Its non-volatile burned-in configuration also resists corruption from industrial power disturbances that could scramble SRAM-based FPGA bitstreams, improving uptime in factory-floor environments.
Recommended
Communications and Networking
In networking line cards and telecom backplanes, the A54SX32A-2BGG329 provides high-speed glue logic between PHYs, MACs, and processors. The 313 MHz toggle rate of the -2 speed grade supports clock-domain crossing and datapath functions at line-card speeds, while 249 user I/Os in the 329-ball BGA accommodate wide parallel buses and multiple port interfaces on one footprint. The low-power 0.25 um CMOS 2.5V core helps keep line-card power budgets in check across many channels. Because the antifuse configuration is physically burned in, service providers gain tamper resistance against bitstream readback - a security property that SRAM FPGAs cannot match without additional encryption silicon.
Recommended
Aerospace and Defense Subsystems
Defense electronics designers value the A54SX32A-2BGG329 for its inherent design security: antifuse interconnect cannot be read back, so proprietary algorithms and crypto control logic remain physically protected without external load-management hardware. Single-chip, non-volatile power-up suits telemetry, guidance interface, and payload control boards where a missing or corrupted configuration is unacceptable. The M temperature variants (A54SX32A-BGG329M, A54SX32A-1BGG329M) extend the same die and 329-ball footprint to extended-temperature platforms. Note that for radiation environments, Microchip's dedicated RT/hi-rel space variants - not this commercial part - should be selected; this device serves ground-based and benign-environment defense applications.
Recommended
Test and Measurement Instrumentation
Bench and automated test equipment use the A54SX32A-2BGG329 as deterministic timing, trigger, and interface logic. The 313 MHz toggle capability enables precise counter/timer and pattern-generator functions, while 2,880 logic cells provide register banks and state machines for scan controllers and bus masters. Antifuse configuration guarantees identical behavior on every power cycle - important for repeatability specifications in instrumentation - and eliminates configuration boot latency so measurements are valid immediately at turn-on. With 249 user I/Os, one device can address multiple instrument cards from a common motherboard footprint, and the 2.5V core keeps self-heating low for thermally sensitive analog front-end sections.
Recommended
Processor and ASIC Glue Logic / System Bridging
A classic SX-A use case is integrating the dozens of discrete PAL/GAL/PLD devices that surround a microprocessor into one low-cost chip. The A54SX32A-2BGG329's 48K system gates absorb address decoding, bus arbitration, wait-state generation, interrupt control, and peripheral chip-select logic, while 249 user I/Os connect directly to processor data, address, and control buses on the same board. Single-chip non-volatile operation means the glue logic is live before the processor's first fetch - critical for reset timing. Microchip positions SX-A specifically for such integration-driven system savings, and the 329-ball BGA leaves routing headroom for wide 32/64-bit buses.
Recommended
Legacy Design Sustainment and Obsolescence Mitigation
Boards originally built with Actel SX-family devices (A54SX32-BG329/BGG329) can be sustained with the A54SX32A-2BGG329, which shares the same 329-ball BGA footprint. The SX-A part offers higher density (48K vs 32K gates) and speed (313 MHz vs 240 MHz), so an original design recompiled for SX-A meets timing with margin - and FindIC classifies the two as package- and terminal-compatible replacements. This makes the device a practical drop-in for life-of-program extensions in avionics, industrial, and telecom platforms that must remain in service for decades, avoiding expensive PCB respins while consolidating on the still-active SX-A product line.
Recommended
Recommended Products Summary
Engineering reference data for A54SX32A-2BGG329 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A54SX32A-2BGG329I | A54SX32A-1BGG329 | A54SX32A-BGG329 | A54SX32-BGG329 |
|---|---|---|---|---|---|
| Package | 329-BBGA (BGG329) | 329-BBGA - same | 329-BBGA - same | 329-BBGA - same | 329-BBGA - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 48000 | 48000 | 48000 | 48000 | 32000 |
| Max Clock Frequency | 313 MHz | 313 MHz | [DATA_NEEDED] (-1 speed grade, lower) | [DATA_NEEDED] (standard grade) | 240 MHz |
| Logic Cells | 2880 | 2880 | 2880 | 2880 | 1800 |
| User I/O | 249 | 249 | 249 | 249 | 249 |
| Temperature Range | Commercial | Industrial (I) | Commercial | Commercial | Commercial |
| Core Supply Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 3.3 V / 5 V |
| Process Technology | 0.25 um CMOS | 0.25 um CMOS | 0.25 um CMOS | 0.25 um CMOS | 0.35 um |
| Price (qty 1, as of 2026-09-03) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Highest speed grade in the same 329-ball footprint (vs A54SX32A-1BGG329)
- Industrial temperature option on identical die (vs A54SX32A-2BGG329I)
- Higher density and speed than the legacy SX predecessor (vs A54SX32-BGG329)
- Antifuse non-volatile security vs SRAM FPGAs (vs Cross-brand SRAM FPGAs (AMD/Xilinx, Intel/Altera))
Design Notes
Antifuse FPGAs are one-time programmable: once the A54SX32A-2BGG329 is burned, the configuration is permanent and any design change requires a new device. Complete full functional simulation, timing closure at the -2 corner, and board-level verification in Microchip's Designer software before committing production parts. Order engineering spares (typically 10-15% extra) to cover programming yield and any late ECOs, since a re-spin costs both parts and programming time.
The device operates from a single 2.5V core supply; provide clean, decoupled power with bulk and 0.1 uF ceramic capacitors at each VDD ball group as specified in the SX-A datasheet power section. Do not confuse this 2.5V SX-A part with legacy SX-family parts that use 3.3V/5V I/O - check I/O bank voltage compatibility with surrounding devices (5V/3.3V logic) before layout. Note the estimated supply current depends on toggle rate and routing; use Microchip's Designer power estimator rather than assuming worst-case numbers.
The 329-ball BGA requires careful fanout: follow the SX-A datasheet land-pattern recommendation and verify via-in-pad or dogbone escape strategy against your fab's minimum via and trace capability. Plan the ball map so 249 user I/O groups align with I/O bank voltage domains, and reserve balls around the package perimeter for escape routing. For first-article builds, X-ray inspect the BGA after reflow to confirm solder joint quality before programming the antifuses.
Pin assignment flexibility matters more than in SRAM FPGAs because the device cannot be reprogrammed to accommodate a marginal layout. Perform place-and-route early with your intended ball map in Microchip Designer, lock the assignment, and re-run timing before releasing the PCB. If critical paths fail timing at -2 conditions, consider the same-footprint -1 grade only after confirming it is not the cause; otherwise restructure the design, since you cannot upgrade to a faster speed grade in the same socket beyond the SX-A -2 ceiling.
Compliance Information
Compliance data not present in the provided web data. The FBGG329 package variant naming convention typically indicates a lead-free/finer-pitch package option; verify RoHS/REACH status on the Microchip product page before export-controlled or EU-market builds.
